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公开(公告)号：US09279185B2
公开(公告)日：2016-03-08
申请号：US13523124
申请日：2012-06-14
IPC分类号： C23C16/455
CPC分类号： C23C16/45563 , C23C16/45587 , C23C16/45589 , Y10T137/85938
摘要： A feed-through apparatus for a chemical vapor deposition device including: a feed-through main body; a plurality of runner units; and a feed-through device rotatable with respect to the plurality of runner units within the feed-through main body. Each runner unit has a fluid inlet and an elongated runner for receiving the fluid from the fluid inlet wherein the elongated runner extends spirally on a surface of the runner unit. The feed-through device has a plurality of feed-through device orifices for receiving fluids from corresponding elongated runners during rotation of the feed-through device and has outlet-orifices for releasing the fluids into a reactor chamber.
摘要翻译： 一种用于化学气相沉积装置的馈通装置，包括：馈通主体; 多个流道单元; 以及可相对于所述多个流道单元在所述馈通主体内旋转的馈通装置。 每个流道单元具有流体入口和用于从流体入口接收流体的细长流道，其中细长流道在流道单元的表面上螺旋地延伸。 馈通装置具有多个馈通装置孔口，用于在馈送装置的旋转期间从相应的细长流道接收流体，并具有用于将流体释放到反应器室中的出口。
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公开(公告)号：US09427893B2
公开(公告)日：2016-08-30
申请号：US14489640
申请日：2014-09-18
CPC分类号： B29C33/308 , B29C33/307 , B29C43/18 , B29C43/32 , B29C43/36 , B29C2043/5858 , B30B1/103 , B30B15/007 , B30B15/067 , H01L21/56 , H01L21/565
摘要： Disclosed is a platen for a molding press for encapsulating semiconductor dies on a substrate, the platen comprising: a first mold chase having a first mold chase surface; the platen being operable to cooperate with a further platen having a second mold chase with a second mold chase surface to clamp a substrate, which is held against a substrate-facing surface relating to either the first or second mold chase surface, between the first and second mold chase surfaces to define at least one mold cavity with respect to the substrate; wherein the platen further comprises a rotational mounting device on which either the first or second mold chase is rotatable about at least one axis passing through the center of the substrate-facing surface to adjust the relative arrangement of the first and second mold chase surfaces. Also disclosed is a molding press comprising the platen, and the further platen cooperating with the platen.
摘要翻译： 公开了一种用于将半导体管芯封装在基板上的模压机的压板，所述压板包括：具有第一模具走向表面的第一模具追逐; 所述压板可操作以与具有第二模具追逐的另一个压板配合，其具有第二模具走走表面，以夹紧基板，所述基板保持在与第一或第二模具追逐表面相关的面向基板的表面上， 第二模具追逐表面以相对于所述基板限定至少一个模腔; 其中所述压板还包括旋转安装装置，所述第一或第二模具追逐可以围绕穿过所述面向衬底的表面的中心的至少一个轴线旋转，以调整所述第一和第二模具走走表面的相对布置。 还公开了一种成型压力机，其包括压板，并且另外的压板与压板配合。
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公开(公告)号：US20160082624A1
公开(公告)日：2016-03-24
申请号：US14489640
申请日：2014-09-18
CPC分类号： B29C33/308 , B29C33/307 , B29C43/18 , B29C43/32 , B29C43/36 , B29C2043/5858 , B30B1/103 , B30B15/007 , B30B15/067 , H01L21/56 , H01L21/565
摘要： Disclosed is a platen for a molding press for encapsulating semiconductor dies on a substrate, the platen comprising: a first mold chase having a first mold chase surface; the platen being operable to cooperate with a further platen having a second mold chase with a second mold chase surface to clamp a substrate, which is held against a substrate-facing surface relating to either the first or second mold chase surface, between the first and second mold chase surfaces to define at least one mold cavity with respect to the substrate; wherein the platen further comprises a rotational mounting device on which either the first or second mold chase is rotatable about at least one axis passing through the centre of the substrate-facing surface to adjust the relative arrangement of the first and second mold chase surfaces. Also disclosed is a molding press comprising the platen, and the further platen cooperating with the platen.
