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1.发明授权
公开(公告)号：US5092510A
公开(公告)日：1992-03-03
申请号：US616152
申请日：1990-11-20
CPC分类号： H05K13/0465 , H05K13/0069
摘要： The method and apparatus of the present invention may be utilized to support a selected mounting point on a circuit board during the mounting an electronic component. An integrated circuit device is selected and positioned adjacent a first side of a circuit board at a desired mounting point utilizing a robotic manipulator and a placement head. A support fixture is then urged into temporary contact with a second side of the circuit board utilizing a flexible mounting system such that minor variations or misalignments between the plane of the support fixture, the circuit board and the placement head are eliminated. In one embodiment of the present invention a flexible fluid filled bag is utilized in conjunction with the support fixture so that the presence of components on the second side of the circuit board may be accommodated while supporting the circuit board during component mounting. Finally, the requirement for providing a robotic manipulator and placement head capable of generating the substantial downward forces necesary to create a bond between a circuit board and an electronic component is eliminated by positioning the placement head and heated bonding tool proximate to the conductive leads of an electronic component and then forcefully urging the support fixture upward toward the heated bonding tool while maintaining the heated bonding tool in a fixed position.
摘要翻译： 本发明的方法和装置可以用于在安装电子部件期间支撑电路板上选定的安装点。 使用机器人操纵器和放置头，在期望的安装点处选择并定位与电路板的第一侧相邻的集成电路器件。 然后，使用柔性安装系统，将支撑固定装置与电路板的第二侧暂时接触，从而消除了支撑固定装置的平面，电路板和放置头之间的微小的变化或不对准。 在本发明的一个实施例中，柔性流体填充的袋与支撑固定装置结合使用，使得可以容纳在电路板的第二侧上的部件的存在，同时在部件安装期间支撑电路板。 最后，通过将放置头和加热的接合工具定位在靠近导电引线的位置，可以消除提供能够产生用于在电路板和电子部件之间形成结合的基本向下的力的机器人操纵器和放置头的要求 然后在将加热的焊接工具保持在固定位置的同时将支撑固定装置向上强制地向着加热的焊接工具推动。
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