公开(公告)号：US07812433B2

公开(公告)日：2010-10-12

申请号：US12078076

申请日：2008-03-27

Applicant: Mi-Cheng Cheng ,  Kuo-Hua Chen

Inventor： Mi-Cheng Cheng ,  Kuo-Hua Chen

IPC: H01L23/02

CPC classification number: B81B7/0067 ,  B81B7/0093 ,  B81B2201/042 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: A package structure and an electronic device using the same are provided. The package structure includes a chip module and a cover. The chip module covered by the cover is used for receiving a first signal. The chip module includes a substrate, a heat sink and a first chip. The substrate has a first surface, a second surface and an opening. The first surface is opposite to the second surface. The opening penetrates the first surface and the second surface. The heat sink is disposed on the first surface of the substrate and covers the opening. The first chip is disposed on the heat sink and is positioned inside the opening. A bottom surface of the first chip flatly contacts the heat sink. The cover has a window element. The first signal passes through the window element to contact with the chip module.

Abstract translation: 提供封装结构和使用其的电子器件。 封装结构包括芯片模块和盖。 覆盖的芯片模块用于接收第一个信号。 芯片模块包括基板，散热器和第一芯片。 基板具有第一表面，第二表面和开口。 第一表面与第二表面相对。 开口穿过第一表面和第二表面。 散热器设置在基板的第一表面上并覆盖开口。 第一芯片设置在散热器上并位于开口内。 第一芯片的底面平坦地接触散热器。 盖子有一个窗口元素。 第一个信号通过窗口元件与芯片模块接触。

公开(公告)号：US20080290489A1

公开(公告)日：2008-11-27

申请号：US12078076

申请日：2008-03-27

Applicant: Mi-Cheng Cheng ,  Kuo-Hua Chen

Inventor： Mi-Cheng Cheng ,  Kuo-Hua Chen

IPC: H01L23/36

CPC classification number: B81B7/0067 ,  B81B7/0093 ,  B81B2201/042 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: A package structure and an electronic device using the same are provided. The package structure includes a chip module and a cover. The chip module covered by the cover is used for receiving a first signal. The chip module includes a substrate, a heat sink and a first chip. The substrate has a first surface, a second surface and an opening. The first surface is opposite to the second surface. The opening penetrates the first surface and the second surface. The heat sink is disposed on the first surface of the substrate and covers the opening. The first chip is disposed on the heat sink and is positioned inside the opening. A bottom surface of the first chip flatly contacts the heat sink. The cover has a window element. The first signal passes through the window element to contact with the chip module.

Abstract translation: 提供封装结构和使用其的电子器件。 封装结构包括芯片模块和盖。 覆盖的芯片模块用于接收第一个信号。 芯片模块包括基板，散热器和第一芯片。 基板具有第一表面，第二表面和开口。 第一表面与第二表面相对。 开口穿过第一表面和第二表面。 散热器设置在基板的第一表面上并覆盖开口。 第一芯片设置在散热器上并位于开口内。 第一芯片的底面平坦地接触散热器。 盖子有一个窗口元素。 第一个信号通过窗口元件与芯片模块接触。

公开(公告)号：US20100149414A1

公开(公告)日：2010-06-17

申请号：US12501682

申请日：2009-07-13

Applicant: Kuo-Hua Chen ,  Yu-Che Tsai

Inventor： Kuo-Hua Chen ,  Yu-Che Tsai

IPC: H04N7/01

CPC classification number: H04N7/0112 ,  H04N7/012 ,  H04N7/0127

Abstract: In the specification and drawing a method for processing video is disclosed. The method comprises the following steps: at least one frame rate of the video is detected, and a refresh rate of a display is adjusted to about 96 Hz when the frame rate is about 24 fps. Moreover, an apparatus for processing video is also disclosed in the specification and drawing.

Abstract translation: 在说明书和绘图中公开了一种用于处理视频的方法。 该方法包括以下步骤：当帧速率为约24fps时，检测到视频的至少一帧速率，并将显示器的刷新率调整到约96Hz。 此外，在说明书和附图中还公开了一种用于处理视频的装置。

公开(公告)号：US07621683B2

公开(公告)日：2009-11-24

申请号：US11556530

申请日：2006-11-03

Applicant: She-Hong Cheng ,  Kuo-Hua Chen

Inventor： She-Hong Cheng ,  Kuo-Hua Chen

IPC: G03B17/00

CPC classification number: G03B17/02 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H04N5/2254 ,  H04N5/2257 ,  H04N17/002 ,  Y10S438/975 ,  H01L2924/00014

Abstract: A compact camera module (CCM) substantially includes a substrate, a sensor chip and a lens module. The substrate has a surface defining a chip-attached area for attaching the sensor chip and a module-secured area for mounting the lens module. A check point is defined in the chip attached area. The module-secured area surrounds the chip-attached area. The substrate includes a plurality of connecting pads and a plurality of check bars disposed outside the chip-attached area, wherein the perpendicular bisectors of the check bars intersect with each other at a point aligning with the check point. Accordingly, a self-check step can be performed to check the center of the sensor area of the sensor chip in accordance with the intersection point after a chip is attached.

