公开(公告)号：US20060247383A1

公开(公告)日：2006-11-02

申请号：US11119306

申请日：2005-04-28

申请人： James Hedrick ,  Victor Lee ,  Teddie Magbitang ,  Robert Miller

发明人： James Hedrick ,  Victor Lee ,  Teddie Magbitang ,  Robert Miller

IPC分类号： C08F297/02

CPC分类号： C08G83/003

摘要： A nanoparticle which includes a multi-armed core and surface decoration which is attached to the core is prepared. A multi-armed core is provided by any of a number of possible routes, exemplary preferred routes being living anionic polymerization that is initiated by a reactive, functionalized anionic initiator and ε-caprolactone polymerization of a bis-MPA dendrimer. The multi-armed core is preferably functionalized on some or all arms. A coupling reaction is then employed to bond surface decoration to one or more arms of the multi-armed core. The surface decoration is a small molecule or oligomer with a degree of polymerization less than 50, a preferred decoration being a PEG oligomer with degree of polymerization between 2 and 24. The nanoparticles (particle size ≦10 nm) are employed as sacrificial templating porogens to form porous dielectrics. The porogens are mixed with matrix precursors (e.g., methyl silsesquioxane resin), the matrix vitrifies, and the porogens are removed via burnout. Greater porosity reduces the dielectric constant k of the resulting dielectrics. The porous dielectrics are incorporated into integrated circuits as lower k alternatives to silicon dioxide.

摘要翻译： 制备了一种纳米颗粒，其包括附着在芯上的多核芯和表面装饰。 通过多种可能途径中的任一种提供多核心核心，示例性的优选途径是由反应性官能化阴离子引发剂引发的活性阴离子聚合和双-MPA树枝状聚合物的ε-己内酯聚合。 多臂核心优选在一些或所有臂上功能化。 然后使用偶联反应将表面装饰粘合到多臂芯的一个或多个臂上。 表面装饰是聚合度小于50的小分子或低聚物，优选的装饰是聚合度为2至24的PEG低聚物。纳米颗粒（粒径<= 10nm）用作牺牲模板致孔剂 以形成多孔电介质。 将致孔剂与基质前体（例如甲基倍半硅氧烷树脂）混合，基体玻璃化，并通过烧尽除去致孔剂。 更大的孔隙度降低了所得电介质的介电常数k。 将多孔电介质作为二氧化硅的较低k替代物并入集成电路中。

公开(公告)号：US20060084282A1

公开(公告)日：2006-04-20

申请号：US11031418

申请日：2005-01-07

申请人： Geraud Dubois ,  James Hedrick ,  Ho-Cheol Kim ,  Victor Lee ,  Teddie Magbitang ,  Robert Miller ,  Eva Simonyi ,  Willi Volksen

发明人： Geraud Dubois ,  James Hedrick ,  Ho-Cheol Kim ,  Victor Lee ,  Teddie Magbitang ,  Robert Miller ,  Eva Simonyi ,  Willi Volksen

IPC分类号： H01L21/31

CPC分类号： H01L21/7682 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02214 ,  H01L21/02282 ,  H01L21/02343 ,  H01L21/31633 ,  H01L21/31695 ,  H01L2221/1047

摘要： Oxycarbosilane materials make excellent matrix materials for the formation of porous low-k materials using incorporated pore generators (porogens). The elastic modulus numbers measured for porous samples prepared in this fashion are 3-6 times higher than porous organosilicates prepared using the sacrificial porogen route. The oxycarbosilane materials are used to produce integrated circuits for use in electronics devices. It is emphasized that this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader quickly to ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the appended issued claims.

摘要翻译： 氧碳硅烷材料制成优良的基质材料，用于形成使用并入的孔隙发生器（致孔剂）的多孔低k材料。 以这种方式制备的多孔样品测量的弹性模量数是使用牺牲致孔剂途径制备的多孔有机硅酸盐的3-6倍。 氧碳硅烷材料用于生产用于电子设备的集成电路。 要强调的是，该摘要被提供以符合要求抽象的规则，这将允许搜索者或其他读者快速地确定技术公开的主题。 提交它的理解是，它不会用于解释或限制所附权利要求的范围或含义。

