公开(公告)号：US07808013B2

公开(公告)日：2010-10-05

申请号：US11590480

申请日：2006-10-31

申请人： Nicholas W. Mendendorp, Jr. ,  Peter Andrews

发明人： Nicholas W. Mendendorp, Jr. ,  Peter Andrews

IPC分类号： H01L33/00 ,  H01L23/495

CPC分类号： H05K1/0206 ,  H01L33/62 ,  H01L33/64 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/1815 ,  H01L2924/3011 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting device (LED) assembly may include an electrically insulating substrate and a thermally conductive layer on a surface of the insulating substrate. A light emitting device may be on the thermally conductive layer so that the thermally conductive layer is between the light emitting device and the electrically insulating substrate. Moreover, the thermally conductive layer may extend beyond an edge of the light emitting device in at least one direction a distance greater than half of a width of the light emitting device.

摘要翻译： 发光器件（LED）组件可以包括在绝缘衬底的表面上的电绝缘衬底和导热层。 发光器件可以在导热层上，使得导热层位于发光器件和电绝缘衬底之间。 此外，导热层可以在比发光器件的宽度的一半的距离的至少一个方向上延伸超过发光器件的边缘。