公开(公告)号：US06656026B2

公开(公告)日：2003-12-02

申请号：US10014456

申请日：2001-12-14

申请人： Minoru Numoto

发明人： Minoru Numoto

IPC分类号： B24B100

CPC分类号： B24B37/30 ,  B24B49/16 ,  H01L21/3212

摘要： In the wafer polishing apparatus for pressing a wafer against a polishing pad with an air bag, which is provided to a carrier, pressing area regulating members are attached to the bottom face of the carrier, whereby areas for pressing the wafer with the air bag are regulated. The pressing area regulating members are prepared in order to regulate different areas to be pressed. The areas for pressing the wafer with the air bag can be changed by replacing the pressing area regulating members when suitable.

公开(公告)号：US06319106B2

公开(公告)日：2001-11-20

申请号：US09779828

申请日：2001-02-09

申请人： Minoru Numoto

发明人： Minoru Numoto

IPC分类号： B24B500

CPC分类号： B24B37/30 ,  B24B37/013 ,  B24B49/10 ,  B24B49/16 ,  H01L21/3212

摘要： The present invention is a wafer polishing apparatus with a device that detects the polishing end according to a change in rotation resistance of a wafer during polishing. The wafer polishing apparatus comprises a head body and a carrier which are connected with each other by a connecting bar which is provided with a strain gage, and determines strain in a horizontal direction of the connecting bar by the strain gage so as to determine a rotation torque of the carrier, whereby accurately detects the polishing end. Since a retainer ring is mounted to the outer periphery of the carrier via an O ring, the impact at contacting of the wafer with the retainer ring can be absorbed by the O ring, thus the wafer is prevented from damage. Because the retainer ring is mounted to the carrier without a gap, the outer periphery of the wafer is enclosed by the retainer ring, and the wafer can be polished in a state where its center is held on the central axis of the carrier. Therefore, the polishing precision of the wafer can be improved.

摘要翻译： 本发明是一种晶片抛光装置，具有根据抛光时晶片的旋转阻力变化来检测抛光端的装置。 晶片抛光装置包括头部本体和载体，它们通过设有应变计的连接杆相互连接，并通过应变计确定连接杆的水平方向上的应变，以便确定旋转 载体的扭矩，从而精确地检测抛光端。 由于通过O形环将保持环安装到载体的外周，所以在晶片与保持环接触时的冲击能被O形环吸收，从而防止了晶片的损坏。 由于保持环没有间隙地安装到载体上，所以晶片的外周被保持环包围，并且可以在其中心保持在载体的中心轴上的状态下抛光晶片。 因此，能够提高晶片的研磨精度。

公开(公告)号：US06203414B1

公开(公告)日：2001-03-20

申请号：US09053062

申请日：1998-04-01

申请人： Minoru Numoto ,  Takao Inaba ,  Kenji Sakai ,  Hisashi Terashita ,  Manabu Satoh

发明人： Minoru Numoto ,  Takao Inaba ,  Kenji Sakai ,  Hisashi Terashita ,  Manabu Satoh

IPC分类号： B24B722

CPC分类号： B24B37/30 ,  B24B49/16

摘要： The polishing apparatus comprises a turn table, which polishes a semiconductor wafer, and a holding and pressing part, which holds and presses the semiconductor wafer against a polishing surface of the turn table. The holding and pressing part transmits a force from an air bag to the semiconductor wafer via a pressurized fluid layer to thereby press the semiconductor wafer against the polishing surface via the pressurized fluid layer, so that the semiconductor wafer can be polished. Thereby, it is possible to uniformly polish the semiconductor wafer.

摘要翻译： 抛光装置包括：抛光半导体晶片的转台，以及将半导体晶片压靠在转台的抛光表面上的保持和按压部分。 保持和按压部分经由加压流体层将气体从气囊传递到半导体晶片，从而经由加压流体层将半导体晶片压靠在抛光表面上，从而可以抛光半导体晶片。 由此，能够均匀地研磨半导体晶片。

公开(公告)号：US07056196B2

公开(公告)日：2006-06-06

申请号：US10433364

申请日：2001-12-04

申请人： Minoru Numoto

发明人： Minoru Numoto

IPC分类号： B24B1/00

CPC分类号： B24B37/30

摘要： A wafer polisher, wherein a retainer ring (28) is installed in a wafer holding head (14), a protective sheet material (52) is disposed inside the retainer ring (28), and a wafer (W) is pressed against a polishing pad (20) through the protective sheet material (52) for polishing, whereby the protective sheet material (52) can be disposed without causing wrinkles on the inner peripheral part of the retainer ring (28).

摘要翻译： 一种晶片抛光机，其中保持环（28）安装在晶片保持头（14）中，保护片材（52）设置在保持环（28）的内部，并且将晶片（W）压在抛光 垫（20）穿过用于抛光的保护片材（52），由此可以设置保护片材（52），而不会在保持环（28）的内周部分产生褶皱。

公开(公告)号：US6059636A

公开(公告)日：2000-05-09

申请号：US112287

申请日：1998-07-09

申请人： Takao Inaba ,  Minoru Numoto ,  Kenji Sakai ,  Manabu Satoh

发明人： Takao Inaba ,  Minoru Numoto ,  Kenji Sakai ,  Manabu Satoh

IPC分类号： B24B37/04 ,  B24B37/005 ,  B24B49/02 ,  B24B49/04 ,  B24B49/06 ,  H01L21/304 ,  B24B49/00

CPC分类号： B24B37/013 ,  B24B37/005 ,  B24B49/04 ,  B24B49/06

摘要： Sensors detect a stock removal of a wafer during polishing, and a CPU calculates the stock removal in accordance with information from the sensors. The CPU compares the actual stock removal detected by the sensors and a model stock removal stored in RAM, and determines timings for dressing and replacing said polishing pad in accordance with a difference between the actual stock removal and the model stock removal. The determination results are shown on a display.

