公开(公告)号：US20070026722A1

公开(公告)日：2007-02-01

申请号：US11194190

申请日：2005-08-01

申请人： Daniel Ringler ,  Michael Correll ,  Richard Whyne ,  RIchard Hamner

发明人： Daniel Ringler ,  Michael Correll ,  Richard Whyne ,  RIchard Hamner

IPC分类号： H01R13/64

CPC分类号： H01R12/585 ,  H01R12/7029 ,  H01R12/716 ,  H01R12/721

摘要： A fully buffered memory module is disclosed having a two piece housing comprised of a primary housing portion and an alignment plate. An array of terminals is included having at least two terminal configurations where the terminals are trapped between the primary housing portion and the alignment plate. A printed circuit board tine of the electrical terminals extend through the alignment plate while a contact portion protrudes into a slot which receives the memory module.

摘要翻译： 公开了一种全缓冲存储器模块，其具有由主壳体部分和对准板组成的两件式壳体。 端子阵列包括至少两个端子配置，其中端子被捕获在主壳体部分和对准板之间。 电气端子的印刷电路板齿通过对准板延伸，而接触部分突出到接收存储器模块的槽中。

公开(公告)号：US20070134970A1

公开(公告)日：2007-06-14

申请号：US11302932

申请日：2005-12-14

申请人： Brian Costello ,  George Defibaugh ,  Richard Hamner

发明人： Brian Costello ,  George Defibaugh ,  Richard Hamner

IPC分类号： H01R4/50

CPC分类号： H05K7/1007 ,  H01R13/26

摘要： A socket assembly is shown as generally including a cover assembly and a base frame assembly. A low insertion force (LIF) package assembly is connectable to the socket assembly and is comprised of a pin assembly, housing a package. The cover assembly includes a socket cover frame array and the base frame assembly includes a socket contact frame array. The cover assembly is spring loadable relative to the base frame assembly to provide a low insertion force application for the package.

摘要翻译： 插座组件通常包括盖组件和底架组件。 低插入力（LIF）包装组件可连接到插座组件，并且包括一个销组件，用于容纳包装。 盖组件包括插座盖框架阵列，并且底座框架组件包括插座接触框架阵列。 盖组件相对于基架组件可弹簧加载，以为包装提供低插入力应用。

公开(公告)号：US20050112933A1

公开(公告)日：2005-05-26

申请号：US10996727

申请日：2004-11-24

申请人： Richard Hamner ,  James Scholz ,  Edmund Jacobs ,  Attalee Taylor ,  Troy Conner ,  Ronald Katzaman

发明人： Richard Hamner ,  James Scholz ,  Edmund Jacobs ,  Attalee Taylor ,  Troy Conner ,  Ronald Katzaman

IPC分类号： H01R12/58 ,  H01R12/71 ,  H01R13/41 ,  H01R24/00 ,  H01R43/20 ,  H01R4/24

CPC分类号： H01R12/721 ,  H01R12/585 ,  H01R13/41 ,  H01R43/20 ,  Y10S439/943

摘要： A memory module electrical connector is comprised of an insulative housing and a plurality of electrical terminals. The terminals are stamped and formed from conductive material to include resilient contact portions for interconnection to the module, and compliant pin portions for interconnection to the printed circuit board. The compliant pin portions of the connector are laterally staggered, with some compliant pin portions being positioned adjacent to a slot in the housing for receiving the memory module, and alternate contacts are positioned distant from the slot, thereby staggering the compliant pin portions. The compliant pin sections include an upstanding, rigidifying section to rigidify the compliant pin portion during the insertion of the electrical connector and the plurality of compliant pin portions into the printed circuit board.

摘要翻译： 存储器模块电连接器包括绝缘外壳和多个电端子。 端子由导电材料冲压并形成以包括用于与模块互连的弹性接触部分，以及用于与印刷电路板互连的柔性销部分。 连接器的柔性销部分横向交错，一些柔顺销部分邻近壳体中的狭槽定位，用于接纳存储器模块，并且交替的触点位于远离槽的位置，从而使顺应销部分交错。 柔性销部分包括直立的刚性部分，用于在插入电连接器和多个柔顺销部分到印刷电路板期间使顺应销部分刚性化。