-
公开(公告)号：US07275312B2
公开(公告)日：2007-10-02
申请号：US10611215
申请日：2003-06-30
IPC分类号： B23P18/00
CPC分类号： B65B7/285 , H01L21/50 , Y10T29/4913 , Y10T29/49133 , Y10T29/53174 , Y10T29/53178 , Y10T29/53248 , Y10T29/53252 , Y10T29/53261 , Y10T29/53265
摘要： The specification discloses an apparatus comprising an alignment plate having a plurality of depressions therein, each depression being sized to receive a packaging cap therein and to prevent its movement, and a force applicator to apply a force to press the packaging caps and a substrate firmly together. Also disclosed is a process comprising inserting a plurality of packaging caps in a plurality of depressions on an alignment plate, each depression being sized to receive a packaging cap and prevent its movement, aligning the plurality of packaging caps with individual devices on a substrate, placing the substrate in contact with the packaging caps, and applying a force to press the caps against the substrate. Other embodiments are disclosed and claimed.
摘要翻译： 本说明书公开了一种装置，其包括其中具有多个凹陷的对准板，每个凹陷的尺寸被设计成在其中容纳包装盖并防止其移动，并且施力器施加力以将包装盖和基板牢固地压在一起 。 还公开了一种方法，包括将多个包装帽插入对准板上的多个凹陷中，每个凹陷的尺寸被设计成接收包装盖并防止其移动，使多个包装盖与基板上的各个装置对准，放置 所述基板与所述包装盖接触，并且施加力以将所述盖压靠在所述基板上。 公开和要求保护其他实施例。
-
公开(公告)号：US07584536B2
公开(公告)日：2009-09-08
申请号：US11827705
申请日：2007-07-13
IPC分类号： H05K3/30
CPC分类号： B65B7/285 , H01L21/50 , Y10T29/4913 , Y10T29/49133 , Y10T29/53174 , Y10T29/53178 , Y10T29/53248 , Y10T29/53252 , Y10T29/53261 , Y10T29/53265
摘要： The specification discloses an apparatus comprising an alignment plate having a plurality of depressions therein, each depression being sized to receive a packaging cap therein and to prevent its movement, and a force applicator to apply a force to press the packaging caps and a substrate firmly together. Also disclosed is a process comprising inserting a plurality of packaging caps in a plurality of depressions on an alignment plate, each depression being sized to receive a packaging cap and prevent its movement, aligning the plurality of packaging caps with individual devices on a substrate, placing the substrate in contact with the packaging caps, and applying a force to press the caps against the substrate. Other embodiments are disclosed and claimed.
摘要翻译： 本说明书公开了一种装置，其包括其中具有多个凹陷的对准板，每个凹陷的尺寸被设计成在其中容纳包装盖并防止其移动，并且施力器施加力以将包装盖和基板牢固地压在一起 。 还公开了一种方法，包括将多个包装帽插入对准板上的多个凹陷中，每个凹陷的尺寸被设计成接收包装盖并防止其移动，使多个包装盖与基板上的各个装置对准，放置 所述基板与所述包装盖接触，并且施加力以将所述盖压靠在所述基板上。 公开和要求保护其他实施例。
-
3.发明授权公开(公告)号：US07518091B2
公开(公告)日：2009-04-14
申请号：US11449262
申请日：2006-06-07
申请人： Shalabh Tandon , Mitesh C. Patel
发明人： Shalabh Tandon , Mitesh C. Patel
CPC分类号： H05B6/806
摘要： A system and method is provided in which a radio frequency transmitter and/or a microwave frequency transmitter applies radio and/or microwave frequency energy, respectively, to an imprinted material to cure the imprinted material. In some embodiments, an oven may be used to apply thermal energy to the imprinted material in conjunction with the radio and/or microwave frequency energy to cure the imprinted material. In other embodiments, an oven is not used. The imprinted material may also include a susceptor that absorbs radio and/or microwave frequency energy and responsive thereto emits thermal energy to aid in curing the imprinted material. Further, at least one susceptor may be located externally and adjacent to the imprinted material. The external susceptor may absorb radio and/or microwave frequency energy, respectively, and responsive thereto emits thermal energy towards the imprinted material to aid in curing the imprinted material.
摘要翻译： 提供了一种系统和方法，其中射频发射机和/或微波频率发射机分别将无线电和/或微波频率能量应用于压印材料以固化所述压印材料。 在一些实施例中，烘箱可用于结合无线电和/或微波频率能量将热能施加到所述压印材料以固化所述压印材料。 在其它实施例中，不使用烤箱。 印记材料还可以包括吸收无线电和/或微波频率能量并且响应于其的发射器发射热能以帮助固化印记材料的感受体。 此外，至少一个感受器可以位于外部并且邻近印刷材料。 外部感受体可以分别吸收放射和/或微波频率能量，并且响应于此，能够向印迹材料发射热能以帮助固化印记材料。
-
公开(公告)号：US07179689B2
公开(公告)日：2007-02-20
申请号：US11282255
申请日：2005-11-18
CPC分类号： H01L23/3128 , H01L23/3135 , H01L24/48 , H01L24/73 , H01L24/81 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/81801 , H01L2224/82 , H01L2224/85 , H01L2224/86 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Numerous embodiments of an apparatus and method to stress and warpage of semiconductor packages are described. In one embodiment, a semiconductor die is disposed above a substrate. An encapsulating material is disposed above the substrate and semiconductor die, in which the encapsulating material has a combination of a low coefficient of thermal expansion material and a high coefficient of thermal expansion material.
-
公开(公告)号：US07170188B2
公开(公告)日：2007-01-30
申请号：US10882783
申请日：2004-06-30
IPC分类号： H01L23/28
CPC分类号： H01L23/3128 , H01L23/3135 , H01L24/48 , H01L24/73 , H01L24/81 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/81801 , H01L2224/82 , H01L2224/85 , H01L2224/86 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Numerous embodiments of an apparatus and method to stress and warpage of semiconductor packages are described. In one embodiment, a semiconductor die is disposed above a substrate. An encapsulating material is disposed above the substrate and semiconductor die, in which the encapsulating material has a combination of a low coefficient of thermal expansion material and a high coefficient of thermal expansion material.
摘要翻译： 描述了半导体封装的应力和翘曲的装置和方法的许多实施例。 在一个实施例中，半导体管芯设置在衬底之上。 封装材料设置在基板和半导体管芯上方，其中封装材料具有低热膨胀系数和高热膨胀系数的组合。
-
公开(公告)号：US07119314B2
公开(公告)日：2006-10-10
申请号：US10880484
申请日：2004-06-30
申请人： Shalabh Tandon , Mitesh C. Patel
发明人： Shalabh Tandon , Mitesh C. Patel
CPC分类号： H05B6/806
摘要： A system and method is provided in which a radio frequency transmitter and/or a microwave frequency transmitter applies radio and/or microwave frequency energy, respectively, to an imprinted material to cure the imprinted material. In some embodiments, an oven may be used to apply thermal energy to the imprinted material in conjunction with the radio and/or microwave frequency energy to cure the imprinted material. In other embodiments, an oven is not used. The imprinted material may also include a susceptor that absorbs radio and/or microwave frequency energy and responsive thereto emits thermal energy to aid in curing the imprinted material. Further, at least one susceptor may be located externally and adjacent to the imprinted material. The external susceptor may absorb radio and/or microwave frequency energy, respectively, and responsive thereto emits thermal energy towards the imprinted material to aid in curing the imprinted material.
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.017 秒)