公开(公告)号：US20050243469A1

公开(公告)日：2005-11-03

申请号：US10835845

申请日：2004-04-29

申请人： Michael Chaw ,  Dan Dawson ,  Craig Hawker ,  James Hedrick ,  Wesley Hillman ,  Teddie Magbitang ,  Dennis McKean ,  Robert Miller ,  Willi Volksen

发明人： Michael Chaw ,  Dan Dawson ,  Craig Hawker ,  James Hedrick ,  Wesley Hillman ,  Teddie Magbitang ,  Dennis McKean ,  Robert Miller ,  Willi Volksen

IPC分类号： G11B5/60

CPC分类号： G11B5/6082 ,  Y10T29/49032 ,  Y10T29/4905 ,  Y10T156/11

摘要： A slider assembly is provided comprising a plurality of sliders bonded by a debondable solid encapsulant comprised of different first and second polymers The solid encapsulant is comprised of a polymer prepared by polymerizing an encapsulant fluid comprising a homogeneous mixture of first and second constituents. The first constituent is comprised of a first monomer suitable for in situ polymerization to form the first polymer. The second constituent is comprised of the second polymer or a second monomer suitable for in situ polymerization to form the second polymer. The first constituent does not substantially react with the second constituent. Each slider has a surface that is free from the encapsulant. The encapsulant-free surfaces are coplanar to each other. Also provided are methods for forming the assembly and methods for patterning a slider surface using the encapsulant.

摘要翻译： 提供了一种滑块组件，其包括由不同的第一和第二聚合物组成的可分散固体密封剂结合的多个滑块。固体密封剂由通过聚合包含第一和第二组分的均匀混合物的密封剂流体制备的聚合物组成。 第一组分由适于原位聚合以形成第一聚合物的第一单体组成。 第二组分由第二聚合物或适于原位聚合形成第二聚合物的第二单体组成。 第一组分基本上不与第二组分反应。 每个滑块具有没有密封剂的表面。 无密封剂的表面彼此共面。 还提供了用于形成组件的方法和使用密封剂来图案化滑块表面的方法。

公开(公告)号：US20070196645A1

公开(公告)日：2007-08-23

申请号：US11358774

申请日：2006-02-21

申请人： Urs Duerig ,  Jane Frommer ,  Bernd Gotsmann ,  Erik Hagberg ,  James Hedrick ,  Armin Knoll ,  Victor Lee ,  Teddie Magbitang ,  Robert Miller ,  Russell Pratt ,  Charles Wade ,  Johannes Windeln

发明人： Urs Duerig ,  Jane Frommer ,  Bernd Gotsmann ,  Erik Hagberg ,  James Hedrick ,  Armin Knoll ,  Victor Lee ,  Teddie Magbitang ,  Robert Miller ,  Russell Pratt ,  Charles Wade ,  Johannes Windeln

IPC分类号： B32B27/00

CPC分类号： G11B9/149 ,  B82Y10/00 ,  G11B9/1454 ,  Y10T428/265 ,  Y10T428/31721

摘要： An approach is presented for designing a polymeric layer for nanometer scale thermo-mechanical storage devices. Cross-linked polyimide oligomers are used as the recording layers in atomic force data storage device, giving significantly improved performance when compared to previously reported cross-linked and linear polymers. The cross-linking of the polyimide oligomers may be tuned to match thermal and force parameters required in read-write-erase cycles. Additionally, the cross-linked polyimide oligomers are suitable for use in nano-scale imaging.

摘要翻译： 提出了一种用于设计用于纳米级热机械存储装置的聚合物层的方法。 交联聚酰亚胺低聚物用作原子力数据存储装置中的记录层，与先前报道的交联和线性聚合物相比，显着提高了性能。 可以调整聚酰亚胺低聚物的交联以匹配读写擦除周期中所需的热和强度参数。 另外，交联聚酰亚胺低聚物适用于纳米级成像。

公开(公告)号：US07229934B2

公开(公告)日：2007-06-12

申请号：US11031418

申请日：2005-01-07

申请人： Geraud Dubois ,  James Hedrick ,  Ho-Cheol Kim ,  Victor Lee ,  Teddie Magbitang ,  Robert Miller ,  Eva Simonyi ,  Willi Volksen

发明人： Geraud Dubois ,  James Hedrick ,  Ho-Cheol Kim ,  Victor Lee ,  Teddie Magbitang ,  Robert Miller ,  Eva Simonyi ,  Willi Volksen

IPC分类号： H01L21/31 ,  H01L21/469

CPC分类号： H01L21/7682 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02214 ,  H01L21/02282 ,  H01L21/02343 ,  H01L21/31633 ,  H01L21/31695 ,  H01L2221/1047

摘要： Oxycarbosilane materials make excellent matrix materials for the formation of porous low-k materials using incorporated pore generators(porogens). The elastic modulus numbers measured for porous samples prepared in this fashion are 3–6 times higher than porous organosilicates prepared using the sacrificial porogen route. The oxycarbosilane materials are used to produce integrated circuits for use in electronics devices.

