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1.发明授权公开(公告)号：US08155754B2
公开(公告)日：2012-04-10
申请号：US11042649
申请日：2005-01-25
IPC分类号： A61N1/04
CPC分类号： A61N1/05 , C23C28/32 , Y10T29/49204
摘要： A method for fabricating an implantable medical electrode includes roughening the electrode substrate, applying an adhesion layer, and depositing a valve metal oxide coating over the adhesion layer under conditions optimized to minimize electrode impedance and post-pulse polarization. The electrode substrate may be a variety of electrode metals or alloys including titanium, platinum, platinum-iridium, or niobium. The adhesion layer may be formed of titanium or zirconium. The valve metal oxide coating is a ruthenium oxide coating sputtered onto the adhesion layer under controlled target power, sputtering pressure, and sputter gas ratio setting optimized to minimize electrode impedance and post-pulse polarization.
摘要翻译： 一种用于制造可植入医疗电极的方法包括使电极基板粗糙化，施加粘合层，以及在优化以最小化电极阻抗和脉冲后极化的条件下，在粘附层上沉积阀金属氧化物涂层。 电极基板可以是各种电极金属或包括钛，铂，铂 - 铱或铌的合金。 粘合层可以由钛或锆形成。 阀金属氧化物涂层是在受控目标功率，溅射压力和溅射气体比设置下溅射到粘附层上的氧化钌涂层，其被优化以最小化电极阻抗和后脉冲极化。
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2.发明申请公开(公告)号：US20100137963A1
公开(公告)日：2010-06-03
申请号：US12640610
申请日：2009-12-17
CPC分类号： A61N1/05 , C23C28/32 , Y10T29/49204
摘要： A method for fabricating an implantable medical electrode includes roughening the electrode substrate, applying an adhesion layer, and depositing a valve metal oxide coating over the adhesion layer under conditions optimized to minimize electrode impedance and post-pulse polarization. The electrode substrate may be a variety of electrode metals or alloys including titanium, platinum, platinum-iridium, or niobium. The adhesion layer may be formed of titanium or zirconium. The valve metal oxide coating is a ruthenium oxide coating sputtered onto the adhesion layer under controlled target power, sputtering pressure, and sputter gas ratio setting optimized to minimize electrode impedance and post-pulse polarization.
摘要翻译： 一种用于制造可植入医疗电极的方法包括使电极基板粗糙化，施加粘合层，以及在优化以最小化电极阻抗和脉冲后极化的条件下，在粘附层上沉积阀金属氧化物涂层。 电极基板可以是各种电极金属或包括钛，铂，铂 - 铱或铌的合金。 粘合层可以由钛或锆形成。 阀金属氧化物涂层是在受控目标功率，溅射压力和溅射气体比设置下溅射到粘附层上的氧化钌涂层，其被优化以最小化电极阻抗和后脉冲极化。
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