Semiconductor inspection apparatus and method of specifying attributes of dies on wafer in semiconductor inspection apparatus
    1.
    发明授权
    Semiconductor inspection apparatus and method of specifying attributes of dies on wafer in semiconductor inspection apparatus 失效
    半导体检查装置及半导体检查装置中的晶片上的金属模具的属性的方法

    公开(公告)号:US06362013B1

    公开(公告)日:2002-03-26

    申请号:US09557846

    申请日:2000-04-26

    IPC分类号: H01L2166

    摘要: The data of a plurality of attributes of dies on a semiconductor wafer under a parametric test can be managed in a unified manner, and edited and displayed on a real-time basis with one tool. A semiconductor inspection apparatus has a memory for expanding and storing attribute data of dies as data of at least three values for selecting and specifying attributes of dies on a wafer from a plurality of attributes, and a display controller for allowing an operator to select any of the attributes of dies within one displayed image, and reflecting selected attributes immediately as die characteristics in the displayed image. A method of specifying attributes of dies on a wafer in such a semiconductor inspection apparatus is also disclosed.

    摘要翻译: 在参数测试下半导体晶片上的多个管芯属性的数据可以统一管理,并用一个工具实时地进行编辑和显示。 半导体检查装置具有用于扩展和存储管芯的属性数据的存储器,用于从多个属性中选择和指定晶片上的管芯属性的至少三个值的数据,以及显示控制器,用于允许操作者选择任何 在一个显示的图像中的模具的属性,并且立即反映所选择的属性作为显示图像中的裸片特征。 还公开了一种在这种半导体检查装置中指定晶片上的管芯属性的方法。