公开(公告)号：US12115594B2

公开(公告)日：2024-10-15

申请号：US17183495

申请日：2021-02-24

申请人： FURUKAWA ELECTRIC CO., LTD.

发明人： Tomomichi Yasuoka ,  Takashi Kayahara ,  Ryosuke Nishii ,  Koji Kirikae ,  Keigo Matsunaga ,  Takashi Shigematsu

IPC分类号： B23K26/067 ,  B23K26/06 ,  B23K26/08 ,  B23K26/21 ,  B23K26/32 ,  B23K103/04 ,  B23K103/10

CPC分类号： B23K26/067 ,  B23K26/0648 ,  B23K26/08 ,  B23K26/21 ,  B23K26/32 ,  B23K2103/04 ,  B23K2103/10

摘要： A welding method includes: emitting laser beam toward a workpiece including a metal to melt and weld a part of the workpiece, the part being where the laser beam has been emitted to. Further, the laser beam includes a main power region and at least one auxiliary power region, a power of the main power region is larger than a power of each of the at least one auxiliary power region, and a ratio between the power of the main power region and the total of powers of the at least one auxiliary power region is in a range of 144:1 to 1:9.

公开(公告)号：US20240325199A1

公开(公告)日：2024-10-03

申请号：US18282768

申请日：2022-02-17

申请人： Carl Zeiss Meditec AG

发明人： Beate BOEHME ,  Mark BISCHOFF

IPC分类号： A61F9/008 ,  A61B18/20 ,  B23K26/06 ,  B23K26/067

CPC分类号： A61F9/008 ,  B23K26/0643 ,  B23K26/067 ,  A61B2018/20359 ,  A61B2018/208 ,  A61F2009/00897

摘要： The invention relates to a beam splitting device (10) for generating a plurality of laser output beams (90-93) from one laser input beam (60), wherein: the beam splitting device (10) has a first beam multiplier element (20) for generating two intermediate beams (75, 76) from the laser input beam (60); the first beam multiplier element (20) has a first polarising beam splitter (22, 42), a second polarising beam splitter (24, 44) and at least one first deflection element (26, 46) for deflecting an intermediate beam (76) by a specified angle: the beam splitting device (10) is designed in such a way that, when the laser input beam (60) is irradiated onto the first polarising beam splitter (22, 42) of the first beam multiplier element (20), the laser input beam (60) is split into the first intermediate beam (75) and the second intermediate beam (76) by means of the first polarising beam splitter (22, 42) of the first beam multiplier element (20); the two intermediate beams (75, 76) span the x-y plane, the second intermediate beam (76) is deflected by the first deflection element (26) by a specified angle, in particular approximately 90° or approximately 180°, the first intermediate beam (75) and the second intermediate beam (76) are irradiated onto the second polarising beam splitter (24) of the first beam multiplier element (20) in such a way that the first intermediate beam (75) and the second intermediate beam (76) radiate away from the second polarising beam splitter (24) of the first beam multiplier element (20) at a substantially parallel mutual offset or with a specified angular difference, in particular of less than 3 mrad, preferably less than 1.4 mrad, particularly preferably less than 0.6 mrad.

公开(公告)号：US12090576B2

公开(公告)日：2024-09-17

申请号：US17329251

申请日：2021-05-25

申请人： Chongqing Institute of East China Normal University ,  SHANGHAI LANGYAN OPTOELECTRONICS TECHNOLOGY CO., LTD. ,  East China Normal University

发明人： Heping Zeng ,  Chuan Yang ,  Mengyun Hu ,  Shuai Yuan

IPC分类号： B23K26/55 ,  B01L3/00 ,  B23K26/067 ,  B23K26/361 ,  B23K26/70

CPC分类号： B23K26/55 ,  B01L3/502707 ,  B23K26/067 ,  B23K26/361 ,  B23K26/702

摘要： A method for processing a micro-channel of a micro-fluidic chip using multi-focus ultrafast laser, in which an array-type multi-focus femtosecond laser is used to perform fractional ablation on the micro-fluidic chip, and then pulse laser is used to perform secondary ablation on the micro-fluidic chip. Ultrasonic-assisted hydrofluoric acid etching is performed on the micro-fluidic chip after ablation to obtain a true three-dimensional micro-channel on the micro-fluidic chip. A device for processing a micro-channel of a micro-fluidic chip using multi-focus ultrafast laser is also provided.

