公开(公告)号：US06516238B1

公开(公告)日：2003-02-04

申请号：US09576418

申请日：2000-05-22

Applicant: Jin-Sun Kim ,  Moon-Gi Kim ,  Chang-Kee Hong ,  Tae-Ho Lee ,  Won-Soo Cho ,  Yung-Hwan Chae ,  Woo-Kyu Lee ,  Jong-Mo Ahn ,  Kwang-Ho Lee

Inventor： Jin-Sun Kim ,  Moon-Gi Kim ,  Chang-Kee Hong ,  Tae-Ho Lee ,  Won-Soo Cho ,  Yung-Hwan Chae ,  Woo-Kyu Lee ,  Jong-Mo Ahn ,  Kwang-Ho Lee

IPC: G06F1900

CPC classification number: G05B19/41895 ,  G05B2219/31002 ,  G05B2219/31013 ,  G05B2219/31086 ,  G05B2219/32277 ,  Y02P90/18 ,  Y02P90/285 ,  Y02P90/60

Abstract: A method for transporting semiconductor wafers in semiconductor factory automation system, includes the steps of: a) processing a lot of semiconductor wafers to be contained in a semiconductor wafer cassette in a process equipment; b) sending a cassette transportation request from the process equipment to a cell management server when the process equipment has processed the lot of semiconductor wafers; c) generating a transportation instruction in response to the cassette transportation request; and d) if the semiconductor wafer cassette is transported from the process equipment to a stocker by an automatic guide vehicle (AGV), simultaneously activating the AGV and the stocker by simultaneously sending the transportation instruction to the AGV and the stocker. The method in accordance with the present invention can reduce a time taken to transport the semiconductor wafers.

Abstract translation: 一种在半导体工厂自动化系统中传送半导体晶片的方法，包括以下步骤：a）处理要包含在处理设备中的半导体晶片盒中的许多半导体晶片; b）当处理设备处理了许多半导体晶片时，将处理设备的盒式磁带运送请求发送到单元管理服务器; c）响应于盒运输请求产生运输指令; 以及d）如果通过自动导向车辆（AGV）将半导体晶片盒从处理设备运送到储盘器，则同时通过向AGV和储料器发送运输指令来激活AGV和储料器。 根据本发明的方法可以减少运输半导体晶片所花费的时间。

公开(公告)号：US07261947B2

公开(公告)日：2007-08-28

申请号：US10727749

申请日：2003-12-04

Applicant: David P. Reichwein ,  Moon Gi Kim ,  Fang Qiao

Inventor： David P. Reichwein ,  Moon Gi Kim ,  Fang Qiao

IPC: B32B5/06

CPC classification number: B32B21/13 ,  B32B3/02 ,  B32B3/06 ,  B32B21/14 ,  B32B2307/734 ,  B32B2419/04 ,  E04F15/04 ,  E04F15/046 ,  E04F2201/0115 ,  E04F2201/0153 ,  E04F2201/07 ,  Y10T428/195 ,  Y10T428/24777 ,  Y10T428/2495 ,  Y10T428/31957 ,  Y10T428/3196 ,  Y10T428/31982 ,  Y10T428/31989

Abstract: A plywood laminate having dimensional stability and resistance to warping and delamination is formed from a plurality of higher quality plies and a plurality of lower quality plies. The higher quality plies may be of hardwood and the lower quality plies may be of softwood or lower quality hardwoods, or the higher quality plies may have a veneer grade of better than ANSI/HPVA HP-1-2000 veneer grade C and the lower quality plies may have a veneer grade of no greater than ANSI/HPVA HP-1-2000 veneer grade C. The exposed plies are of the higher quality. In most embodiments, at least two adjacent interior plies are of the lower quality. In those embodiments having a tongue and groove or click-lock edge configuration, the tongue comprises portions of at least two plies and at least one of the plies is a higher quality ply.

Abstract translation: 由多个较高质量的层和多个较低质量的层形成具有尺寸稳定性和抗翘曲和分层的胶合板层压板。 较高质量的层可以是硬木，较低质量的层可以是软木或较低质量的硬木，或者较高质量的层可以具有优于ANSI / HPVA HP-1-2000单板C级的单板级别，并且较低质量 层可以具有不大于ANSI / HPVA HP-1-2000单板级C的单板级别。暴露的层具有更高的质量。 在大多数实施例中，至少两个相邻的内层具有较低质量。 在具有榫舌和凹槽或点击锁定边缘构造的那些实施例中，舌部包括至少两个层的部分，并且至少一个层是更高质量的层。