公开(公告)号：US06600132B2

公开(公告)日：2003-07-29

申请号：US09917918

申请日：2001-07-31

Applicant: John James Horsting ,  Mool Chand Gupta

Inventor： John James Horsting ,  Mool Chand Gupta

IPC: B23K2636

CPC classification number: B23K26/0613 ,  B23K26/0604 ,  B23K26/067 ,  B23K26/384

Abstract: A method of and apparatus for forming chamfers in an orifice of a workpiece. The orifice has an axis, which extends between a first surface and second surface of the workpiece, where the first and second surfaces are parallel to each other. The chamfers are disposed between the first surface and the second surface. The method includes forming an orifice in a workpiece with a source of non-collimated light directed at the workpiece at a predetermined first time interval, and forming a chamfer with a source of collimated light at a second time interval simultaneously with the first time interval. The apparatus includes at least a source of collimated and non-collimated light, a collimated light filter, and a non-collimated light generating arrangement, and at least one shutter and at least one iris that direct collimated and non-collimated light at the workpiece to form the orifice. The apparatus is configured such that the orifice has a surface roughness of between approximately 0.05 micron and approximately 0.13 micron and an orifice coefficient of greater than approximately 0.6.

Abstract translation: 一种用于在工件的孔中形成倒角的方法和装置。 孔口具有在工件的第一表面和第二表面之间延伸的轴线，其中第一和第二表面彼此平行。 倒角设置在第一表面和第二表面之间。 该方法包括在预定的第一时间间隔内以工件的非准直光源形成工作孔，并且在第一时间间隔内与第二时间间隔的准直光源形成倒角。 该装置至少包括准直光源和非准直光源，准直光滤光器和非准直光产生装置，以及至少一个快门和至少一个可在工件处直接准直和非准直光的光圈 以形成孔口。 该设备被配置为使得孔口具有介于约0.05微米和约0.13微米之间的表面粗糙度以及大于约0.6的孔口系数。

公开(公告)号：US06448700B1

公开(公告)日：2002-09-10

申请号：US09425410

申请日：1999-10-25

Applicant: Mool Chand Gupta ,  Ganapati Rao Myneni

Inventor： Mool Chand Gupta ,  Ganapati Rao Myneni

IPC: H01J102

CPC classification number: H01J1/3044 ,  H01J2201/30457

Abstract: The present invention provides a “solid” diamond, i.e. greater than 5&mgr; thick, electron emitter that has been “machined” using non-contact techniques to a point having a radius of less than about 100&mgr;, preferably below about 10&mgr; and most preferably between about 3 angstroms and about 3&mgr;. The solid diamond electron emitters of the present invention can perform, even at these small radii, as multi-point emitters depending upon the radius and roughness of the pointed tip and can be used in arrays to obtain relatively large area field emitters for applications where such larger field emissions are necessary. Production of the solid diamond emitters of the present invention is preferably accomplished using non-contact electron or ion beam machining techniques. Residual gas analyzers (RGA) and field emitter extractor gauge analyzers (FERGA) that use the solid diamond emitters are also described.

Abstract translation: 本发明提供了一种“固体”金刚石，即大于5μm厚的电子发射体，其已经使用非接触技术“加工”到半径小于约100μm，优选低于约10μm，最优选在约10μm之间的点 3埃，约3亩。 本发明的固体金刚石电子发射体即使在这些小半径处也可以作为多点发射体，取决于尖尖的半径和粗糙度，并且可以用于阵列以获得用于其中这样的应用的相对较大的面积场致发射体 较大的场排放是必要的。 本发明的固体金刚石发射体的制造优选使用非接触电子或离子束加工技术来实现。 还描述了使用固体金刚石发射体的残余气体分析仪（RGA）和场发射器提取仪分析仪（FERGA）。