-
1.发明授权公开(公告)号：US08709702B2
公开(公告)日：2014-04-29
申请号：US13024952
申请日：2011-02-10
IPC分类号： G03F7/20
CPC分类号： G03F7/0047 , C03C4/04 , C03C10/00 , C03C15/00 , C03C23/002 , C03C2218/34 , G03F7/0043
摘要： A method of fabrication and device with holes for electrical conduction made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form the one or more depressions or through holes for electrical conduction in the device.
摘要翻译： 一种通过制备至少包含二氧化硅，氧化锂，氧化铝和氧化铈的感光玻璃基板制造的具有电导通孔的装置的方法和装置，掩蔽包括一个或多个孔的设计布局以形成一个或多个导电路径 在感光性玻璃基板上，将感光性玻璃基板的至少一部分曝光于活化能源，使感光性玻璃基板暴露于玻璃化转变温度以上至少10分钟的加热相，冷却感光性玻璃基板， 将暴露的玻璃的至少一部分暴露于晶体材料以形成玻璃晶体衬底并用蚀刻剂溶液蚀刻玻璃晶体衬底以形成用于器件中的导电的一个或多个凹陷或通孔。
-
公开(公告)号：US20110217657A1
公开(公告)日：2011-09-08
申请号：US13043393
申请日：2011-03-08
CPC分类号： G03F7/004 , G03F7/20 , H01R43/16 , Y10T29/49204
摘要： A method of fabrication and device with holes for electrical conduction made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form the one or more depressions or through holes for electrical conduction in the device.
-
3.发明申请公开(公告)号：US20110195360A1
公开(公告)日：2011-08-11
申请号：US13024952
申请日：2011-02-10
IPC分类号： G03F7/20
CPC分类号： G03F7/0047 , C03C4/04 , C03C10/00 , C03C15/00 , C03C23/002 , C03C2218/34 , G03F7/0043
摘要： A method of fabrication and device with holes for electrical conduction made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form the one or more depressions or through holes for electrical conduction in the device.
摘要翻译： 一种通过制备至少包含二氧化硅，氧化锂，氧化铝和氧化铈的感光玻璃基板制造的具有电导通孔的装置的方法和装置，掩蔽包括一个或多个孔的设计布局以形成一个或多个导电路径 在感光性玻璃基板上，将感光性玻璃基板的至少一部分曝光于活化能源，使感光性玻璃基板暴露于玻璃化转变温度以上至少10分钟的加热相，冷却感光性玻璃基板， 将暴露的玻璃的至少一部分暴露于晶体材料以形成玻璃晶体衬底并用蚀刻剂溶液蚀刻玻璃晶体衬底以形成用于器件中的导电的一个或多个凹陷或通孔。
-
-
搜索结果
3 条记录 (耗时 0.017 秒)