公开(公告)号：US20240293897A1

公开(公告)日：2024-09-05

申请号：US18663649

申请日：2024-05-14

申请人： ELECTRO SCIENTIFIC INDUSTRIES, INC.

发明人： Patrick RIECHEL ,  Mark UNRATH ,  Jake ROBERTS ,  Joseph HASTY

IPC分类号： B23K26/70 ,  B23K26/03 ,  B23K26/067 ,  B23K26/08 ,  B23K26/082 ,  B65H18/10 ,  G02B27/10 ,  G02F1/33

CPC分类号： B23K26/705 ,  B23K26/032 ,  B23K26/067 ,  B23K26/082 ,  B23K26/083 ,  B65H18/103 ,  G02B27/108 ,  G02F1/33

摘要： Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to use of beam characterization tools to facilitate adaptive processing, process control and other desirable features. Other embodiments relate to laser power sensors incorporating integrating spheres. Still other embodiments relate to workpiece handling systems capable of simultaneously providing different workpieces to a common laser-processing apparatus. A great number of other embodiments and arrangements are also detailed.

公开(公告)号：US20240238895A1

公开(公告)日：2024-07-18

申请号：US18413229

申请日：2024-01-16

申请人： DISCO CORPORATION

发明人： Toshiyuki KITAMURA ,  Keiji NOMARU

IPC分类号： B23K26/06 ,  B23K26/067 ,  H01L21/67

CPC分类号： B23K26/0652 ,  B23K26/0665 ,  B23K26/067 ,  H01L21/67092

摘要： A laser oscillating device includes a signal laser oscillator for emitting a laser beam, a laser medium for amplifying the laser beam emitted from the signal laser oscillator, an exciting light introducing unit for introducing an exciting light into the laser medium, and a photonic crystal fiber for shaping the laser beam.

公开(公告)号：US20240189944A1

公开(公告)日：2024-06-13

申请号：US18286292

申请日：2022-04-14

申请人： AKZENTA PANEELE + PROFILE GMBH

发明人： Hans-Jürgen HANNIG ,  Felix HÜLLENKREMER ,  Paul WEYER

IPC分类号： B23K26/352 ,  B23K26/067

CPC分类号： B23K26/355 ,  B23K26/067

摘要： The present disclosure relates to a method for producing a decorative panel, comprising the following method steps: a) applying a decorative layer to a substrate, b) optionally applying an intermediate layer to the decorative layer, c) applying a cover layer to the decorative layer or the intermediate layer, and d) structuring at least one layer to be structured, said layer to be structured being selected from the decorative layer, the intermediate layer and the cover layer, characterised in that method step d) comprises the following method steps: d1) generating a laser beam; d2) dividing the laser beam into a matrix of a plurality of sub-beams; d3) guiding the matrix of sub-beams into a modulator for selective inactivation of individual sub-beams; d4) guiding the matrix of sub-beams from the modulator into an optical scanner, the matrix of sub-beams downstream of the modulator comprising all the sub-beams guided into the modulator or a reduced number of sub-beams; and d5) guiding the matrix of sub-beams from the scanner onto the layer to be structured; d6) the layer to be structured being negatively structured under the action of the sub-beams in order to generate a three-dimensional structure.

公开(公告)号：US20240165737A1

公开(公告)日：2024-05-23

申请号：US18422033

申请日：2024-01-25

申请人： TRUMPF Laser- und Systemtechnik GmbH

发明人： Daniel Flamm ,  Myriam Kaiser ,  Jonas Kleiner

IPC分类号： B23K26/067 ,  B23K26/06

CPC分类号： B23K26/067 ,  B23K26/0648

摘要： A method for laser processing a workpiece is provided. The workpiece includes a material transparent to a laser beam of the laser processing. The method includes splitting an input laser beam by using a beam splitter into a plurality of partial beams. The splitting of the input laser beam is performed by application of phases to a beam cross section of the input laser beam. The method further includes focusing the plurality of partial beams decoupled from the beam splitter by using a focusing optical unit. Multiple focus elements are formed by the focusing of the plurality of partial beams. The method further includes subjecting the material of the workpiece to at least a subset of the multiple focus elements. The application of the phases is performed in such a way that at least two of the multiple focus elements have different intensities.

