Abstract:
Disclosed is a method for fabrication of a liquid crystal display with improved optical transmission, which includes sequentially forming a first oxide film, a silicon film, and a second oxide film on a semiconductor substrate, selectively etching the silicon film and the second oxide film to expose the first oxide film, forming a oxynitride film on at least the silicon film, forming a polysilicon layer over the oxynitride film, selectively etching the polysilicon layer to form a top electrode, forming an insulating film on and/or over the substrate, including the top electrode, and forming metal wirings on outer regions of the top electrode.
Abstract:
An LDMOS device includes a gate which is formed on and/over over a substrate; a source and a drain which are arranged to be separated from each other on both sides of the substrate with the gate interposed therebetween; and a field oxide film formed to have a step between the gate and the drain. The LDMOS device further includes a drift region formed of first conduction type impurity ions between the gate and the drain in the substrate; and at least one internal field ring formed in the drift region by selectively implanting a second conduction type impurity in accordance with the step of the field oxide film.
Abstract:
An LDMOS device includes a gate which is formed on and/over over a substrate; a source and a drain which are arranged to be separated from each other on both sides of the substrate with the gate interposed therebetween; and a field oxide film formed to have a step between the gate and the drain. The LDMOS device further includes a drift region formed of first conduction type impurity ions between the gate and the drain in the substrate; and at least one internal field ring formed in the drift region by selectively implanting a second conduction type impurity in accordance with the step of the field oxide film.
Abstract:
Disclosed is a method for fabrication of a liquid crystal display with improved optical transmission, which includes sequentially forming a first oxide film, a silicon film, and a second oxide film on a semiconductor substrate, selectively etching the silicon film and the second oxide film to expose the first oxide film, forming a oxynitride film on at least the silicon film, forming a polysilicon layer over the oxynitride film, selectively etching the polysilicon layer to form a top electrode, forming an insulating film on and/or over the substrate, including the top electrode, and forming metal wirings on outer regions of the top electrode.