System and method for performing low contamination extrusion for microelectronics applications
    4.
    发明授权
    System and method for performing low contamination extrusion for microelectronics applications 失效
    用于微电子应用的低污染挤出的系统和方法

    公开(公告)号:US06319316B1

    公开(公告)日:2001-11-20

    申请号:US09251646

    申请日:1999-02-17

    IPC分类号: B05C500

    摘要: This invention relates to a system and method for performing accurate coating operations while minimizing contamination of the coating fluid arising from contact between the fluid and the extrusion head. In one embodiment, the extrusion head is composed entirely of non-metallic material, possibly ceramic, thereby minimizing any material removal by the fluid, and any ionic or chemical reaction between the extrusion head material and the fluid. In another embodiment, a shim separating metal parts of an extrusion head is composed of a non-metallic substance to prevent galvanic potential induced corrosion between the shim and the extrusion head material and the resulting release of the products of such corrosion into the coating fluid.

    摘要翻译: 本发明涉及一种用于执行精确涂覆操作同时最小化由流体和挤压头之间的接触引起的涂覆液体的污染的系统和方法。 在一个实施例中,挤出头部完全由非金属材料构成,可能是陶瓷,从而最小化流体的任何材料去除以及挤压头材料和流体之间的任何离子或化学反应。 在另一个实施例中,分离挤出头的金属部件的垫片由非金属物质组成,以防止垫片和挤出头材料之间的电偶电位引起的腐蚀,并导致这种腐蚀产物的释放到涂覆液中。