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1.发明授权公开(公告)号：US07341449B2
公开(公告)日：2008-03-11
申请号：US10961170
申请日：2004-10-08
IPC分类号： F27B9/20
CPC分类号： F27D99/0075 , B23K1/008 , F27B9/10
摘要： A method and apparatus for heat treating objects in an enclosure, where the enclosure has an inlet passage, an outlet passage, and a treatment zone. Gaseous first fluid is injected into the treatment zone and the objects to be treated are passed through the treatment zone. A second fluid, with a density greater than that of the first fluid, is injected near the inlet and outlet passages.
摘要翻译： 一种用于对外壳中的物体进行热处理的方法和装置，其中所述外壳具有入口通道，出口通道和处理区。 将气态第一流体注入处理区域中，待处理物体通过处理区域。 密度大于第一流体的第二流体在入口和出口通道附近被注入。
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2.发明申请公开(公告)号：US20050100849A1
公开(公告)日：2005-05-12
申请号：US10961170
申请日：2004-10-08
CPC分类号： F27D99/0075 , B23K1/008 , F27B9/10
摘要： The process is carried out in an enclosure (21) located in a surrounding gaseous fluid and defining an internal treatment zone (31). The enclosure (21) comprises an entrance passage (32) and an exit passage (33). This process comprises the following steps: (a) the treatment zone (31) is heated; (b) a gaseous treatment fluid is injected into the treatment zone (31); (c) the said objects (12) are transported through the said treatment zone (31); (d) a gaseous isolating fluid is injected in the vicinity of at least one of the said passages (32, 33). In step (d), the density of the said gaseous isolating fluid at the temperature found in the one or more of the said passages (32, 33) is greater than the density of the gaseous treatment fluid inside the oven. Applicable to the assembling of electronic boards by soldering.
摘要翻译： 该过程在位于周围气体流体中并限定内部处理区（31）的外壳（21）中进行。 外壳（21）包括入口通道（32）和出口通道（33）。 该方法包括以下步骤：（a）处理区（31）被加热; （b）将气体处理流体注入到处理区（31）中; （c）所述物体（12）被输送通过所述处理区（31）; （d）气体隔离流体被注入至少一个所述通道（32,33）附近。 在步骤（d）中，在一个或多个所述通道（32,33）中发现的温度下，所述气体隔离流体的密度大于炉内气态处理流体的密度。 适用于通过焊接组装电子板。
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