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公开(公告)号：US20100018951A1
公开(公告)日：2010-01-28
申请号：US12555481
申请日：2009-09-08
CPC分类号： B05B1/00 , B08B3/08 , B08B7/00 , B08B2230/01 , G03F7/423 , H01L21/02063 , H01L21/02071 , H01L21/30604 , H01L21/31105 , H01L21/31133 , H01L21/6708
摘要： A method of removing materials, and preferably photoresist, from a substrate comprises dispensing a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors and having a water/sulfuric acid molar ratio of no greater than 5:1 onto an material coated substrate in an amount effective to substantially uniformly coat the material coated substrate. The substrate is preferably heated to a temperature of at least about 90° C., either before, during or after dispensing of the liquid sulfuric acid composition. After the substrate is at a temperature of at least about 90° C., the liquid sulfuric acid composition is exposed to water vapor in an amount effective to increase the temperature of the liquid sulfuric acid composition above the temperature of the liquid sulfuric acid composition prior to exposure to the water vapor. The substrate is then preferably rinsed to remove the material.
摘要翻译： 从衬底去除材料，优选光致抗蚀剂的方法包括将包含硫酸和/或其干燥物质和前体并且具有不大于5:1的水/硫酸摩尔比的液体硫酸组合物分配到材料 涂覆的基材的量可以有效地基本上均匀地涂覆涂覆有材料的基材。 优选在分配液体硫酸组合物之前，期间或之后将基材加热至至少约90℃的温度。 在基板处于至少约90℃的温度之后，将液体硫酸组合物暴露于水蒸气中，其量可以有效地将液体硫酸组合物的温度升高到高于液体硫酸组合物的温度之前 暴露于水蒸汽。 然后优选冲洗基材以除去材料。
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公开(公告)号：US07592264B2
公开(公告)日：2009-09-22
申请号：US11603634
申请日：2006-11-22
IPC分类号： H01L21/302
CPC分类号： B05B1/00 , B08B3/08 , B08B7/00 , B08B2230/01 , G03F7/423 , H01L21/02063 , H01L21/02071 , H01L21/30604 , H01L21/31105 , H01L21/31133 , H01L21/6708
摘要： A method of removing materials, and preferably photoresist, from a substrate comprises dispensing a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors and having a water/sulfuric acid molar ratio of no greater than 5:1 onto an material coated substrate in an amount effective to substantially uniformly coat the material coated substrate. The substrate is preferably heated to a temperature of at least about 90° C., either before, during or after dispensing of the liquid sulfuric acid composition. After the substrate is at a temperature of at least about 90° C., the liquid sulfuric acid composition is exposed to water vapor in an amount effective to increase the temperature of the liquid sulfuric acid composition above the temperature of the liquid sulfuric acid composition prior to exposure to the water vapor. The substrate is then preferably rinsed to remove the material.
摘要翻译： 从衬底去除材料，优选光致抗蚀剂的方法包括将包含硫酸和/或其干燥物质和前体并且具有不大于5:1的水/硫酸摩尔比的液体硫酸组合物分配到材料 涂覆的基材的量可以有效地基本上均匀地涂覆涂覆有材料的基材。 优选在分配液体硫酸组合物之前，期间或之后将基材加热至至少约90℃的温度。 在基板处于至少约90℃的温度之后，将液体硫酸组合物暴露于水蒸气中，其量可以有效地将液体硫酸组合物的温度升高到高于液体硫酸组合物的温度之前 暴露于水蒸汽。 然后优选冲洗基材以除去材料。
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公开(公告)号：US08394228B2
公开(公告)日：2013-03-12
申请号：US12555481
申请日：2009-09-08
CPC分类号： B05B1/00 , B08B3/08 , B08B7/00 , B08B2230/01 , G03F7/423 , H01L21/02063 , H01L21/02071 , H01L21/30604 , H01L21/31105 , H01L21/31133 , H01L21/6708
摘要： A method of removing materials, and preferably photoresist, from a substrate comprises dispensing a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors and having a water/sulfuric acid molar ratio of no greater than 5:1 onto an material coated substrate in an amount effective to substantially uniformly coat the material coated substrate. The substrate is preferably heated to a temperature of at least about 90° C., either before, during or after dispensing of the liquid sulfuric acid composition. After the substrate is at a temperature of at least about 90° C., the liquid sulfuric acid composition is exposed to water vapor in an amount effective to increase the temperature of the liquid sulfuric acid composition above the temperature of the liquid sulfuric acid composition prior to exposure to the water vapor. The substrate is then preferably rinsed to remove the material.
摘要翻译： 从衬底去除材料，优选光致抗蚀剂的方法包括将包含硫酸和/或其干燥物质和前体并且具有不大于5:1的水/硫酸摩尔比的液体硫酸组合物分配到材料 涂覆的基材的量可以有效地基本上均匀地涂覆涂覆有材料的基材。 优选在分配液体硫酸组合物之前，期间或之后将基材加热至至少约90℃的温度。 在基板处于至少约90℃的温度之后，将液体硫酸组合物暴露于水蒸气中，其量可以有效地将液体硫酸组合物的温度升高到高于液体硫酸组合物的温度之前 暴露于水蒸汽。 然后优选冲洗基材以除去材料。
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