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公开(公告)号：US20140295013A1
公开(公告)日：2014-10-02
申请号：US14305034
申请日：2014-06-16
申请人： Shu Chuen HO , Si Liang LU , Swee Kwong MOK , Kar Weng YAN
发明人： Shu Chuen HO , Si Liang LU , Swee Kwong MOK , Kar Weng YAN
IPC分类号： B29C33/44
CPC分类号： B29C33/442 , B29C45/14655 , B29C45/372
摘要： A molding apparatus for an electronic device comprises a first mold chase, a second mold chase and a middle plate which is configured to be clamped together with the electronic device between the first mold chase and second mold chase during molding. A molding cavity formed in the middle plate is configured for receiving molding compound. A package pin is mounted on the middle plate to be movable with the middle plate, and a portion of the package pin is positioned to protrude into the molding cavity to form a mark in the molding compound when molding compound is molded around the said portion of the package pin.
摘要翻译： 一种用于电子设备的成型设备包括第一模具追逐，第二模具追逐和中间板，其构造成在模制期间与第一模具追逐和第二模具追逐之间的电子装置夹紧在一起。 形成在中间板中的模腔构造成用于接收模塑料。 封装销安装在中间板上以与中间板一起移动，并且封装销的一部分定位成突出到模制腔中以在模制化合物中形成标记，当模制化合物围绕所述模制化合物的所述部分 封装引脚。
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公开(公告)号：US07901196B2
公开(公告)日：2011-03-08
申请号：US12041140
申请日：2008-03-03
CPC分类号： B29C43/58 , B29C33/20 , B29C33/30 , B29C33/303 , B29C43/36 , B29C2043/5808
摘要： A molding apparatus comprises first and second mold chases that are configured to clamp an electronic device therebetween, and a driving mechanism which drives the first and second mold chases to apply a clamping force onto the electronic device. A pressure adjustment mechanism communicates with at least one of the mold chases and applies an additional clamping pressure onto one or more portions of the mold chase. The pressure adjustment mechanism comprises movable supports that are displaceable in directions which are substantially perpendicular to the direction of the clamping force so as to transmit and apply the said additional clamping pressure onto the mold chase, and also a plurality of piezoelectric actuators which are operative to apply displacement forces to the movable supports in their displacement directions.
摘要翻译： 模制设备包括构造成在其间夹住电子设备的第一和第二模具追逐器，以及驱动机构，其驱动第一模具追踪器和第二模具模具以将夹紧力施加到电子设备上。 压力调节机构与模具中的至少一个连通，并对模具追逐的一个或多个部分施加附加夹紧压力。 压力调节机构包括可移动的支撑件，其可在基本上垂直于夹紧力的方向上移动，以便将所述附加夹紧压力传递并施加到模具追踪上，并且还具有多个压电致动器， 在位移方向上向可动支架施加位移力。
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公开(公告)号：US06770163B1
公开(公告)日：2004-08-03
申请号：US10129258
申请日：2002-05-02
申请人： Teng Hock Kuah , Shu Chuen Ho , Charles Joseph Vath, III , Loon Aik Lim , Man Ho Hui , Juay Sim Koh
发明人： Teng Hock Kuah , Shu Chuen Ho , Charles Joseph Vath, III , Loon Aik Lim , Man Ho Hui , Juay Sim Koh
IPC分类号： B29C4514
CPC分类号： H01L21/565 , B29C45/14655 , B29C2045/14934 , H01L24/73 , H01L2224/32245 , H01L2224/45144 , H01L2224/48247 , H01L2224/73265 , H01L2924/00012 , H01L2924/00
摘要： A mold (1) is for molding a one-sided encapsulated electronic device. The mold (1) includes a first mold section (2) defining a mold cavity (4), and a second mold section (3) including a first recessed portion (6) adapted to receive a layer of material (15) attached to a leadframe (10), but not the leadframe (10).
摘要翻译： 模具（1）用于模制单面封装的电子设备。 模具（1）包括限定模腔（4）的第一模具部分（2）和包括第一凹部（6）的第二模具部分（3），第一凹部（6）适于容纳附着到模具 引线框架（10），而不是引线框架（10）。
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公开(公告)号：US09427893B2
公开(公告)日：2016-08-30
申请号：US14489640
申请日：2014-09-18
CPC分类号： B29C33/308 , B29C33/307 , B29C43/18 , B29C43/32 , B29C43/36 , B29C2043/5858 , B30B1/103 , B30B15/007 , B30B15/067 , H01L21/56 , H01L21/565
摘要： Disclosed is a platen for a molding press for encapsulating semiconductor dies on a substrate, the platen comprising: a first mold chase having a first mold chase surface; the platen being operable to cooperate with a further platen having a second mold chase with a second mold chase surface to clamp a substrate, which is held against a substrate-facing surface relating to either the first or second mold chase surface, between the first and second mold chase surfaces to define at least one mold cavity with respect to the substrate; wherein the platen further comprises a rotational mounting device on which either the first or second mold chase is rotatable about at least one axis passing through the center of the substrate-facing surface to adjust the relative arrangement of the first and second mold chase surfaces. Also disclosed is a molding press comprising the platen, and the further platen cooperating with the platen.
