公开(公告)号：US5243218A

公开(公告)日：1993-09-07

申请号：US794221

申请日：1991-11-19

申请人： Hideki Zenitani ,  Mitsuo Okawachi ,  Hisato Sato ,  Haruhiko Horizoe ,  Naoya Yamazaki

发明人： Hideki Zenitani ,  Mitsuo Okawachi ,  Hisato Sato ,  Haruhiko Horizoe ,  Naoya Yamazaki

IPC分类号： H01L23/40 ,  H01L23/433 ,  H01L23/538 ,  H01L25/11 ,  H05K1/18 ,  H05K7/14 ,  H05K7/20

CPC分类号： H05K7/20436 ,  H01L23/4006 ,  H01L23/433 ,  H01L23/5387 ,  H01L25/115 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2023/4081 ,  H01L2924/0002 ,  H05K1/189

摘要： A cooling structure for LSI or the like devices to be mounted in a small size electronic apparatus housing. A main printed circuit board has mounted thereon first electronic devices with low heat generation; at least one auxiliary printed circuit board has mounted thereon a second electronic device with high heat generation, which is connected with one edge of the main printed circuit board (1) through a flexible printed circuit tape (5); a holder (6) fixed on the main printed circuit board (1) for resiliently supporting the auxiliary printed circuit board (2) at a distance above the former when the latter is turned over and is above the main printed circuit board (1) by bending the flexible printed circuit tape (5) so that a heat conductive surface of the second electronic device (4) is exposed outside. This printed circuit board assembly (A) is accommodated in a housing (B) made of a heat conductive material so that the heat conductive surface of the second electronic device (4) is brought into close and resilient contact with the inner wall (14) of the hosing (B).

摘要翻译： 用于安装在小型电子设备外壳中的LSI等的装置的冷却结构。 主印刷电路板上安装有低发热量的第一电子装置; 至少一个辅助印刷电路板上安装有通过柔性印刷电路胶带（5）与主印刷电路板（1）的一个边缘连接的具有高发热量的第二电子设备。 固定在主印刷电路板（1）上的保持器（6），用于当辅助印刷电路板（2）翻转后在与前者相隔一定距离处弹性地支撑辅助印刷电路板（2），并且在主印刷电路板（1）上方通过 弯曲柔性印刷电路胶带（5），使得第二电子装置（4）的导热表面暴露在外部。 该印刷电路板组件（A）容纳在由导热材料制成的壳体（B）中，使得第二电子装置（4）的导热表面与内壁（14）紧密弹性接触， 的动作（B）。