Abstract translation: 小型相机模块（CCM）基本上包括基板，传感器芯片和透镜模块。 衬底具有限定用于附接传感器芯片的芯片连接区域和用于安装透镜模块的模块固定区域的表面。 检查点在芯片连接区域中定义。 模块固定区域围绕芯片附着区域。 基板包括多个连接焊盘和设置在芯片附着区域外部的多个检查条，其中检查条的垂直平分线在与检查点对准的点处彼此相交。 因此，可以执行自检步骤，以便在安装芯片之后根据交点检查传感器芯片的传感器区域的中心。

公开(公告)号：US20080041614A1

公开(公告)日：2008-02-21

申请号：US11889096

申请日：2007-08-09

Applicant: Kuo-Hua Chen ,  Hung-Hsiang Lu

Inventor： Kuo-Hua Chen ,  Hung-Hsiang Lu

IPC: H05K1/02

CPC classification number: H05K1/0269 ,  H01L2924/0002 ,  H05K3/0052 ,  H05K3/303 ,  H05K3/3452 ,  H05K2201/09781 ,  H05K2201/0989 ,  H01L2924/00

Abstract: A circuit board for carrying a chip is provided. The circuit board includes a substrate, a wiring layer and a solder mask. The wiring layer including a cutting line pattern defining a cutting region is disposed on the substrate. The solder mask including a chip region, a first opening and a second opening is disposed on the substrate and the wiring layer. The chip region is disposed inside the cutting region. The chip is suitable to be disposed in the chip region, wherein the chip overlaps the chip region. The first opening and the second opening are respectively disposed outside two adjacent lateral sides of the chip region for exposing a part of the cutting line pattern. The exposed part of the cutting line pattern is used for measuring the position of the chip relative to the substrate.

Abstract translation: 提供用于承载芯片的电路板。 电路板包括基板，布线层和焊接掩模。 包括限定切割区域的切割线图案的布线层设置在基板上。 包括芯片区域，第一开口和第二开口的焊接掩模设置在基板和布线层上。 芯片区域设置在切割区域内。 该芯片适于放置在芯片区域中，其中芯片与芯片区域重叠。 第一开口和第二开口分别设置在芯片区域的两个相邻侧面的外侧，用于暴露切割线图案的一部分。 切割线图案的露出部分用于测量芯片相对于基板的位置。

公开(公告)号：US20070196103A1

公开(公告)日：2007-08-23

申请号：US11556530

申请日：2006-11-03

Applicant: She-Hong CHENG ,  Kuo-Hua Chen

Inventor： She-Hong CHENG ,  Kuo-Hua Chen

IPC: G03B17/00

CPC classification number: G03B17/02 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H04N5/2254 ,  H04N5/2257 ,  H04N17/002 ,  Y10S438/975 ,  H01L2924/00014

Abstract: A compact camera module (CCM) substantially includes a substrate, a sensor chip and a lens module. The substrate has a surface defining a chip-attached area for attaching the sensor chip and a module-secured area for mounting the lens module. A check point is defined in the chip attached area. The module-secured area surrounds the chip-attached area. The substrate includes a plurality of connecting pads and a plurality of check bars disposed outside the chip-attached area, wherein the perpendicular bisectors of the check bars intersect with each other at a point aligning with the check point. Accordingly, a self-check step can be performed to check the center of the sensor area of the sensor chip in accordance with the intersection point after a chip is attached.

Abstract translation: 小型相机模块（CCM）基本上包括基板，传感器芯片和透镜模块。 衬底具有限定用于附接传感器芯片的芯片连接区域和用于安装透镜模块的模块固定区域的表面。 检查点在芯片连接区域中定义。 模块固定区域围绕芯片附着区域。 基板包括多个连接焊盘和设置在芯片附着区域外部的多个检查条，其中检查条的垂直平分线在与检查点对准的点处彼此相交。 因此，可以执行自检步骤，以便在安装芯片之后根据交点检查传感器芯片的传感器区域的中心。

公开(公告)号：US20100187681A1

公开(公告)日：2010-07-29

申请号：US12691478

申请日：2010-01-21

Applicant: Kuo-Hua Chen ,  Kuo-Pin Yang

Inventor： Kuo-Hua Chen ,  Kuo-Pin Yang

IPC: H01L23/34 ,  H01L23/48

CPC classification number: H01L23/49827 ,  H01L23/147 ,  H01L23/3677 ,  H01L23/49816 ,  H01L24/16 ,  H01L25/0652 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/0401

Abstract: The present invention relates to a silicon substrate having through vias and a package having the same. The silicon substrate includes a substrate body, a plurality of through vias and at least one heat dissipating area. The substrate body has a surface, and the material of the substrate body is silicon. The through vias penetrate the substrate body, and each of the through vias has a conductive material therein. The heat dissipating area is disposed on the surface of the substrate body and covers at least two through vias. The heat dissipating area is made of metal, and the through vias inside the heat dissipating area have same electrical potential. Thus, the heat in the through vias is transmitted to the heat dissipating area, and since the area of the heat dissipating area is large, the silicon substrate has good heat dissipation efficiency.