摘要翻译： 氧碳硅烷材料制成优良的基质材料，用于形成使用并入的孔隙发生器（致孔剂）的多孔低k材料。 以这种方式制备的多孔样品测量的弹性模量数是使用牺牲致孔剂途径制备的多孔有机硅酸盐的3-6倍。 氧碳硅烷材料用于生产用于电子设备的集成电路。

公开(公告)号：US20050068680A1

公开(公告)日：2005-03-31

申请号：US10672011

申请日：2003-09-25

申请人： Nicholas Buchan ,  Michael Chaw ,  Sean Clemenza ,  Dan Dawson ,  Craig Hawker ,  James Hedrick ,  Wesley Hillman ,  Teddie Magbitang ,  Willi Volksen ,  Dennis McKean ,  Robert Miller

发明人： Nicholas Buchan ,  Michael Chaw ,  Sean Clemenza ,  Dan Dawson ,  Craig Hawker ,  James Hedrick ,  Wesley Hillman ,  Teddie Magbitang ,  Willi Volksen ,  Dennis McKean ,  Robert Miller

IPC分类号： G11B5/187 ,  G11B5/60

CPC分类号： G11B5/187 ,  G11B5/60

摘要： A slider assembly is provided comprising a plurality of sliders bonded by a debondable solid encapsulant. The solid encapsulant is comprised of a polymer prepared by polymerizing a mixture of first and second monomers in a nonstoichiometric ratio effective to render the encapsulant debondable. Each slider has a surface that is free from the encapsulant. The encapsulant-free surfaces are coplanar to each other. Also provided are methods for forming the assembly and methods for patterning a slider surface using the encapsulant.

摘要翻译： 提供了一种滑块组件，其包括通过可剥离固体密封剂结合的多个滑块。 固体密封剂由通过以非化学计量比聚合第一和第二单体的混合物而制备的聚合物有效地使密封剂脱粘。 每个滑块具有没有密封剂的表面。 无密封剂的表面彼此共面。 还提供了用于形成组件的方法和使用密封剂来图案化滑块表面的方法。

公开(公告)号：US06670285B2

公开(公告)日：2003-12-30

申请号：US09808726

申请日：2001-03-14

申请人： Craig Jon Hawker ,  James Lupton Hedrick ,  Elbert Emin Huang ,  Victor Yee-Way Lee ,  Teddie Magbitang ,  Robert Dennis Miller ,  Willi Volksen

发明人： Craig Jon Hawker ,  James Lupton Hedrick ,  Elbert Emin Huang ,  Victor Yee-Way Lee ,  Teddie Magbitang ,  Robert Dennis Miller ,  Willi Volksen

IPC分类号： H01L2131

CPC分类号： H01L21/02126 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/31695 ,  H01L23/49894 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/024 ,  Y10S977/788 ,  H01L2924/00

摘要： Dielectric compositions comprised of porous polymeric matrices are prepared using nitrogen-containing polymers as pore-generating agents. The compositions are useful in the manufacture of electronic devices such as integrated circuit devices and integrated circuit packaging devices. The dielectric compositions are prepared by admixing a polymeric nitrogenous porogen with a high temperature, thermosetting host polymer in a suitable solvent, heating the admixture to cure the polymer and provide a vitrified matrix, and then decomposing the porogen using heat, radiation, or a chemical reagent effective to degrade the porogen. The highly porous dielectric materials so prepared have an exceptionally low dielectric constant on the order of 2.5 or less, preferably less than about 2.0. Integrated circuit devices and integrated circuit packaging devices manufactured so as to contain the dielectric material of the invention are provided as well.

