Method of fabricating circuits
    1.
    发明授权
    Method of fabricating circuits 失效
    制造电路的方法

    公开(公告)号:US5912187A

    公开(公告)日:1999-06-15

    申请号:US871489

    申请日:1997-06-10

    摘要: A method of fabricating an integrated circuit device is described in which fluorine ions are implanted into the patterned photoresist and the exposed polysilicon layer prior to etching the polysilicon. The ion implantation minimizes the chemical reaction between the photoresist and etchant, thereby significantly reducing the formation of polysilicon etch delta, and also significantly reducing etch delta variation due to pattern density variations.

    摘要翻译: 描述了一种制造集成电路器件的方法,其中在蚀刻多晶硅之前将氟离子注入到图案化的光致抗蚀剂和暴露的多晶硅层中。 离子注入使光致抗蚀剂和蚀刻剂之间的化学反应最小化,从而显着减少了多晶硅蚀刻三角形的形成,并且还显着减少了由于图案密度变化引起的蚀刻δ变化。