摘要:
An organic light emitting display (OLED) includes a substrate, first and second driving units positioned on the substrate, a first light emitting diode (LED) connected with the first driving unit and including a first organic light emitting layer and a second emitting diode electrically connected with the second driving unit and including a second organic light emitting layer. The second emitting diode is positioned on the first emitting diode.
摘要:
Provided is an organic light emitting device comprising: a substrate; and a plurality of sub-pixels, each sub-pixel comprising a thin film transistor formed on the substrate; a planarization layer formed on the thin film transistor, and having a contact hole exposing a portion of a source electrode or a drain electrode of the thin film transistor; a contact electrode formed on the planarization layer, and electrically connected with the source electrode or the drain electrode of the thin film transistor through the contact hole; a first electrode spaced apart from the contact electrode, the first electrode formed on the planarization layer; an insulating layer formed on the first electrode and the contact electrode, the insulating layer comprising a first opening exposing a portion of the first electrode and a second opening exposing a portion of the contact electrode; a light emitting layer formed in the first opening; a second electrode formed on the light emitting layer and electrically connected with a portion of the contact electrode through the second opening.
摘要:
An organic light emitting display (OLED) includes a substrate, first and second driving units positioned on the substrate, a first light emitting diode (LED) connected with the first driving unit and including a first organic light emitting layer and a second emitting diode electrically connected with the second driving unit and including a second organic light emitting layer. The second emitting diode is positioned on the first emitting diode.
摘要:
Provided is an organic light emitting device comprising: a substrate; and a plurality of sub-pixels, each sub-pixel comprising a thin film transistor formed on the substrate; a planarization layer formed on the thin film transistor, and having a contact hole exposing a portion of a source electrode or a drain electrode of the thin film transistor; a contact electrode formed on the planarization layer, and electrically connected with the source electrode or the drain electrode of the thin film transistor through the contact hole; a first electrode spaced apart from the contact electrode, the first electrode formed on the planarization layer; an insulating layer formed on the first electrode and the contact electrode, the insulating layer comprising a first opening exposing a portion of the first electrode and a second opening exposing a portion of the contact electrode; a light emitting layer formed in the first opening; a second electrode formed on the light emitting layer and electrically connected with a portion of the contact electrode through the second opening.
摘要:
Disclosed is a dry cleaning apparatus and method using cluster for cleaning a surface of a specimen such as semiconductor wafer. The cleaning method first forms a neutral cluster no having polarity by passing a cleaning gas such as argon, nitrogen, or carbon dioxide gas through a sand glass-shaped nozzle. The formed neutral cluster is injected at an acute angle with respect to a surface of the specimen, thereby removing particles or organic remnants attached on the surface of the specimen without damaging the surface of the specimen.
摘要:
A temperature-humidity controller for a semiconductor equipment comprises a housing; an inlet pipe for introducing processing air, which has a discharging portion for flowing the air into an inner portion of the housing; a water supplying means for supplying water into the inner portion of the housing so as to contact with the processing air from the discharging portion of the inlet pipe thereby simultaneously performing dehumidifying and humidifying processes; a cooling means for cooling the water at a dew point; a heating means for heating the air at a desired temperature, which is dehumidified and humidified by the water supplying means; an outlet pipe for supplying the heated air to the semiconductor equipment.