公开(公告)号：US5094381A

公开(公告)日：1992-03-10

申请号：US616150

申请日：1990-11-20

申请人： Robert A. Amos ,  Joel R. Anstrom ,  Francis W. Bogaczyk ,  Robert W. Kulterman ,  Gilbert B. Nebgen ,  Darryl R. Polk ,  Michael A. Rubsam ,  David P. Watson ,  Terry L. Wilmoth ,  Clifford M. Wood

发明人： Robert A. Amos ,  Joel R. Anstrom ,  Francis W. Bogaczyk ,  Robert W. Kulterman ,  Gilbert B. Nebgen ,  Darryl R. Polk ,  Michael A. Rubsam ,  David P. Watson ,  Terry L. Wilmoth ,  Clifford M. Wood

IPC分类号： H01L21/52 ,  H01L21/00 ,  H01L21/60 ,  H05K13/04 ,  H05K13/08

CPC分类号： H01L21/67144 ,  H05K13/0465 ,  H05K13/08

摘要： The apparatus of the present invention may be utilized for the automated bonding of electronic components to a circuit board. A placement and bonding head is attached to a manipulatable robotic arm and is utilized to select an electronic component having a plurality of conductive leads from a supply of such components and position that component adjacent a plurality of contact pads on a circuit board. While retaining the electronic component within the placement and bonding head, the component is then thermally bonded to the contact pads. In one embodiment of the present invention, an electronic component may be optically inspected while being retained within the placement and bonding head. In another embodiment, thermal bonding is accomplished utilizing a plurality of thermally activatable blades which each include a thermocouple mounted adjacent thereto. Selective low current control signals are then coupled to the placement and bonding head where transformers are utilized to amplify the current prior to coupling the control signal to individually thermally activatable blades. In yet another embodiment of the present invention, the placement and bonding head includes a plenum for supplying inert gas to the bonding site so that the use of flux is not necessary.

公开(公告)号：US4401931A

公开(公告)日：1983-08-30

申请号：US214070

申请日：1980-12-08

申请人： Robert W. Kulterman ,  James M. Rakes ,  Robert H. Sweat, Jr.

发明人： Robert W. Kulterman ,  James M. Rakes ,  Robert H. Sweat, Jr.

IPC分类号： H02P8/12 ,  H02P5/68 ,  H02P8/40 ,  H02K37/00

CPC分类号： H02P5/68 ,  H02P8/40

摘要： In apparatus which uses a plurality of stepper motors for the actuation of various moving members therein, e.g., impact printer apparatus, an expedient is provided wherein at least one pair of stepper motors which operate during mutually exclusive periods share common driver means which are switchable to be connected to the active stepper motor and disconnected from the dormant one. When thus connected to the active stepper motor, the driver means operate in the conventional manner to couple the windings of the active stepper motor to the particular current supply associated with that active motor in a predetermined sequence so that each winding of the active motor is energized during portions of the sequence and deenergized during other portions. The apparatus further includes switching means for selectively connecting and disconnecting the drive means to the first and second stepper motors in accordance with the requirements of the apparatus driven by said stepper motors.

摘要翻译： 在使用多个步进电动机来驱动其中的各种移动部件的设备中，例如冲击打印机装置，提供了一种方案，其中至少一对在相互排斥的周期内操作的步进电动机共享共同的驱动装置，该驱动装置可切换到 连接到有源步进电机，并从休眠状态断开。 当这样连接到有源步进电动机时，驱动装置以常规的方式工作，以将有源步进电动机的绕组以预定的顺序耦合到与有源电动机相关联的特定电流源，使得有源电动机的每个绕组被通电 在序列的部分期间，在其他部分期间断电。 该装置还包括根据由所述步进电动机驱动的装置的要求，选择性地将驱动装置连接到第一和第二步进电动机的开关装置。