摘要翻译： 公开了一种用于将半导体管芯封装在基板上的模压机的压板，所述压板包括：具有第一模具走向表面的第一模具追逐; 所述压板可操作以与具有第二模具追逐的另一个压板配合，其具有第二模具走走表面，以夹紧基板，所述基板保持在与第一或第二模具追逐表面相关的面向基板的表面上， 第二模具追逐表面以相对于所述基板限定至少一个模腔; 其中所述压板还包括旋转安装装置，所述第一或第二模具追逐可以围绕穿过所述面向衬底的表面的中心的至少一个轴线旋转，以调整所述第一和第二模具走走表面的相对布置。 还公开了一种成型压力机，其包括压板，并且另外的压板与压板配合。
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公开(公告)号：US08840726B2
公开(公告)日：2014-09-23
申请号：US13155529
申请日：2011-06-08
申请人： Zilan Li , Teng Hock Kuah , Jiapei Ding , Ravindra Raghavendra
发明人： Zilan Li , Teng Hock Kuah , Jiapei Ding , Ravindra Raghavendra
IPC分类号： C23C16/455 , C23C16/458 , C23F1/00 , H01L21/306 , C23C16/30 , C23C16/06 , C23C16/22
CPC分类号： C23C16/303 , C23C16/45563 , C23C16/45589
摘要： An apparatus 101 for depositing a thin-film onto a surface of a substrate 113 using precursor gases G1, G2 is disclosed. The apparatus 101 comprises i) a supporting device 111 for holding the substrate 113; and ii) a spinner 105 positioned adjacent to the supporting device 111. Specifically, the spinner 105 includes a hub 106 for connecting to a motor, and one or more blades 201 connected to the hub 106. In particular, the one or more blades 201 are operative to rotate around the hub 106 on a plane to drive a fluid flow of the precursor gases G1, G2, so as to distribute the precursor gases G1, G2 across the surface of the substrate 113.
摘要翻译： 公开了一种用于使用前体气体G1，G2将薄膜沉积到衬底113的表面上的装置101。 装置101包括：i）用于保持基板113的支撑装置111; 并且ii）与支撑装置111相邻定位的旋转器105.具体地，旋转器105包括用于连接到电动机的毂106和连接到毂106的一个或多个叶片201.特别地，一个或多个叶片201 可操作以在平面上围绕毂106旋转以驱动前体气体G1，G2的流体流，以便将前体气体G1，G2分布在衬底113的表面上。
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公开(公告)号：US20130333620A1
公开(公告)日：2013-12-19
申请号：US13523124
申请日：2012-06-14
IPC分类号： F16L41/00 , C23C16/458
CPC分类号： C23C16/45563 , C23C16/45587 , C23C16/45589 , Y10T137/85938
摘要： A feed-through apparatus for a chemical vapor deposition device including: a feed-through main body; a plurality of runner units; and a feed-through device rotatable with respect to the plurality of runner units within the feed-through main body. Each runner unit has a fluid inlet and an elongated runner for receiving the fluid from the fluid inlet wherein the elongated runner extends spirally on a surface of the runner unit. The feed-through device has a plurality of feed-through device orifices for receiving fluids from corresponding elongated runners during rotation of the feed-through device and has outlet-orifices for releasing the fluids into a reactor chamber.
摘要翻译： 一种用于化学气相沉积装置的馈通装置，包括：馈通主体; 多个流道单元; 以及可相对于所述多个流道单元在所述馈通主体内旋转的馈通装置。 每个流道单元具有流体入口和用于从流体入口接收流体的细长流道，其中细长流道在流道单元的表面上螺旋地延伸。 馈通装置具有多个馈通装置孔口，用于在馈送装置的旋转期间从相应的细长流道接收流体，并具有用于将流体释放到反应器室中的出口。
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公开(公告)号：US20120312231A1
公开(公告)日：2012-12-13
申请号：US13155529
申请日：2011-06-08
申请人： Zilan LI , Teng Hock KUAH , Jiapei DING , Ravindra RAGHAVENDRA
发明人： Zilan LI , Teng Hock KUAH , Jiapei DING , Ravindra RAGHAVENDRA
IPC分类号： C23C16/455
CPC分类号： C23C16/303 , C23C16/45563 , C23C16/45589
摘要： An apparatus 101 for depositing a thin-film onto a surface of a substrate 113 using precursor gases G1, G2 is disclosed. The apparatus 101 comprises i) a supporting device 111 for holding the substrate 113; and ii) a spinner 105 positioned adjacent to the supporting device 111. Specifically, the spinner 105 includes a hub 106 for connecting to a motor, and one or more blades 201 connected to the hub 106. In particular, the one or more blades 201 are operative to rotate around the hub 106 on a plane to drive a fluid flow of the precursor gases G1, G2, so as to distribute the precursor gases G1, G2 across the surface of the substrate 113.
摘要翻译： 公开了一种用于使用前体气体G1，G2将薄膜沉积到衬底113的表面上的装置101。 装置101包括：i）用于保持基板113的支撑装置111; 并且ii）与支撑装置111相邻定位的旋转器105.具体地，旋转器105包括用于连接到电动机的毂106和连接到毂106的一个或多个叶片201.特别地，一个或多个叶片201 可操作以在平面上围绕毂106旋转以驱动前体气体G1，G2的流体流，以便将前体气体G1，G2分布在衬底113的表面上。
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