公开(公告)号：US4765181A

公开(公告)日：1988-08-23

申请号：US82925

申请日：1987-08-05

申请人： Minoru Numoto ,  Tsutomu Kanzaki

发明人： Minoru Numoto ,  Tsutomu Kanzaki

IPC分类号： G01B5/28 ,  G01B7/28 ,  G01B7/34

CPC分类号： G01B7/28 ,  G01B5/28 ,  G01B7/34

摘要： A surface texture measuring instrument comprises an immovable casing located on an object, a movable pick-up for detecting a surface roughness of the object, and a driving unit in the casing for driving the pick-up. The pick-up comprises a skid having a curved surface for absorbing a waviness component of the surface of the object, and a stylus in the skid for detecting the surface roughness thereof. The stylus is slightly deviated from a center of the curved surface to give a more accurate measurement of the surface roughness.

摘要翻译： 表面纹理测量仪器包括位于物体上的不可移动的壳体，用于检测物体的表面粗糙度的可移动拾取器和用于驱动拾取器的壳体中的驱动单元。 拾取器包括具有用于吸收物体表面的波纹成分的弯曲表面的滑块和用于检测其表面粗糙度的滑块中的触针。 触笔略微偏离曲面的中心，以更准确地测量表面粗糙度。

公开(公告)号：US06702658B2

公开(公告)日：2004-03-09

申请号：US09996797

申请日：2001-11-30

申请人： Minoru Numoto

发明人： Minoru Numoto

IPC分类号： B24B4700

CPC分类号： B24B37/32 ,  B24B37/30

摘要： A rotation force of a drive shaft is transmitted from a drive plate to an intermediate plate through a first pin, and a rotation force of the intermediate plate is transmitted to a carrier through a second pin. The rotation force of the drive shaft is transmitted to the carrier through an Oldham's coupling mechanism; thereby, a wafer polishing apparatus can always rotate the carrier in a stable condition even though a wafer receives a friction force in side directions from a polishing pad because no twisting force is applied to the drive shaft.

摘要翻译： 驱动轴的旋转力通过第一销从驱动板传递到中间板，并且中间板的旋转力通过第二销传递到载体。 驱动轴的旋转力通过奥德姆联合机构传递到载体; 因此，即使晶片从抛光垫接收到侧面的摩擦力，晶片抛光装置总是可以在稳定的状态下旋转载体，因为对驱动轴没有施加扭转力。

公开(公告)号：US06409583B1

公开(公告)日：2002-06-25

申请号：US09522677

申请日：2000-03-10

申请人： Minoru Numoto

发明人： Minoru Numoto

IPC分类号： B24B700

CPC分类号： B24B37/30 ,  B24B37/32 ,  B24B49/16

摘要： An apparatus 1 for polishing wafers in which a first pushing means 50 for imparting a pushing force to a carrier 20 is arranged along the outer peripheral portion under the lower surface of a head body 40, and a second pushing means 60 for imparting a pushing force to a retainer ring 30 is arranged at a central portion under the lower surface of the head body. The first and second pushing means are formed of air bags 51 and 61.

摘要翻译： 一种用于抛光晶片的装置1，其中用于向载体20施加推力的第一推动装置50沿着头主体40的下表面下的外周部分布置，并且第二推动装置60用于施加推力 保持环30布置在头部主体的下表面下方的中心部分处。 第一和第二推动装置由气囊51和61形成。

公开(公告)号：US06296555B1

公开(公告)日：2001-10-02

申请号：US09420454

申请日：1999-10-18

申请人： Takao Inaba ,  Minoru Numoto

发明人： Takao Inaba ,  Minoru Numoto

IPC分类号： B24B100

CPC分类号： B24B37/345 ,  B24B41/061

摘要： According to the present invention, a floating mechanism of a load stage floats positioned wafers in concave parts, and then, the chucks hold the wafers by suction. Therefore, the chucks can easily hold the centered wafers.

摘要翻译： 根据本发明，负载台的浮动机构将定位的晶片漂浮在凹部中，然后卡盘通过抽吸来保持晶片。 因此，卡盘可以容易地保持中心的晶片。

公开(公告)号：US06283828B1

公开(公告)日：2001-09-04

申请号：US09433310

申请日：1999-11-03

申请人： Minoru Numoto

发明人： Minoru Numoto

IPC分类号： B24B4900

CPC分类号： B24B37/30 ,  B24B37/013 ,  B24B49/10 ,  B24B49/16 ,  H01L21/3212

摘要： The present invention is a wafer polishing apparatus with a device that detects the polishing end according to a change in rotation resistance of a wafer during polishing. The wafer polishing apparatus comprises a head body and a carrier which are connected with each other by a connecting bar which is provided with a strain gage, and determines strain in a horizontal direction of the connecting bar by the strain gage so as to determine a rotation torque of the carrier, whereby accurately detects the polishing end. Since a retainer ring is mounted to the outer periphery of the carrier via an O ring, the impact at contacting of the wafer with the retainer ring can be absorbed by the O ring, thus the wafer is prevented from damage. Because the retainer ring is mounted to the carrier without a gap, the outer periphery of the wafer is enclosed by the retainer ring, and the wafer can be polished in a state where its center is held on the central axis of the carrier. Therefore, the polishing precision of the wafer can be improved.