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    Mandibular advancement device
    1.
    发明申请
    Mandibular advancement device 审中-公开
    下颌推进装置

    公开(公告)号：US20050028826A1

    公开(公告)日：2005-02-10

    申请号：US10641255

    申请日：2004-08-11

    申请人： Richard Palmisano

    发明人： Richard Palmisano

    IPC分类号： A61F5/56

    CPC分类号： A61F5/566

    摘要： A mandibular advancement device is disclosed. The upper jaw (12) has fitted to it an upper plate (30). The upper plate (30) is firmly received, and generally comprises a body component (32) and two opposed flange components (34), are located to be lying in an area beside and close to the posterior teeth, and particularly the buccal side of the upper posterior teeth. The leading edge (36) of the flanges (34) provide engagement surfaces complementing the engagement surfaces of the trailing edges (26) of the lower flanges (24). The relative lengths of the respective trailing edges (26) and leading edges (36) ensure that mandibular advancement is maintained over a desired range of jaw openings. The angle of inclination of the engaging edges (26, 36) provides a jaw opening path generally arcuate with the protrusive border path.

    摘要翻译： 公开了一种下颌推进装置。 上钳口（12）已经装配有上板（30）。 上板（30）被牢固地接纳，并且通常包括主体部件（32）和两个相对的凸缘部件（34），所述两个相对的凸缘部件位于与后齿相邻并且靠近后牙的区域中，特别是位于 上后牙。 凸缘（34）的前缘（36​​）提供与下凸缘（24）的后缘（26）的接合表面互补的接合表面。 相应的后缘（26）和前缘（36​​）的相对长度确保下颌前进保持在所需的钳口开口范围上。 接合边缘（26,36）的倾斜角度提供了与突出边界路径大体上弓形的钳口打开路径。

    Removable encapsulant for protection of electronic equipment
    4.
    发明授权
    Removable encapsulant for protection of electronic equipment 失效
    用于保护电子设备的可拆卸密封剂

    公开(公告)号：US4118861A

    公开(公告)日：1978-10-10

    申请号：US656050

    申请日：1976-02-06

    申请人： Rocco Richard Palmisano

    发明人： Rocco Richard Palmisano

    IPC分类号： H05K3/28 ,  H01B19/00

    CPC分类号： H05K3/284 ,  H05K2201/0116 ,  H05K2201/09872 ,  Y10T29/49002

    摘要： A method of providing an easily removable encapsulant for electronic circuit assemblies is disclosed. According to the method, a body of a suitable inexpensive, low density, foamed silicone rubber which is environmentally and electrically stable is divided into pellets or fine particles. The pellets or particles are poured into a circuit assembly housing to fill voids between the housing and the circuit assembly itself. Since the encapsulating material does not adhere to the circuit assembly or the housing and retains its particulate character in use, it may be removed by simply pouring it out of the circuit assembly housing when desired.

    摘要翻译： 公开了一种为电子电路组件提供易于拆卸的密封剂的方法。 根据该方法，将环境和电气稳定的合适廉价的低密度泡沫硅橡胶的主体分成颗粒或细颗粒。 将颗粒或颗粒倒入电路组件壳体中以填充壳体和电路组件本身之间的空隙。 由于密封材料不粘附到电路组件或壳体并保持其使用中的颗粒特性，所以当需要时，可以通过简单地将其从电路组件外壳中注入而被去除。