公开(公告)号：US4987295A

公开(公告)日：1991-01-22

申请号：US331137

申请日：1989-03-31

Applicant: Kenneth P. Kinnard ,  Richard T. Strong, Jr. ,  Samuel Goldfarb ,  John R. Tower

Inventor： Kenneth P. Kinnard ,  Richard T. Strong, Jr. ,  Samuel Goldfarb ,  John R. Tower

IPC: H01L27/14 ,  H01L27/148 ,  H04N1/03 ,  H04N5/372

CPC classification number: H04N1/1934 ,  H01L27/148 ,  H04N1/03 ,  H04N3/1593

Abstract: A compound imager consists of two or more individual chips, each with at least one line array of sensors thereupon. Each chip has a glass support plate attached to the side from which light reaches the line arrays. The chips are butted together end-to-end to make large line arrays of sensors. Because of imperfections in cutting, the butted surfaces define a gap. Light entering in the region of the gap is either lost or falls on an individual imager other than the one for which it is intended. This results in vignetting and/or crosstalk near the butted region. The gap is filled with an epoxy resin or other similar material which, when hardened, has an index of referaction near that of the glass support plate.

Abstract translation: 复合成像器由两个或更多个单独的芯片组成，每个芯片具有至少一个线阵列的传感器。 每个芯片具有附接到光到达线阵列的一侧的玻璃支撑板。 芯片端对端对接，制成大型传感器阵列。 由于切割缺陷，对接面限定了间隙。 进入差距区域的光线或者丢失或落在单独的成像器上，而不是预期的那个。 这导致对接区域附近的渐晕和/或串扰。 间隙填充有环氧树脂或其它类似的材料，当硬化时，其具有接近玻璃支撑板的参考指数。