公开(公告)号：US5091692A

公开(公告)日：1992-02-25

申请号：US636094

申请日：1990-12-31

申请人： Akira Ohno ,  Tetsuo Ohtsuka ,  Naotaka Matsumoto

发明人： Akira Ohno ,  Tetsuo Ohtsuka ,  Naotaka Matsumoto

IPC分类号： G01R31/26 ,  G01R1/073 ,  H01L21/66

CPC分类号： G01R1/07314

摘要： A probing test device is provided for contacting a plurality of probes with pads on a semiconductor wafer to be tested and supplying a test signal to a tester comprising a CPU for previously storing, as a reference image, the image signal obtained when the probes are correctly contacted with the electrode pads. The probing test device includes a mechanism for positioning these probes to be contacted with the pads on the wafer by moving the tested wafer relative to the probes, an optical system for image sensing those portions at which the probes are contacted with the pads, and a mechanism for positioning the optical system near to the pads by moving the optical system relative to the wafer. The CPU performs a comparison of the reference image signal with that image signal sensed for those portions at which the probes are contacted with the pads. which is picked up by the optical system to confirm whether or not both of these images coincide with each other, wherein the wafer is moved relative to the probes by the wafer positioning mechanism responsive to the result confirmed by the CPU.

摘要翻译： 提供探测测试装置，用于使多个探针与要测试的半导体晶片上的焊盘接触，并将测试信号提供给包括CPU的测试器，所述测试器包括用于预先存储当探针正确地获得的图像信号作为参考图像的CPU 与电极焊盘接触。 探测测试装置包括用于通过相对于探针移动测试晶片来定位这些探针以与晶片上的焊盘接触的机构，用于图像感测探针与焊盘接触的部分的光学系统，以及 通过相对于晶片移动光学系统来将光学系统定位在靠近焊盘的机构。 CPU对参考图像信号与探针与垫接触的那些部分检测到的图像信号进行比较。 其被光学系统拾取以确认这两个图像是否彼此一致，其中晶片定位机构响应于由CPU确认的结果相对于探针移动晶片。