公开(公告)号：US06667072B2

公开(公告)日：2003-12-23

申请号：US10023878

申请日：2001-12-21

Applicant: Geoffrey Wen-Tai Shuy ,  Jong-Hong Lu ,  Sheng-Ju Liao ,  Huai-Luh Chang ,  Song-Wein Hong ,  Ruey-Cheng Huang

Inventor： Geoffrey Wen-Tai Shuy ,  Jong-Hong Lu ,  Sheng-Ju Liao ,  Huai-Luh Chang ,  Song-Wein Hong ,  Ruey-Cheng Huang

IPC: B05D512

CPC classification number: C04B41/009 ,  C04B41/52 ,  C04B41/89 ,  C04B2111/00844 ,  H01L21/481 ,  H05K1/0306 ,  H05K3/38 ,  C04B41/5022 ,  C04B41/4582 ,  C04B41/5024 ,  C04B41/4572 ,  C04B41/5155 ,  C04B35/10

Abstract: This invention provides a concept of using porous materials on ceramic substrate planarization. This planarized substrate consists of a ceramic substrate, a buffer layer, and a nanostructure layer. The ceramic substrate provides structural strength and surface-mount capability. The buffer layer provides the adhesion between the substrate and the nanostructure layer. The nanostructure layer provides the required surface smoothness of the ceramic substrates for performing thin-film processing techniques and enhances adhesion for metallization and electronic materials.

Abstract translation: 本发明提供了在陶瓷衬底平面化上使用多孔材料的概念。 该平坦化衬底由陶瓷衬底，缓冲层和纳米结构层组成。 陶瓷基板提供结构强度和表面贴装能力。 缓冲层提供了衬底和纳米结构层之间的粘附。 纳米结构层提供陶瓷基底所需的表面平滑度，用于执行薄膜加工技术并增强金属化和电子材料的粘合性。