公开(公告)号：US5116218A

公开(公告)日：1992-05-26

申请号：US622647

申请日：1990-12-05

申请人： Gerard E. A. Jourdain ,  Regis Raynal

发明人： Gerard E. A. Jourdain ,  Regis Raynal

IPC分类号： B29C33/44 ,  B29C33/48 ,  B29C53/82

CPC分类号： B29C53/824 ,  B29C33/44 ,  B29C33/485

摘要： Molding apparatus, for example for molding components of polymerized resin without drawing, comprises a mold defined by a mold wall having a first thermal expansion coefficient, and a die including a die wall having a second thermal expansion coefficient greater than the said first coefficient, a molding operation being carried out by inserting the die into the mold at a first temperature, heating the die and the mold to a second temperature higher than the first temperature, and subsequently cooling the die and the mold after a component has been molded. In accordance with the invention, the die wall includes a plurality of separate sectors which are pivotally mounted on a common support member and which are arranged and dimensioned such that, at the second temperature, the radially outer faces of the sectors adjoin one another contiguously to define the molding face of the die wall.

摘要翻译： 成型装置，例如用于模制未拉伸的聚合树脂的组分，包括由具有第一热膨胀系数的模具壁定义的模具和包括具有大于所述第一系数的第二热膨胀系数的模具壁的模具， 通过在第一温度下将模具插入模具中进行成型操作，将模具和模具加热至高于第一温度的第二温度，随后在模制成型后冷却模具和模具。 根据本发明，模具壁包括多个单独的扇区，其可枢转地安装在共同的支撑构件上，并且其布置和尺寸被设计成使得在第二温度下，扇形体的径向外表面彼此邻接地连接到 限定模具壁的模制面。