Low application temperature hot melt adhesive
    3.
    发明申请
    Low application temperature hot melt adhesive 有权
    低应用温度热熔胶

    公开(公告)号:US20070173153A1

    公开(公告)日:2007-07-26

    申请号:US11716954

    申请日:2007-03-12

    CPC classification number: C09J153/02 C09J153/025 Y10T442/2738 Y10T442/2746

    Abstract: A low application temperature rubber-based hot melt adhesive having properties particularly well suited for use in the construction of disposable articles has been invented. The adhesive comprises a styrene block copolymer and a type of wax in an amount effective to produce a viscosity at 120° C. of below about 10,000 centipoises, a cube flow at 130° F. (54° C.) of less than about 300%, a DSC crystallization temperature of less than about 75° C. and a storage modulus of less than about 1.0×107 dynes/cm2 at 10 rads/sec (25° C.).

    Abstract translation: 已经发明了一种具有特别适用于一次性制品结构的性能的低使用温度的橡胶基热熔粘合剂。 粘合剂包括苯乙烯嵌段共聚物和一种蜡,其量有效地在120℃下产生低于约10,000厘泊的粘度,在130°F(54℃)下的立方体流小于约300 %,DSC结晶温度小于约75℃,储能模量小于约1.0×10 6达因/ cm 2,10rad / sec(25 C。)。

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