摘要:
An all solutions automatic test pattern generation (ATPG) engine method uses a decision selection heuristic that makes use of the “connectivity of gates” in the circuit in order to obtain a compact solution-set. The “symmetry in search-states” is analyzed using a “Success-Driven Learning” technique which is extended to prune conflict sub-spaces. A metric is used to determine the use of learnt information a priori, which information is stored and used efficiently during “success driven learning”.
摘要:
A method of creating models for power estimation of a circuit comprising generating an input space for the circuit. The input space is separated into multiple power modes corresponding to regions that display similar power behavior. Separate power models are generated for each of said multiple power modes. A power mode identification function is created that selects an appropriate power model from the separate power models based on the present and past values of the circuit inputs.
摘要:
Methods of compacting sequential circuit test vector set by partitioning of faults into hard and easy faults, re-ordering vectors in a test set by moving sequences that detect hard faults to the beginning of the test set, and a combination of partitioning and re-ordering.
摘要:
A method and apparatus for testing a scan-based 3D integrated circuit (3DIC) using time-division demultiplexing/multiplexing allowing for high-data-rate scan patterns applied at input/output pads converting into low-data-rate scan patterns applied to each embeddded module in the 3DIC. A set of 3D design guidelines is proposed to reduce the number of test times and the number of through-silicon vias (TSVs) required for both pre-bond testing and post-bond testing. The technique allows reuse of scan patterns developed for pre-bond testing of each die (layer) for post-bond testing of the whole 3DIC. It further reduces test application time without concerns for I/O pad count limit and risks for fault coverage loss.
摘要:
A hybrid clocking scheme for simultaneously detecting a b-cycle path-delay fault in a b-cycle (false) path and a c-cycle path-delay fault in a c-cycle (false) path using at least n+1 at-speed clock pulses during a capture operation in a clock domain in a scan design or a scan-based BIST design, where 1
摘要翻译:一种用于同时检测b周期(假)路径中的b周期路径延迟故障和c周期(假)路径中的c周期路径延迟故障的混合时钟方案,其使用至少n + 1 at- 在扫描设计或基于扫描的BIST设计中的时钟域中的捕获操作期间,速度时钟脉冲,其中1 <= b <= c <= n。 扫描设计或BIST设计包括多个扫描链,每个扫描链包括串联耦合的多个扫描单元。 该设计包括一个或多个时钟域,每个时钟域以其预期的工作频率或速度运行。 混合时钟方案包括至少一个速率移位时钟脉冲或一个在速捕获时钟脉冲,紧接着在捕获操作期间至少两个速度捕捉时钟脉冲,以同时检测b周期路径延迟故障,以及 时钟域内的c循环路径延迟故障。
摘要:
Generating a test sequence includes receiving a circuit representation describing a circuit, and a fault associated with the circuit representation. A miter circuit model associated with a good circuit model and a faulty circuit model is established according to the circuit representation. A satisfiability problem corresponding to the fault as associated with the miter circuit model is also established. Whether the satisfiability problem is satisfiable is determined. If the satisfiability problem is satisfiable, a test sequence is generated for the fault as associated with the miter circuit model.
摘要:
A method and apparatus for testing a scan-based 3D integrated circuit (3DIC) using time-division demultiplexing/multiplexing allowing for high-data-rate scan patterns applied at input/output pads converting into low-data-rate scan patterns applied to each embeddded module in the 3DIC. A set of 3D design guidelines is proposed to reduce the number of test times and the number of through-silicon vias (TSVs) required for both pre-bond testing and post-bond testing. The technique allows reuse of scan patterns developed for pre-bond testing of each die (layer) for post-bond testing of the whole 3DIC. It further reduces test application time without concerns for I/O pad count limit and risks for fault coverage loss.
摘要:
A method for fast static compaction in sequential circuits with finite output states by removing subsequences of test vectors from a vector test set. The method has the following steps: (1) relaxing the output states of the sequential circuits; (2) identifying a candidate subsequence of test vectors from the vector test set for removal; (3) temporarily removing the candidate subsequence of test vectors from the vector test set; (4) performing fault simulation on remaining test vectors from the vector test set; (5) examining fault simulation results against a set of removal criteria; (6) permanently removing the temporarily removed candidate subsequence if said set of removal criteria are met; (7) replacing the temporarily removed candidate subsequence if said set of removal criteria are not met; and (8) repeating steps (1) through (7) until all candidate subsequences of test vectors have been identified.