公开(公告)号：US20060241194A1

公开(公告)日：2006-10-26

申请号：US11111343

申请日：2005-04-20

申请人： Jennifer Cha ,  Geraud Dubois ,  James Hedrick ,  Ho-Cheol Kim ,  Victor Lee ,  Teddie Magbitang ,  Robert Miller ,  Willi Volksen

发明人： Jennifer Cha ,  Geraud Dubois ,  James Hedrick ,  Ho-Cheol Kim ,  Victor Lee ,  Teddie Magbitang ,  Robert Miller ,  Willi Volksen

IPC分类号： C08J9/00

CPC分类号： C08G63/66 ,  C08J9/26 ,  C08K5/5419 ,  C08L67/00 ,  C08L83/04 ,  C08L83/00

摘要： Substantially or roughly spherical micellar structures useful in the formation of nanoporous materials by templating are disclosed. A roughly spherical micellar structure is formed by organization of one or more spatially unsymmetric organic amphiphilic molecules. Each of those molecules comprises a branched moiety and a second moiety. The branched moiety can form part of either the core or the surface of the spherical micellar structure, depending on the polarity of the environment. The roughly spherical micellar structures form in a thermosetting polymer matrix. They are employed in a templating process whereby the amphiphilic molecules are dispersed in the polymer matrix, the matrix is cured, and the porogens are then removed, leaving nanoscale pores.

公开(公告)号：US07087982B2

公开(公告)日：2006-08-08

申请号：US10366780

申请日：2003-02-13

申请人： Elbert Emin Huang ,  Teddie Magbitang ,  Robert Dennis Miller ,  Willi Volksen

发明人： Elbert Emin Huang ,  Teddie Magbitang ,  Robert Dennis Miller ,  Willi Volksen

IPC分类号： H01L23/58 ,  H01L23/48

CPC分类号： H01L21/02126 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/31695 ,  H01L23/49894 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/024 ,  Y10S977/788 ,  H01L2924/00

摘要： Dielectric compositions comprised of porous polymeric matrices are prepared using nitrogen-containing polymers as pore-generating agents. The compositions are useful in the manufacture of electronic devices such as integrated circuit devices and integrated circuit packaging devices. The dielectric compositions are prepared by admixing a polymeric nitrogenous porogen with a high temperature, thermosetting host polymer in a suitable solvent, heating the admixture to cure the polymer and provide a vitrified matrix, and then decomposing the porogen using heat, radiation, or a chemical reagent effective to degrade the porogen. The highly porous dielectric materials so prepared have an exceptionally low dielectric constant on the order of 2.5 or less, preferably less than about 2.0. Integrated circuit devices and integrated circuit packaging devices manufactured so as to contain the dielectric material of the invention are provided as well.

公开(公告)号：US06812551B2

公开(公告)日：2004-11-02

申请号：US10371270

申请日：2003-02-21

申请人： Craig Jon Hawker ,  James Lupton Hedrick ,  Elbert Emin Huang ,  Victor Yee-Way Lee ,  Teddie Magbitang ,  David Mecerreyes ,  Robert Dennis Miller ,  Willi Volksen

发明人： Craig Jon Hawker ,  James Lupton Hedrick ,  Elbert Emin Huang ,  Victor Yee-Way Lee ,  Teddie Magbitang ,  David Mecerreyes ,  Robert Dennis Miller ,  Willi Volksen

IPC分类号： H01L2352

CPC分类号： H01L21/02203 ,  C09D183/02 ,  C09D183/04 ,  H01L21/02134 ,  H01L21/02137 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/312 ,  H01L21/31695 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10T428/24917 ,  C08L2666/14 ,  C08L2666/04 ,  H01L2924/00

摘要： Defect-free dielectric coatings comprised of porous polymeric matrices are prepared using nitrogen-containing polymers as pore-generating agents. The dielectric coatings are useful in a number of contexts, including the manufacture of electronic devices such as integrated circuit devices and integrated circuit packaging devices. The dielectric coatings are prepared by admixing, in a solvent, a polymeric nitrogenous porogen with a high temperature, thermosetting host polymer miscible therewith, coating a substrate surface with the admixture, heating the uncured coating to cure the host polymer and provide a vitrified, two-phase matrix, and then decomposing the porogen. The dielectric coatings so prepared have few if any defects, and depending on the amount and molecular weight of porogen used, can be prepared so as to have an exceptionally low dielectric constant on the order of 2.5 or less, preferably less than about 2.0. Integrated circuit devices and integrated circuit packaging devices manufactured so as to contain the dielectric material of the invention are provided as well.