公开(公告)号：US11975405B2

公开(公告)日：2024-05-07

申请号：US16765812

申请日：2018-11-20

申请人： IPG PHOTONICS CORPORATION

发明人： Pancho Tzankov ,  Jonathan Ehrmann ,  Jeffrey Kmetec ,  Alexey Avdokhin ,  Andrei Babushkin

IPC分类号： B23K26/06 ,  B23K26/067 ,  B23K26/38 ,  G02B27/30 ,  G02F1/35 ,  H01S3/08 ,  H01S3/067

CPC分类号： B23K26/0648 ,  B23K26/067 ,  B23K26/38 ,  G02B27/30 ,  G02F1/3501 ,  G02F1/353 ,  H01S3/08086 ,  G02F1/3503 ,  H01S3/067

摘要： A multiple wavelength laser processing system is configured with a multiple wavelength laser source for generating a multiple wavelength coaxial laser processing beam. The laser processing system further includes a multiple wavelength optical system to deliver the coaxial laser processing beam to a laser-material interaction zone on the surface of a workpiece such that each of the a first and a second laser wavelengths in the processing beam impinge at least a portion of the interaction zone as respective first and second concentric laser spots. The multiple wavelength optical system includes a multiple wavelength beam collimator, a configurable chromatic optic, and a laser processing focus lens, wherein the configurable chromatic optic provides an adjustment to the relative focus distance of the first and second laser wavelengths.

公开(公告)号：US11938570B2

公开(公告)日：2024-03-26

申请号：US17024871

申请日：2020-09-18

申请人： DISCO CORPORATION

发明人： Keiji Nomaru

IPC分类号： B23K26/53 ,  B23B31/30 ,  B23K26/00 ,  B23K26/03 ,  B23K26/04 ,  B23K26/06 ,  B23K26/064 ,  B23K26/067 ,  B23K26/08 ,  B23K26/38 ,  B23K26/402 ,  B23K37/04 ,  B23K101/40

CPC分类号： B23K26/53 ,  B23B31/307 ,  B23K26/0006 ,  B23K26/032 ,  B23K26/04 ,  B23K26/064 ,  B23K26/0648 ,  B23K26/067 ,  B23K26/0853 ,  B23K26/0876 ,  B23K26/38 ,  B23K26/402 ,  B23K37/0408 ,  B23K2101/40

摘要： A laser beam applying unit of a laser processing apparatus includes a beam splitter disposed on a first optical path connecting a laser oscillator and a condenser, a wide band light source disposed on a second optical path branched by the beam splitter, a spectroscope that is disposed between the wide band light source and the beam splitter and that branches the laser beam from the second optical path to a third optical path, and a Z position detection unit that is disposed on the third optical path branched by the spectroscope and that detects the position in a Z-axis direction of a workpiece according to an intensity of light corresponding to the wavelength of return light that is generated when the light of the wide band light source is condensed by the condenser and is reflected by the workpiece held by a chuck table.

公开(公告)号：US11938561B2

公开(公告)日：2024-03-26

申请号：US17232412

申请日：2021-04-16

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： Izuru Nakai ,  Takaaki Kassai ,  Takayuki Yoshida

IPC分类号： B23K26/0622 ,  B23K26/064 ,  B23K26/067

CPC分类号： B23K26/0622 ,  B23K26/064 ,  B23K26/067

摘要： A laser processing apparatus includes a light source configured to emit laser light; a power supply configured to supply a current to the light source; a deflection unit on an optical path of the laser light and including an optical element configured to change an amount of transmission of the laser light to deflect at least a part of the laser light; an optical separation unit on the optical path of the laser light and being configured to shield higher-order light included in the laser light and deflected by the optical element in the deflection unit, and transmit zero-order light that is included in the laser light and passes through the deflection unit; and a signal synchronization unit configured to control the power supply to selectively turn the current on or off in synchronization with a timing at which the higher-order light is deflected by the optical element.