公开(公告)号：US06731045B2

公开(公告)日：2004-05-04

申请号：US10042196

申请日：2002-01-11

申请人： Rieko Chujo

发明人： Rieko Chujo

IPC分类号： H01L4108

CPC分类号： H03H9/059 ,  H01L2224/13012 ,  H01L2224/13144 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H03H2009/0019 ,  Y10T29/42 ,  H01L2224/0401

摘要： An attempt is made to reduce the size of a multichip package obtained by mounting a plurality of surface acoustic wave elements having different frequency characteristics in one package. For this purpose, when a plurality of surface acoustic wave elements are face-down bonded to a package, the ultrasound wave application direction is set to a direction substantially perpendicular to the direction in which the surface acoustic wave elements are juxtaposed.

摘要翻译： 尝试通过将具有不同频率特性的多个声表面波元件安装在一个封装中而获得的多芯片封装的尺寸减小。 为此，当将多个表面声波元件面朝下地接合到封装体上时，将超声波施加方向设定为与表面声波元件并置的方向大致垂直的方向。

公开(公告)号：US06404100B1

公开(公告)日：2002-06-11

申请号：US09419610

申请日：1999-10-18

申请人： Rieko Chujo ,  Masayoshi Koshino ,  Kaoru Sakinada

发明人： Rieko Chujo ,  Masayoshi Koshino ,  Kaoru Sakinada

IPC分类号： H03H900

CPC分类号： H03H9/1071 ,  H01L2224/16225 ,  H01L2924/16152 ,  H03H9/02897 ,  H03H9/02929

摘要： A surface acoustic wave apparatus includes a package having a concave-shaped base and a concave-shaped cap and a surface acoustic wave element housed in the package. The base has a mounting surface on which the surface acoustic wave element is mounted and a side wall raised from the periphery of the mounting surface. The side wall of the base is formed lower than the highest part of the surface acoustic wave element mounted on the mounting surface. Since the surface acoustic wave element mounted on the base is raised above the side wall of the base, the surface acoustic wave element is subjected easily to, for example, test, measurement, fault analysis, and others.

摘要翻译： 表面声波装置包括具有凹形基部和凹形帽的封装以及容纳在封装中的表面声波元件。 底座具有安装表面声波元件的安装表面和从安装表面的周边升起的侧壁。 底座的侧壁形成为比安装在安装面上的表面声波元件的最高部分低。 由于安装在基座上的表面声波元件在基座的侧壁上方突出，所以表面声波元件容易进行例如测试，测量，故障分析等。