公开(公告)号：US06594150B2

公开(公告)日：2003-07-15

申请号：US09776455

申请日：2001-02-02

申请人： Richard Creason ,  Clifford B. Willis ,  Denise Silverman ,  Michael Sean White ,  David M. Arstein ,  Victor E. JoChiong ,  Timothy E. Mautz ,  Steve M. Wilson ,  Raymond Kai Ho ,  Kaamel Kermaani ,  Carl Meert ,  Adiymar Bigio ,  Vince Hileman

发明人： Richard Creason ,  Clifford B. Willis ,  Denise Silverman ,  Michael Sean White ,  David M. Arstein ,  Victor E. JoChiong ,  Timothy E. Mautz ,  Steve M. Wilson ,  Raymond Kai Ho ,  Kaamel Kermaani ,  Carl Meert ,  Adiymar Bigio ,  Vince Hileman

IPC分类号： H05K114

CPC分类号： G06F1/18 ,  G06F1/183

摘要： A computer system comprising a chassis and housing removable servers supported in subchassis, each chassis having optional front or read cable access. Power and signal connectivity to the servers may be made from the front or rear of the system. The subchassis may be half the width of the chassis or a quarter of a width of the chassis. The subchassis further include an upper bay and a lower bay as well as a plurality of field replaceable units, which all may be access through the front of the chassis. One or more of the field replaceable units connect to the system through a midplane, located within the subchassis.

公开(公告)号：US6101094A

公开(公告)日：2000-08-08

申请号：US216136

申请日：1998-12-18

申请人： Kaamel M. Kermaani ,  Raymond Kai Ho

发明人： Kaamel M. Kermaani ,  Raymond Kai Ho

IPC分类号： H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  H05K3/36 ,  H05K7/20

CPC分类号： H05K7/205 ,  H05K1/141 ,  H05K1/0203 ,  H05K1/0206 ,  H05K2201/066 ,  H05K2201/10189 ,  H05K2201/10477 ,  H05K3/284 ,  H05K3/368

摘要： An electronic device having two or more printed circuit boards with integrated heat-dissipating mechanism without a fan. A heat-generating circuit component is placed on a daughter board separated from a motherboard. An electrically insulating thermal conductor is placed between the daughter board and the motherboard for heat transfer.

摘要翻译： 具有两个或更多个印刷电路板的电子设备，其具有集成散热机构而没有风扇。 将发热电路部件放置在与母板分离的子板上。 电绝缘导热体置于子板和母板之间进行热传递。