DRAM no capacitor dielectric process
    1.
    发明授权
    DRAM no capacitor dielectric process 失效
    DRAM无电容介质工艺

    公开(公告)号:US5696036A

    公开(公告)日:1997-12-09

    申请号:US751089

    申请日:1996-11-15

    CPC分类号: H01L28/40

    摘要: A new method of fabricating the NO capacitor dielectric layers of dynamic random access memory (DRAM) cells is disclosed. Because NH.sub.4 Cl particles are soluble (dissolvable) in deionized (DI) water, the undesired NH.sub.4 Cl particles left in the thin nitride surface of the DRAM capacitor dielectric layer can be removed by high-speed spinning the silicon wafers while spraying DI water. At the same time, this high-speed spinning step produces a charge-up effect that can also help the thin nitride layer of the DRAM capacitors eliminate these defects. High quality capacitors are then achieved, and therefore high quality DRAM cells may also be produced using this method.

    摘要翻译: 公开了制造动态随机存取存储器(DRAM)单元的NO电容器电介质层的新方法。 因为NH 4 Cl颗粒在去离子(DI)水中是可溶的(可溶解的),所以留下在DRAM电容器介质层的薄氮化物表面中的不需要的NH 4 Cl颗粒可以通过在喷涂去离子水的同时高速旋转硅晶片来除去。 同时,这种高速纺丝步骤产生充电效果,也可以帮助DRAM电容器的薄氮化物层消除这些缺陷。 然后实现高质量的电容器,因此也可以使用这种方法来生产高质量的DRAM单元。