公开(公告)号：US06747392B1

公开(公告)日：2004-06-08

申请号：US09656106

申请日：2000-09-06

申请人： Masaya Wajima ,  Naoshi Bamoto

发明人： Masaya Wajima ,  Naoshi Bamoto

IPC分类号： H01L4104

CPC分类号： H03H9/177 ,  H03H9/02133 ,  H03H9/1014 ,  H03H9/1035 ,  H03H9/56 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/10083 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： A chip electronic component capable of being mounted with high density while preventing separation of bonded portions caused by solder fillets without requiring a case member having a complicated structure is provided at a low cost. The chip electronic component includes an electronic component element board including a circuit that defines an electronic component therein and having a pair of side surfaces and a lower surface, and a plurality of external electrodes extending over at least one of the side surface and the lower surface of the electronic component element and being electrically connected to the circuit provided therein. The electrode portion provided on the lower surface of the monolithic body as an electronic component element of each external electrode is provided with narrow portions and wide portions provided thereon, and the narrow portion continues to the external electrode portion provided on the side surface thereof.

摘要翻译： 以低成本提供能够以高密度安装的芯片电子部件，同时防止由焊接圆角引起的接合部分的分离而不需要具有复杂结构的壳体部件。 芯片电子部件包括电子元件基板，其包括在其中限定电子部件并具有一对侧表面和下表面的电路，以及多个外部电极，其在侧表面和下表面中的至少一个 并且电连接到设置在其中的电路。 设置在作为每个外部电极的电子元件的单片体的下表面上的电极部分设置有设置在其上的窄部分和宽部分，并且窄部分继续到设置在其侧表面上的外部电极部分。