Methods for selective deposition to improve selectivity
    1.
    发明申请
    Methods for selective deposition to improve selectivity 审中-公开
    用于选择性沉积以提高选择性的方法

    公开(公告)号:US20060057809A1

    公开(公告)日:2006-03-16

    申请号:US11270933

    申请日:2005-11-10

    CPC classification number: H01L29/66636 H01L21/823418

    Abstract: Methods and associated apparatus of forming a microelectronic structure are described. Those methods comprise providing a substrate comprising a region of higher active area density comprising source and drain recesses and a region of lower active area density comprising source and drain recesses, wherein the region of lower active area density further comprises dummy recesses, and selectively depositing a silicon alloy layer in the source, drain and dummy recesses to enhance the selectivity and uniformity of the silicon alloy deposition.

    Abstract translation: 描述形成微电子结构的方法和相关装置。 那些方法包括提供一种衬底,其包括具有源极和漏极凹部的较高有源面积密度的区域和包括源极和漏极凹陷的较低有源面积密度的区域,其中较低有源面积密度的区域还包括虚设凹槽,并且选择性地沉积 源极,漏极和虚拟凹槽中的硅合金层,以增强硅合金沉积的选择性和均匀性。

    Methods for selective deposition to improve selectivity
    3.
    发明申请
    Methods for selective deposition to improve selectivity 有权
    用于选择性沉积以提高选择性的方法

    公开(公告)号:US20050230760A1

    公开(公告)日:2005-10-20

    申请号:US11152266

    申请日:2005-06-13

    CPC classification number: H01L29/66636 H01L21/823418

    Abstract: Methods and associated apparatus of forming a microelectronic structure are described. Those methods comprise providing a substrate comprising a region of higher active area density comprising source and drain recesses and a region of lower active area density comprising source and drain recesses, wherein the region of lower active area density further comprises dummy recesses, and selectively depositing a silicon alloy layer in the source, drain and dummy recesses to enhance the selectivity and uniformity of the silicon alloy deposition.

    Abstract translation: 描述形成微电子结构的方法和相关装置。 那些方法包括提供一种衬底,其包括具有源极和漏极凹部的较高有源面积密度的区域和包括源极和漏极凹陷的较低有源面积密度的区域,其中较低有源面积密度的区域还包括虚设凹槽,并且选择性地沉积 源极,漏极和虚拟凹槽中的硅合金层,以增强硅合金沉积的选择性和均匀性。

    Selective deposition to improve selectivity and structures formed thereby
    4.
    发明授权
    Selective deposition to improve selectivity and structures formed thereby 有权
    选择性沉积以改善由此形成的选择性和结构

    公开(公告)号:US07358547B2

    公开(公告)日:2008-04-15

    申请号:US11152266

    申请日:2005-06-13

    CPC classification number: H01L29/66636 H01L21/823418

    Abstract: Methods and associated apparatus of forming a microelectronic structure are described. Those methods comprise providing a substrate comprising a region of higher active area density comprising source and drain recesses and a region of lower active area density comprising source and drain recesses, wherein the region of lower active area density further comprises dummy recesses, and selectively depositing a silicon alloy layer in the source, drain and dummy recesses to enhance the selectivity and uniformity of the silicon alloy deposition.

    Abstract translation: 描述形成微电子结构的方法和相关装置。 那些方法包括提供一种衬底,其包括具有源极和漏极凹部的较高有源面积密度的区域和包括源极和漏极凹陷的较低有源面积密度的区域,其中较低有源面积密度的区域还包括虚设凹槽,并且选择性地沉积 源极,漏极和虚拟凹槽中的硅合金层,以增强硅合金沉积的选择性和均匀性。

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