Fluid ejector device
    1.
    发明授权
    Fluid ejector device 有权
    流体喷射装置

    公开(公告)号:US08042908B2

    公开(公告)日:2011-10-25

    申请号:US11829354

    申请日:2007-07-27

    CPC classification number: B41J2/1606 C09D163/00 Y10T29/49401

    Abstract: A fluid ejector device, including: a fluid nozzle layer defining an orifice therein; and at least one epoxy resin layer established on the nozzle layer, the at least one epoxy resin layer having first and second opposed surfaces with a thickness there between and a fluorine gradient formed therein such that the gradient extends into at least a portion of the thickness of the at least one epoxy resin layer, wherein an amount of a fluorinated species present in the at least one epoxy resin layer at the first opposed surface is greater than an amount of the fluorinated species present in the at least one epoxy resin layer at the second opposed surface that is adjacent the fluid nozzle layer.

    Abstract translation: 一种流体喷射器装置,包括:在其中限定孔口的流体喷嘴层; 以及至少一个环氧树脂层,其建立在所述喷嘴层上,所述至少一个环氧树脂层具有形成在其中的厚度的第一和第二相对表面和形成在其中的氟梯度,使得所述梯度延伸到所述厚度的至少一部分 的至少一个环氧树脂层,其中存在于所述第一相对表面的所述至少一个环氧树脂层中的氟化物质的量大于所述至少一个环氧树脂层中存在的氟化物质的量 与流体喷嘴层相邻的第二相对表面。

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