公开(公告)号：US20080153202A1

公开(公告)日：2008-06-26

申请号：US11901798

申请日：2007-09-19

申请人： Naruhiko Uemura ,  Takashi Mori ,  Hirofumi Matsumoto

发明人： Naruhiko Uemura ,  Takashi Mori ,  Hirofumi Matsumoto

IPC分类号： H01L21/00

CPC分类号： H01L24/29 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/16225 ,  H01L2224/29019 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2224/29101 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/0401

摘要： Problem In a flip chip mounting method by a no-flow underfill, when a resin highly filled with the filler is pre-coated on a substrate, a bump is brought into reliable contact with a pad electrode without sandwich the filler between the bump of a semiconductor and the pad electrode on the substrate to make it possible to reliably perform reflow soldering.Solving Means In a flip chip mounting method by a no-flow underfill in which resin is pre-coated on a substrate 52, and, thereafter, a semiconductor 50 with bump is mounted on the substrate 52 to join a pad electrode 53 on the substrate 52 to the bump 51, a resin 54a highly filled with the filler 55 is applied to a region except for the pad electrode 53 on the substrate 52, a resin 54b being free from the filler is applied to a pad electrode 53 portion on the substrate 52, and, thereafter, the semiconductor 50 with bump is mounted at a predetermined position on the substrate 52.

摘要翻译： 问题在通过无流动底部填充物的倒装芯片安装方法中，当将高填充有填料的树脂预先涂覆在基板上时，使凸块与焊盘电极可靠地接触，而不会将填料夹在 半导体和衬底电极，使得可以可靠地进行回流焊接。 解决方法在通过在基板52上预涂覆有树脂的无流动底部填充物的倒装芯片安装方法中，然后将具有凸块的半导体50安装在基板52上以将衬底电极53接合到基板 如图52所示，在凸块51上，将高填充有填料55的树脂54施加到基板52上的焊盘电极53以外的区域，将不含填料的树脂54b施加到焊盘电极53的部分上 衬底52，此后，具有凸块的半导体50被安装在衬底52上的预定位置。

公开(公告)号：US07795075B2

公开(公告)日：2010-09-14

申请号：US11901169

申请日：2007-09-14

申请人： Naruhiko Uemura ,  Akihiro Nakamura ,  Takashi Mori ,  Hirofumi Matsumoto

发明人： Naruhiko Uemura ,  Akihiro Nakamura ,  Takashi Mori ,  Hirofumi Matsumoto

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L23/295 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/757 ,  H01L2224/81208 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  Y10T29/53174 ,  H01L2224/0401

摘要： In a flip shop mounting method by no-flow underfill in which resin 54 is pre-coated on a substrate 52, and a semiconductor 50 with bump is mounted on the substrate 52 to join a pad electrode 53 on the substrate 52 to the bump 51, the substrate 52 is placed on an upper surface of a base 11 of a reflow jig 10, the resin 54 highly filled with filler 55 is applied onto the substrate 52, the semiconductor 50 with bump is mounted at a predetermined position over the substrate 52, a press plate 21 is placed on an upper portion of the semiconductor 50, a spacer 13 is interposed between a lower surface of the press plate 21 and an upper surface of the base 11 to regulate an amount of press force of the press plate 21, and horizontal movement of the press plate 21 is regulated by positioning guide pins 15 on the upper surface of the base 11.

摘要翻译： 在通过未流动的底部填充物的翻转车间安装方法中，树脂54预涂在基底52上，并且具有凸起的半导体50安装在基底52上，以将衬底52上的焊盘电极53接合到凸块51 ，将基板52放置在回流夹具10的基部11的上表面上，将高填充有填料55的树脂54施加到基板52上，将具有凸块的半导体50安装在基板52上的预定位置 在半导体50的上部配置有压板21，在压板21的下表面与基座11的上表面之间插入间隔件13，以调节压板21的按压力 通过在基座11的上表面上定位导销15来调节压板21的水平移动。

