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    Fasteners and dual-thickness thermal stages in electronic devices
    1.
    发明授权
    Fasteners and dual-thickness thermal stages in electronic devices 有权
    电子设备中的紧固件和双层热层

    公开(公告)号：US08976528B2

    公开(公告)日：2015-03-10

    申请号：US13614996

    申请日：2012-09-13

    申请人： Brett W. Degner ,  Patrick Kessler ,  Charles A. Schwalbach ,  Richard H. Tan ,  William F. Leggett

    发明人： Brett W. Degner ,  Patrick Kessler ,  Charles A. Schwalbach ,  Richard H. Tan ,  William F. Leggett

    IPC分类号： H05K7/20 ,  F28F7/00 ,  F28D15/04 ,  G01F1/20

    CPC分类号： G06F1/20 ,  F28D15/0233 ,  F28D15/0275 ,  G06F1/203

    摘要： The disclosed embodiments provide a system that facilitates heat transfer in an electronic device. The system includes a heat pipe configured to conduct heat away from a heat-generating component in the electronic device. The system also includes a thermal stage disposed along a thermal interface between the heat-generating component and the heat pipe, wherein the thermal stage applies a spring force between the heat-generating component and the heat pipe. The thermal stage includes a first thickness to accommodate the heat pipe and a second thickness that is greater than the first thickness to increase a spring force between the heat-generating component and the heat pipe. Finally, the system includes a set of fasteners configured to fasten the thermal stage to a surface within the electronic device and form a thermal gap between the heat pipe and an enclosure of the electronic device.

    摘要翻译： 所公开的实施例提供了促进电子设备中的热传递的系统。 该系统包括被配置为将热量从电子设备中的发热部件导出的热管。 该系统还包括沿着发热部件和热管之间的热界面设置的热级，其中热级在发热部件和热管之间施加弹簧力。 热级包括第一厚度以容纳热管，第二厚度大于第一厚度，以增加发热部件和热管之间的弹簧力。 最后，该系统包括一组紧固件，其被配置为将热台固定到电子设备内的表面，并在热管和电子设备的外壳之间形成热间隙。

    FASTENERS AND DUAL-THICKNESS THERMAL STAGES IN ELECTRONIC DEVICES
    2.
    发明申请
    FASTENERS AND DUAL-THICKNESS THERMAL STAGES IN ELECTRONIC DEVICES 有权
    电子设备中的紧固件和双厚度热阶段

    公开(公告)号：US20130329368A1

    公开(公告)日：2013-12-12

    申请号：US13614996

    申请日：2012-09-13

    申请人： Brett W. Degner ,  Patrick Kessler ,  Charles A. Schwalbach ,  Richard H. Tan ,  William F. Leggett

    发明人： Brett W. Degner ,  Patrick Kessler ,  Charles A. Schwalbach ,  Richard H. Tan ,  William F. Leggett

    IPC分类号： H05K7/20 ,  F28F7/00 ,  F28D15/04

    CPC分类号： G06F1/20 ,  F28D15/0233 ,  F28D15/0275 ,  G06F1/203

    摘要： The disclosed embodiments provide a system that facilitates heat transfer in an electronic device. The system includes a heat pipe configured to conduct heat away from a heat-generating component in the electronic device. The system also includes a thermal stage disposed along a thermal interface between the heat-generating component and the heat pipe, wherein the thermal stage applies a spring force between the heat-generating component and the heat pipe. The thermal stage includes a first thickness to accommodate the heat pipe and a second thickness that is greater than the first thickness to increase a spring force between the heat-generating component and the heat pipe. Finally, the system includes a set of fasteners configured to fasten the thermal stage to a surface within the electronic device and form a thermal gap between the heat pipe and an enclosure of the electronic device.

    摘要翻译： 所公开的实施例提供了促进电子设备中的热传递的系统。 该系统包括被配置为将热量从电子设备中的发热部件导出的热管。 该系统还包括沿着发热部件和热管之间的热界面设置的热级，其中热级在发热部件和热管之间施加弹簧力。 热级包括第一厚度以容纳热管，第二厚度大于第一厚度，以增加发热部件和热管之间的弹簧力。 最后，该系统包括一组紧固件，其被配置为将热平台固定到电子设备内的表面，并在热管和电子设备的外壳之间形成热间隙。