公开(公告)号：US07740899B2

公开(公告)日：2010-06-22

申请号：US10431346

申请日：2003-05-07

Applicant: Srinivasan Sridharan ,  Michail Moroz

Inventor： Srinivasan Sridharan ,  Michail Moroz

IPC: B05D5/12 ,  B05D3/02

CPC classification number: C03C8/20 ,  C03C8/02 ,  C03C8/14 ,  C03C8/22

Abstract: The present invention provides an electronic device having a lead-free and cadmium-free glass composition applied thereto and fired to form an acid resistant overglaze, and a method of overglazing an electronic device using the lead-free and cadmium-free glass composition. The lead-free and cadmium-free glass composition fuses at low firing temperatures and is particularly suitable for use in thick film pastes. The glass composition forms predominantly bismuth titanate and/or zinc titanate crystals upon firing. Preferably, glass compositions include by weight from about 11% to about 52% SiO2, from 3.4% to about 40% TiO2, up to about 75% Bi2O3, up to about 40% by weight ZnO, where the sum of Bi2O3 and ZnO comprises from about 15% to about 85% of the glass composition by weight.

Abstract translation: 本发明提供了一种电子装置，其具有施加到其上的无铅和无镉玻璃组合物并烧制以形成耐酸釉料，以及使用无铅和无镉玻璃组合物来搪瓷电子器件的方法。 无铅和无镉玻璃组合物在低烧成温度下熔化，特别适用于厚膜糊剂。 玻璃组合物在烧制时主要形成钛酸铋和/或钛酸锌晶体。 优选地，玻璃组合物包括按重量计约11％至约52％SiO 2，3.4％至约40％TiO 2，至多约75％Bi 2 O 3，至多约40％重量的ZnO，其中Bi 2 O 3和ZnO的总和包含 约占玻璃组合物重量的约15％至约85％。