公开(公告)号：US20080153201A1

公开(公告)日：2008-06-26

申请号：US11901169

申请日：2007-09-14

申请人： Naruhiko Uemura ,  Akihiro Nakamura ,  Takashi Mori ,  Hirofumi Matsumoto

发明人： Naruhiko Uemura ,  Akihiro Nakamura ,  Takashi Mori ,  Hirofumi Matsumoto

IPC分类号： H01L21/60

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L23/295 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/757 ,  H01L2224/81208 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  Y10T29/53174 ,  H01L2224/0401

摘要： ProblemIn a flip chip mounting method by a no-flow underfill, when a resin highly filled with the filler is pre-coated on a substrate to mount a semiconductor, a bump is brought into reliable contact with a pad electrode of a substrate to make it possible to reliably perform reflow soldering.Solving MeansIn a flip chip mounting method by a no-flow underfill in which a resin 54 is pre-coated on a substrate 52, and, thereafter, a semiconductor 50 with bump is mounted on the substrate 52 to join the pad electrode 53 of the substrate 52 to a bump 51, the substrate 52 is placed on an upper surface of a base 11 of a reflow jig 10, the resin 54 highly filled with the filler 55 is applied onto the substrate 52, the semiconductor 50 with bump is mounted at a predetermined position of the substrate 52, a press plate 21 larger than an overall size of a product of the substrate 52 is placed on an upper portion of the semiconductor 50, a spacer 13 is interposed between a lower surface of the press plate 21 and an upper surface of the base 11 to regulate an amount of press force of the press plate 21, and horizontal movement of the press plate 21 is regulated by positioning guide pins 15 upright standing on the upper surface of the base 11.

摘要翻译： 问题在通过无流动底部填充物的倒装芯片安装方法中，当将高填充有填料的树脂预先涂覆在基板上以安装半导体时，使凸块与基板的焊盘电极可靠地接触， 可靠地进行回流焊接。 解决方法在通过在基板52上预先涂布树脂54的无流动底部填充物的倒装芯片安装方法，然后将具有凸块的半导体50安装在基板52上，以将基板52的焊盘电极53 将基板52连接到凸块51，将基板52放置在回流夹具10的基部11的上表面上，将高填充有填料55的树脂54施加到基板52上，安装具有凸块的半导体50 在基板52的预定位置处，将比基板52的整体尺寸大的压板21放置在半导体50的上部，隔板13插入在压板21的下表面之间 和基座11的上表面，以调节压板21的按压力，并且压板21的水平运动通过直立站立在基座11的上表面上的定位导销15来调节。

公开(公告)号：US07732255B2

公开(公告)日：2010-06-08

申请号：US11901798

申请日：2007-09-19

申请人： Naruhiko Uemura ,  Takashi Mori ,  Hirofumi Matsumoto

发明人： Naruhiko Uemura ,  Takashi Mori ,  Hirofumi Matsumoto

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/29 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/16225 ,  H01L2224/29019 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2224/29101 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/0401

摘要： In a flip shop mounting method by a no-flow underfill in which resin is pre-coated on a substrate 52, and, thereafter, a semiconductor 50 with bump is mounted on the substrate 52 to join a pad electrode 53 on the substrate 52 to the bump 51, a resin 54a highly filed with the filler 55 is applied to a region except for the pad electrode 53 on the substrate 52, a resin 54b being free from the filler is applied to a pad electrode 53 portion on the substrate 52, and, thereafter, the semiconductor 50 with bump is mounted at a predetermined position on the substrate 52.

摘要翻译： 在通过预先涂覆在基板52上的树脂的无流动底部填充物的翻转车间安装方法中，然后将具有凸块的半导体50安装在基板52上以将基板52上的焊盘电极53接合到 将突起51，高填充填料55的树脂54a施加到基板52上的焊盘电极53以外的区域，将不含填料的树脂54b施加到基板52上的焊盘电极53部分， 此后，具有凸块的半导体50被安装在基板52上的预定位置。