公开(公告)号：US20130329368A1

公开(公告)日：2013-12-12

申请号：US13614996

申请日：2012-09-13

申请人： Brett W. Degner ,  Patrick Kessler ,  Charles A. Schwalbach ,  Richard H. Tan ,  William F. Leggett

发明人： Brett W. Degner ,  Patrick Kessler ,  Charles A. Schwalbach ,  Richard H. Tan ,  William F. Leggett

IPC分类号： H05K7/20 ,  F28F7/00 ,  F28D15/04

CPC分类号： G06F1/20 ,  F28D15/0233 ,  F28D15/0275 ,  G06F1/203

摘要： The disclosed embodiments provide a system that facilitates heat transfer in an electronic device. The system includes a heat pipe configured to conduct heat away from a heat-generating component in the electronic device. The system also includes a thermal stage disposed along a thermal interface between the heat-generating component and the heat pipe, wherein the thermal stage applies a spring force between the heat-generating component and the heat pipe. The thermal stage includes a first thickness to accommodate the heat pipe and a second thickness that is greater than the first thickness to increase a spring force between the heat-generating component and the heat pipe. Finally, the system includes a set of fasteners configured to fasten the thermal stage to a surface within the electronic device and form a thermal gap between the heat pipe and an enclosure of the electronic device.

摘要翻译： 所公开的实施例提供了促进电子设备中的热传递的系统。 该系统包括被配置为将热量从电子设备中的发热部件导出的热管。 该系统还包括沿着发热部件和热管之间的热界面设置的热级，其中热级在发热部件和热管之间施加弹簧力。 热级包括第一厚度以容纳热管，第二厚度大于第一厚度，以增加发热部件和热管之间的弹簧力。 最后，该系统包括一组紧固件，其被配置为将热平台固定到电子设备内的表面，并在热管和电子设备的外壳之间形成热间隙。

公开(公告)号：US08976528B2

公开(公告)日：2015-03-10

申请号：US13614996

申请日：2012-09-13

申请人： Brett W. Degner ,  Patrick Kessler ,  Charles A. Schwalbach ,  Richard H. Tan ,  William F. Leggett

发明人： Brett W. Degner ,  Patrick Kessler ,  Charles A. Schwalbach ,  Richard H. Tan ,  William F. Leggett

IPC分类号： H05K7/20 ,  F28F7/00 ,  F28D15/04 ,  G01F1/20

CPC分类号： G06F1/20 ,  F28D15/0233 ,  F28D15/0275 ,  G06F1/203

摘要： The disclosed embodiments provide a system that facilitates heat transfer in an electronic device. The system includes a heat pipe configured to conduct heat away from a heat-generating component in the electronic device. The system also includes a thermal stage disposed along a thermal interface between the heat-generating component and the heat pipe, wherein the thermal stage applies a spring force between the heat-generating component and the heat pipe. The thermal stage includes a first thickness to accommodate the heat pipe and a second thickness that is greater than the first thickness to increase a spring force between the heat-generating component and the heat pipe. Finally, the system includes a set of fasteners configured to fasten the thermal stage to a surface within the electronic device and form a thermal gap between the heat pipe and an enclosure of the electronic device.

摘要翻译： 所公开的实施例提供了促进电子设备中的热传递的系统。 该系统包括被配置为将热量从电子设备中的发热部件导出的热管。 该系统还包括沿着发热部件和热管之间的热界面设置的热级，其中热级在发热部件和热管之间施加弹簧力。 热级包括第一厚度以容纳热管，第二厚度大于第一厚度，以增加发热部件和热管之间的弹簧力。 最后，该系统包括一组紧固件，其被配置为将热台固定到电子设备内的表面，并在热管和电子设备的外壳之间形成热间隙。