公开(公告)号：US07812433B2

公开(公告)日：2010-10-12

申请号：US12078076

申请日：2008-03-27

Applicant: Mi-Cheng Cheng ,  Kuo-Hua Chen

Inventor： Mi-Cheng Cheng ,  Kuo-Hua Chen

IPC: H01L23/02

CPC classification number: B81B7/0067 ,  B81B7/0093 ,  B81B2201/042 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: A package structure and an electronic device using the same are provided. The package structure includes a chip module and a cover. The chip module covered by the cover is used for receiving a first signal. The chip module includes a substrate, a heat sink and a first chip. The substrate has a first surface, a second surface and an opening. The first surface is opposite to the second surface. The opening penetrates the first surface and the second surface. The heat sink is disposed on the first surface of the substrate and covers the opening. The first chip is disposed on the heat sink and is positioned inside the opening. A bottom surface of the first chip flatly contacts the heat sink. The cover has a window element. The first signal passes through the window element to contact with the chip module.

Abstract translation: 提供封装结构和使用其的电子器件。 封装结构包括芯片模块和盖。 覆盖的芯片模块用于接收第一个信号。 芯片模块包括基板，散热器和第一芯片。 基板具有第一表面，第二表面和开口。 第一表面与第二表面相对。 开口穿过第一表面和第二表面。 散热器设置在基板的第一表面上并覆盖开口。 第一芯片设置在散热器上并位于开口内。 第一芯片的底面平坦地接触散热器。 盖子有一个窗口元素。 第一个信号通过窗口元件与芯片模块接触。

公开(公告)号：US20080290489A1

公开(公告)日：2008-11-27

申请号：US12078076

申请日：2008-03-27

Applicant: Mi-Cheng Cheng ,  Kuo-Hua Chen

Inventor： Mi-Cheng Cheng ,  Kuo-Hua Chen

IPC: H01L23/36

CPC classification number: B81B7/0067 ,  B81B7/0093 ,  B81B2201/042 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: A package structure and an electronic device using the same are provided. The package structure includes a chip module and a cover. The chip module covered by the cover is used for receiving a first signal. The chip module includes a substrate, a heat sink and a first chip. The substrate has a first surface, a second surface and an opening. The first surface is opposite to the second surface. The opening penetrates the first surface and the second surface. The heat sink is disposed on the first surface of the substrate and covers the opening. The first chip is disposed on the heat sink and is positioned inside the opening. A bottom surface of the first chip flatly contacts the heat sink. The cover has a window element. The first signal passes through the window element to contact with the chip module.

Abstract translation: 提供封装结构和使用其的电子器件。 封装结构包括芯片模块和盖。 覆盖的芯片模块用于接收第一个信号。 芯片模块包括基板，散热器和第一芯片。 基板具有第一表面，第二表面和开口。 第一表面与第二表面相对。 开口穿过第一表面和第二表面。 散热器设置在基板的第一表面上并覆盖开口。 第一芯片设置在散热器上并位于开口内。 第一芯片的底面平坦地接触散热器。 盖子有一个窗口元素。 第一个信号通过窗口元件与芯片模块接触。