摘要翻译： 公开了一种用于将半导体管芯封装在基板上的模压机的压板，所述压板包括：具有第一模具走向表面的第一模具追逐; 所述压板可操作以与具有第二模具追逐的另一个压板配合，其具有第二模具走走表面，以夹紧基板，所述基板保持在与第一或第二模具追逐表面相关的面向基板的表面上， 第二模具追逐表面以相对于所述基板限定至少一个模腔; 其中所述压板还包括旋转安装装置，所述第一或第二模具追逐可以围绕穿过所述面向衬底的表面的中心的至少一个轴线旋转，以调整所述第一和第二模具走走表面的相对布置。 还公开了一种成型压力机，其包括压板，并且另外的压板与压板配合。
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公开(公告)号：US20160082624A1
公开(公告)日：2016-03-24
申请号：US14489640
申请日：2014-09-18
CPC分类号： B29C33/308 , B29C33/307 , B29C43/18 , B29C43/32 , B29C43/36 , B29C2043/5858 , B30B1/103 , B30B15/007 , B30B15/067 , H01L21/56 , H01L21/565
摘要： Disclosed is a platen for a molding press for encapsulating semiconductor dies on a substrate, the platen comprising: a first mold chase having a first mold chase surface; the platen being operable to cooperate with a further platen having a second mold chase with a second mold chase surface to clamp a substrate, which is held against a substrate-facing surface relating to either the first or second mold chase surface, between the first and second mold chase surfaces to define at least one mold cavity with respect to the substrate; wherein the platen further comprises a rotational mounting device on which either the first or second mold chase is rotatable about at least one axis passing through the centre of the substrate-facing surface to adjust the relative arrangement of the first and second mold chase surfaces. Also disclosed is a molding press comprising the platen, and the further platen cooperating with the platen.
摘要翻译： 公开了一种用于将半导体管芯封装在基板上的模压机的压板，所述压板包括：具有第一模具走向表面的第一模具追逐; 所述压板可操作以与具有第二模具追逐的另一个压板配合，其具有第二模具走走表面，以夹紧基板，所述基板保持在与第一或第二模具追逐表面相关的面向基板的表面上， 第二模具追逐表面以相对于所述基板限定至少一个模腔; 其中所述压板还包括旋转安装装置，所述第一或第二模具追逐可以围绕穿过所述面向衬底的表面的中心的至少一个轴线旋转，以调整所述第一和第二模具走走表面的相对布置。 还公开了一种成型压力机，其包括压板，并且另外的压板与压板配合。
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公开(公告)号：US08419404B2
公开(公告)日：2013-04-16
申请号：US12701036
申请日：2010-02-05
申请人： Shu Chuen Ho , Jian Wu , Choon Hong Cheong , Chee Toh Teh , Fu Sun Huang
发明人： Shu Chuen Ho , Jian Wu , Choon Hong Cheong , Chee Toh Teh , Fu Sun Huang
CPC分类号： B29C45/0084 , B29C31/006 , B29C43/003 , B29C43/34 , B29C45/14655 , B29C45/1761
摘要： A modular molding assembly comprises an input module for loading electronic devices for molding, a press station including one or more molding presses for molding the electronic devices, an output module for offloading molded electronic devices after they have been molded and a carrier that is movable at least between the input module and the press station and/or the press station and the output module. The carrier has an adaptor located thereon for detachably mounting a first attachment or a second attachment which is operative to perform a function of transporting the electronic devices and/or introducing a molding compound to the press station for conducting molding. The first and second attachments each has a corresponding mounting device for detachably mounting the first or second attachment onto the adapter and the first attachment has a different function from the second attachment.
摘要翻译： 模块化模制组件包括用于装载用于模制的电子装置的输入模块，包括用于模制电子装置的一个或多个模制压机的压力站，用于在模制后卸载模制的电子装置的输出模块和可在 至少在输入模块和压力站和/或压力站和输出模块之间。 载体具有位于其上的适配器，用于可拆卸地安装第一附件或第二附件，该第一附件或第二附件可操作以执行传送电子装置和/或将模塑料引入到压力站中以进行模制的功能。 第一和第二附件各自具有相应的安装装置，用于将第一或第二附件可拆卸地安装到适配器上，并且第一附件具有与第二附件不同的功能。
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7.发明申请APPARATUS FOR ELECTROPLATING A TOOLING FOR USE IN SEMICONDUCTOR DEVICE ENCAPSULATION 有权用于电镀的设备用于半导体器件封装的工具公开(公告)号：US20130020193A1
公开(公告)日：2013-01-24
申请号：US13184675
申请日：2011-07-18
CPC分类号： C25D17/001 , C25D17/06 , C25D17/12
摘要： An apparatus is disclosed for electroplating an inside wall of a transfer mold, the transfer mold being suitable for use in semiconductor device encapsulation. Specifically, the apparatus comprises a fixture, as well as a through-hole in the fixture for receiving an electrode to electroplate the inside wall of the transfer mold. In particular, the through-hole is configured to receive the electrode in a slide-fit to form a mutual interference fit for securing the electrode to the fixture. Upon fitting the electrode into the through-hole, the apparatus can then be used to electroplate the inside wall of the transfer mold by introducing the electrode into the space adjacent to the inside wall of the transfer mold. A device for use as an electrode in the apparatus is also disclosed.
