公开(公告)号：US07745897B2

公开(公告)日：2010-06-29

申请号：US11140157

申请日：2005-05-27

申请人： Cheng Why Tan ,  Piang Joon Seow

发明人： Cheng Why Tan ,  Piang Joon Seow

IPC分类号： H01L31/0203

CPC分类号： H04N5/2253 ,  H01L24/48 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/8592 ,  H01L2224/85951 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/4554

摘要： An image sensor is packaged by attaching the image sensor to a substrate, forming metallic bumps on either the image sensor or a transparent cover, where the metallic bumps are formed in a pattern around the perimeter of the active area of the image sensor. The transparent cover is then glued to the image sensor at the metallic bumps. Electrical connections are formed between the image sensor and the substrate using, for example, conventional wire bonding techniques. The electrical connections are encapsulated within an epoxy for protection. In an embodiment, multiple image sensors are packaged together on the same substrate and separated into individually packaged image sensors by, for example, sawing.

摘要翻译： 图像传感器通过将图像传感器附接到基板来封装，在图像传感器或透明盖上形成金属凸块，其中金属凸块以图像传感器的有效区域的周边周围的图案形成。 然后透明盖子在金属凸块处胶合到图像传感器。 使用例如常规的引线接合技术在图像传感器和基板之间形成电连接。 电气连接被封装在环氧树脂中以进行保护。 在一个实施例中，多个图像传感器被封装在同一基板上并通过例如锯切被分离成单独封装的图像传感器。