公开(公告)号：US08879274B2

公开(公告)日：2014-11-04

申请号：US10581552

申请日：2004-12-01

申请人： Alan Wilson ,  Peter Vincent ,  Richard Muscat

发明人： Alan Wilson ,  Peter Vincent ,  Richard Muscat

IPC分类号： H05K7/00 ,  C23F4/00 ,  G01N17/04 ,  H05K3/02 ,  H05K1/16 ,  H05K3/00

CPC分类号： C23F4/00 ,  G01N17/04 ,  H05K1/162 ,  H05K1/165 ,  H05K3/0038 ,  H05K3/027 ,  H05K2201/0187 ,  H05K2201/10151

摘要： There is disclosed a method of manufacturing an electrical component, involving bonding a thin metal foil to an insulating substrate and thereby forming a component blank, and laser machining at least the metal foil of said component blank to produce at least one trench for defining one or more foil tracks, said trench being at least equal in depth to the thickness of the foil so as to prevent current flow across the trench.

摘要翻译： 公开了一种制造电气部件的方法，包括将薄金属箔接合到绝缘基板上，从而形成部件坯料，并激光加工至少所述部件坯件的金属箔，以产生至少一个用于限定一个或多个 更多的箔轨道，所述沟槽至少与箔的厚度相等，以防止电流流过沟槽。

公开(公告)号：US20070173048A1

公开(公告)日：2007-07-26

申请号：US10581552

申请日：2004-12-01

申请人： Alan Wilson ,  Peter Vincent ,  Richard Muscat

发明人： Alan Wilson ,  Peter Vincent ,  Richard Muscat

IPC分类号： H01L21/44

CPC分类号： C23F4/00 ,  G01N17/04 ,  H05K1/162 ,  H05K1/165 ,  H05K3/0038 ,  H05K3/027 ,  H05K2201/0187 ,  H05K2201/10151

摘要： There is disclosed a method of manufacturing an electrical component, involving bonding a thin metal foil to an insulating substrate and thereby forming a component blank, and laser machining at least the metal foil of said component blank to produce at least one trench for defining one or more foil tracks, said trench being at least equal in depth to the thickness of the foil so as to prevent current flow across the trench.

摘要翻译： 公开了一种制造电气部件的方法，包括将薄金属箔接合到绝缘基板上，从而形成部件坯料，并激光加工至少所述部件坯件的金属箔，以产生至少一个沟槽，用于限定一个或 更多的箔轨道，所述沟槽至少与箔的厚度相等，以防止电流流过沟槽。