摘要翻译： 公开了一种用于电镀转移模具的内壁的装置，该转移模具适用于半导体器件封装。 具体地，该装置包括固定装置，以及夹具中的通孔，用于接收用于电镀转移模具的内壁的电极。 特别地，通孔被配置为以滑动配合接收电极以形成用于将电极固定到固定装置上的相互干涉配合。 在将电极安装到通孔中之后，该装置可用于通过将电极引入与转移模具的内壁相邻的空间中来电镀转移模具的内壁。 还公开了一种在装置中用作电极的装置。
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公开(公告)号：US20110212214A1
公开(公告)日：2011-09-01
申请号：US13036078
申请日：2011-02-28
申请人： Shu Chuen HO , Si Liang LU , Swee Kwong MOK , Kar Weng YAN
发明人： Shu Chuen HO , Si Liang LU , Swee Kwong MOK , Kar Weng YAN
IPC分类号： B29C45/03
CPC分类号： B29C45/27 , B29C45/02 , B29C45/14655
摘要： A runner system for a molding apparatus comprises a plurality of runner networks, each runner network further comprising a mold supply pot having a first side and a second side opposite to the first side. A plurality of molding cavities are located on the first and second sides of the mold supply pot, and a plurality of runners are operative to channel molding compound from each mold supply pot to the plurality of molding cavities. At least one of the mold supply pots comprises a different number of runners located on the first side which are connected to the mold supply pot as compared to a number of runners located on the second side which are connected to the mold supply pot.
摘要翻译： 用于成型设备的流道系统包括多个流道网络，每个流道网络还包括具有第一侧和与第一侧相对的第二侧的模具供应罐。 多个模腔位于模具供应罐的第一和第二侧上，并且多个浇道可操作以将模塑料从每个模具供应罐引导到多个模腔。 与连接到模具供应罐的位于第二侧的多个浇道相比，至少一个模具供应罐包括位于第一侧上的不同数量的流道，其连接到模具供应罐。
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公开(公告)号：US07927087B2
公开(公告)日：2011-04-19
申请号：US11052566
申请日：2005-02-07
申请人： Xiang Chen , Shu Chuen Ho , Teng Hock Eric Kuah , Si Liang Lu , See Yap Ong
发明人： Xiang Chen , Shu Chuen Ho , Teng Hock Eric Kuah , Si Liang Lu , See Yap Ong
IPC分类号： B29C45/00
CPC分类号： B29C45/02 , B29C45/14655 , B29C45/27 , B29C45/586
摘要： An apparatus and process are provided for molding electronic devices in a mold, which apparatus comprises at least one runner in the mold connected to a mold supply pot for channeling a molding compound from the mold supply pot to the electronic devices. A plunger assembly is also provided that comprises a main body, and a supplementary body configured to be movable relative to the main body. The plunger assembly is locatable in the mold supply pot and is drivable in a direction towards the runner for forcing the molding compound into the runner. In order to avoid or reduce cull formation, a width of the runner at an opening connecting the runner to the mold supply pot is smaller than a width of the main body of the plunger assembly.
摘要翻译： 提供了用于在模具中模制电子装置的装置和方法，该装置包括在模具中的至少一个流道，其连接到模具供应罐，用于将模制化合物从模具供应罐引导到电子装置。 还提供了一种柱塞组件，其包括主体和构造成相对于主体可移动的辅助主体。 柱塞组件可定位在模具供应罐中，并且可以在朝着流道的方向上驱动，以迫使模塑料进入流道。 为了避免或减少ull形，在连接流道与模具供应罐的开口处的流道宽度小于柱塞组件主体的宽度。
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公开(公告)号：US07677874B2
公开(公告)日：2010-03-16
申请号：US11670691
申请日：2007-02-02
申请人： Zheng Yu Gao , Shu Chuen Ho
发明人： Zheng Yu Gao , Shu Chuen Ho
CPC分类号： H01L21/565 , H01L2924/0002 , Y10S425/812 , H01L2924/00
摘要： A molding apparatus is provided for molding a leadframe, the molding apparatus comprising a mold having a leadframe-receiving area on its surface that is configured to receive and clamp the leadframe in the leadframe-receiving area. At least one molding cavity and a plurality of vacuum suction holes formed adjacent to the molding cavity are located within the leadframe-receiving area. The vacuum suction holes are operative to evacuate air from the mold surface, especially the molding cavity, through air vents connecting the vacuum suction holes to the molding cavity.
摘要翻译： 提供了一种用于模制引线框架的模制设备，该模制设备包括其表面上具有引线框接收区域的模具，该引线框架接收区域被构造成在引线框接收区域中接收和夹紧引线框架。 至少一个模制腔和邻近模制腔形成的多个真空吸附孔位于引导框接收区域内。 真空吸孔可操作以通过将真空抽吸孔连接到模制腔的通风口从模具表面，特别是模制腔排出空气。
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