Abstract translation: 本发明涉及具有通孔的硅衬底和具有该通孔的封装。 硅衬底包括衬底主体，多个通孔和至少一个散热区域。 基板主体具有表面，并且基板主体的材料是硅。 通孔穿透基板主体，并且通孔中的每一个在其中具有导电材料。 散热区域设置在基板主体的表面上并且覆盖至少两个通孔。 散热区由金属制成，散热区内的通孔具有相同的电位。 因此，通孔中的热量传递到散热区域，由于散热面积大，所以硅基板具有良好的散热效率。

公开(公告)号：US20100164293A1

公开(公告)日：2010-07-01

申请号：US12648925

申请日：2009-12-29

Applicant: Pi-Chang Chiu ,  Kuo-Hua Chen

Inventor： Pi-Chang Chiu ,  Kuo-Hua Chen

IPC: H02J1/00 ,  H01R33/96

CPC classification number: H04N21/4436 ,  H04N21/418 ,  Y10T307/658 ,  Y10T307/675 ,  Y10T307/696 ,  Y10T307/729

Abstract: An electronic card connector is used to connect an electronic card to an electronic device, such as a level-shifting device. The electronic card connector includes an insert slot unit and a switch unit. The insert slot unit is adapted for insertion of the electronic card and is provided with a power signal terminal for providing electric power to the electronic card that is inserted into the insert slot unit. The 10 switch unit is disposed in the insert slot unit, is operable to establish electrical connection between the power signal terminal and a first power source when the electronic card inserted into the insert slot unit does not actuate the switch unit, and is further operable to establish electrical connection between the power signal terminal and a second power source when the electronic card inserted into the insert slot unit actuates the switch unit.

公开(公告)号：US07540315B2

公开(公告)日：2009-06-02

申请号：US11590414

申请日：2006-10-31

Applicant: Kuo-Hua Chen

Inventor： Kuo-Hua Chen

IPC: E06B9/30

CPC classification number: E06B9/322 ,  E06B2009/3225

Abstract: A winding mechanism for a window blind includes a base having two slideways, a rotation member rotatably mounted on the base and having an outer wall formed with a threaded guide portion, and a guide seat having an inner wall formed with a threaded guide hole screwed onto the threaded guide portion of the rotation member and an outer wall formed with two guide posts each provided with a roller slidably mounted in a respective slideway of the base. Thus, when the lift cord is wound around the rotation member, the guide seat is movable successively on the rotation member by guidance of the roller, so that the lift cord is wound around the rotation member serially and smoothly by guidance of the guide seat, thereby preventing the lift cord from being tangled.

Abstract translation: 用于窗帘的卷绕机构包括具有两个滑道的基座，旋转构件可旋转地安装在基座上并具有形成有螺纹导向部分的外壁，以及引导座，其具有形成有螺纹导向孔的内壁， 旋转构件的螺纹引导部分和形成有两个导向柱的外壁，每个导向柱设置有可滑动地安装在基座的相应滑道中的辊。 因此，当提升绳缠绕在旋转构件上时，引导座可以通过引导辊在旋转构件上依次移动，使得提升绳在引导座的引导下顺序地和顺畅地缠绕在旋转构件上， 从而防止电梯线缠结。

公开(公告)号：US20080037234A1

公开(公告)日：2008-02-14

申请号：US11779888

申请日：2007-07-19

Applicant: Kuo-Hua Chen

Inventor： Kuo-Hua Chen

IPC: H05K7/00

CPC classification number: H05K7/026 ,  H01L23/544 ,  H01L24/05 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/85125 ,  H01L2924/00014 ,  H01L2924/014 ,  H05K1/0269 ,  H05K3/303 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/09918 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A circuit board which is suitable for carrying a chip and includes a substrate, a wiring layer and a solder mask is provided. The wiring layer is disposed on the substrate. The solder mask is between the substrate and the wiring layer. The solder mask has a chip area, a first opening and a second opening. The chip is suitable for being disposed in the chip area. The first opening and the second opening are respectively located outside two sides of the chip area that are adjacent to each other. The exposed parts of the wiring layer are used for identifying the relative location of the chip relative to the substrate.

Abstract translation: 提供一种适用于承载芯片并包括基板，布线层和焊接掩模的电路板。 布线层设置在基板上。 焊料掩模在基板和布线层之间。 焊接掩模具有芯片面积，第一开口和第二开口。 芯片适合放置在芯片区域。 第一开口和第二开口分别位于彼此相邻的芯片区域的两侧之外。 布线层的暴露部分用于识别芯片相对于衬底的相对位置。