公开(公告)号：US07450862B2

公开(公告)日：2008-11-11

申请号：US10392353

申请日：2003-03-19

申请人： Dale C. Flanders ,  Walid Atia ,  Eric E. Fitch ,  Minh Van Le ,  Randal A. Murdza ,  Robert L. Payer ,  Jeffrey A. Korn ,  Xiaomei Wang ,  Walter R. Buchwald ,  L. James Newman, III

发明人： Dale C. Flanders ,  Walid Atia ,  Eric E. Fitch ,  Minh Van Le ,  Randal A. Murdza ,  Robert L. Payer ,  Jeffrey A. Korn ,  Xiaomei Wang ,  Walter R. Buchwald ,  L. James Newman, III

IPC分类号： H04B10/06

CPC分类号： H01S5/02216 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/0683

摘要： A detector system for a fiber optic component is insensitive to stray light. Specifically, the invention comprises a detector chip, which converts received light into an electric signal. A baffle substrate is positioned over the detector chip. This baffle substrate has a transmission port through which an optical signal is transmitted to the detector chip. As a result, light that is not directed to be transmitted through the port is blocked by the baffle substrate. In this way, it rejects stray light that may be present in the hermetic package. A detector substrate is provided on which the detector chip is mounted. This detector substrate preferably comprises electrical traces to which the detector chip is electrically connected. The detector substrate can further comprise bond pads for wire bonding to make electrical connections to the electrical traces.

摘要翻译： 用于光纤部件的检测器系统对杂散光不敏感。 具体地，本发明包括将接收的光转换成电信号的检测器芯片。 挡板基板位于检测器芯片上。 该挡板基板具有传输端口，通过该传输端口将光信号传输到检测器芯片。 结果，不被透射通过端口的光被挡板衬底阻挡。 以这种方式，它拒绝可能存在于密封包装中的杂散光。 设置有检测器芯片安装在其上的检测器基板。 该检测器基板优选地包括检测器芯片电连接到的电迹线。 检测器基板还可以包括用于引线键合的接合焊盘以与电迹线进行电连接。

公开(公告)号：US07081660B2

公开(公告)日：2006-07-25

申请号：US09884844

申请日：2001-06-19

申请人： Robert L. Payer

发明人： Robert L. Payer

IPC分类号： H01L23/495 ,  H01L23/52 ,  H01L23/02

CPC分类号： G02B6/4201 ,  G02B6/4248 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An optoelectronic hermetic package comprises a frame defining a hermetic boundary and an electrical feedthrough assembly on the frame. This electrical feedthrough assembly provides electrical connections between signal wire bond areas within the hermetic boundary to electrical contact areas outside the hermetic boundary. Additionally, according to the invention, ground wire bond pad areas are also provided within the hermetic boundary, the ground wire bond pad areas being electrically connected to each other and/or the frame or other ground plane.

公开(公告)号：US06704150B2

公开(公告)日：2004-03-09

申请号：US10064081

申请日：2002-06-10

申请人： Mona Masghati ,  Livia M. Racz ,  Robert L. Payer ,  Dale C. Flanders

发明人： Mona Masghati ,  Livia M. Racz ,  Robert L. Payer ,  Dale C. Flanders

IPC分类号： G02B702

CPC分类号： G02B6/32 ,  G02B6/327 ,  G02B6/3636 ,  G02B6/3644 ,  G02B6/3656 ,  G02B6/3692 ,  G02B6/4225 ,  G02B6/4226 ,  G02B6/4237 ,  G02B6/4238 ,  G02B6/4244 ,  G02B6/4249 ,  G02B7/003 ,  G02B27/62

摘要： 12 of 12 An optical component is adapted for pick-and-place-style installation on an optical submount or bench and compatible with a chuck of a bonder that picks-up the optical component, places it on the optical bench, and then typically solder bonds the optical component to the bench. In the current implementation, this optical component comprises an optical element, such as an optical fiber, lens, or MOEMS device, that is attached to a plastically deformable mounting structure. The optical component has a bench-attach surface that is used to bond the optical component to an optical bench. Further, the optical component has a bonder chuck engagement surface to which a bonder chuck attaches to manipulate the optical component, such as install it, on the optical bench.

摘要翻译： 12 of 12一个光学部件适用于光学底座或工作台上的拾放式安装，并与拾取光学部件的接合器卡盘兼容，将其放置在光学台上，然后通常焊接 将光学部件连接到工作台上。 在当前的实施方案中，该光学部件包括附接到可塑性变形的安装结构的光学元件，例如光纤，透镜或MOEMS装置。 光学部件具有用于将光学部件粘合到光学台上的台面附接表面。 此外，光学部件具有接合卡盘接合表面，接合卡盘附接到该接合卡盘接合表面以将光学部件（例如安装）光学部件操纵在光学台上。

公开(公告)号：US06404567B2

公开(公告)日：2002-06-11

申请号：US09797530

申请日：2001-03-01

申请人： Mona Masghati ,  Livia M. Racz ,  Robert L. Payer ,  Dale C. Flanders

发明人： Mona Masghati ,  Livia M. Racz ,  Robert L. Payer ,  Dale C. Flanders

IPC分类号： G02B702

CPC分类号： G02B6/32 ,  G02B6/327 ,  G02B6/3636 ,  G02B6/3644 ,  G02B6/3656 ,  G02B6/3692 ,  G02B6/4225 ,  G02B6/4226 ,  G02B6/4237 ,  G02B6/4238 ,  G02B6/4244 ,  G02B6/4249 ,  G02B7/003 ,  G02B27/62

摘要： An optical component is adapted for pick-and-place-style installation on an optical submount or bench and compatible with a chuck of a bonder that picks-up the optical component, places it on the optical bench, and then typically solder bonds the optical component to the bench. In the current implementation, this optical component comprises an optical element, such as an optical fiber, lens, or MOEMS device, that is attached to a plastically deformable mounting structure. The optical component has a bench-attach surface that is used to bond the optical component to an optical bench. Further, the optical component has a bonder chuck engagement surface to which a bonder chuck attaches to manipulate the optical component, such as install it, on the optical bench.

摘要翻译： 光学元件适用于拾光放置式安装在光学底座或台架上，并与拾取光学元件的接合器卡盘兼容，将其放置在光学平台上，然后通常焊接光学 组件到板凳。 在当前的实施方案中，该光学部件包括附接到可塑性变形的安装结构的光学元件，例如光纤，透镜或MOEMS装置。 光学部件具有用于将光学部件粘合到光学台上的台面附接表面。 此外，光学部件具有接合卡盘接合表面，接合卡盘附接到该接合卡盘接合表面以将光学部件（例如安装）光学部件操纵在光学台上。