公开(公告)号：US06478977B1

公开(公告)日：2002-11-12

申请号：US09500238

申请日：2000-02-08

申请人： Shigeo Moriyama ,  Katsuhiko Yamaguchi ,  Yoshio Homma ,  Sunao Matsubara ,  Yoshihiro Ishida ,  Ryousei Kawa-ai

发明人： Shigeo Moriyama ,  Katsuhiko Yamaguchi ,  Yoshio Homma ,  Sunao Matsubara ,  Yoshihiro Ishida ,  Ryousei Kawa-ai

IPC分类号： C01B3300

CPC分类号： B24B37/11 ,  B24B27/0076 ,  B24B37/04 ,  B24B37/042 ,  B24D3/002 ,  B24D3/28 ,  H01L21/31053

摘要： The present invention relates to a polishing method using a grindstone comprising abrasive grains and a bonding resin for bonding the abrasive grains, as well as to a polishing apparatus to be used for the polishing method. By using a resin for bonding abrasive grains, it is possible to obtain a grindstone having a desired modulus of elasticity. With such a grindstone, the surface of a substrate having concave and convex portions can be rendered uniformly flat, irrespective of the size of the concave and convex portions. Further, by first polishing the substrate surface with a polishing tool of a small elastic modulus and thereafter polishing it with a polishing tool of a large elastic modulus, it is possible to obtain a polished surface of reduced damage. The method of the invention is effective in planarizing various substrate surfaces having concave and convex portions.

摘要翻译： 本发明涉及使用包括磨粒的磨石和用于粘结磨粒的粘合树脂的抛光方法，以及用于抛光方法的抛光装置。 通过使用用于粘合磨粒的树脂，可以获得具有所需弹性模量的磨石。 利用这样的磨石，与凹部和凸部的尺寸无关地，具有凹凸部的基板的表面能够均匀地平坦化。 此外，通过用具有小的弹性模量的抛光工具首先抛光基板表面，然后用具有大的弹性模量的抛光工具进行抛光，可以获得损伤减小的抛光表面。 本发明的方法对于具有凹凸部分的各种基板表面进行平面化是有效的。

公开(公告)号：US06180020B2

公开(公告)日：2001-01-30

申请号：US09029903

申请日：1998-03-12

申请人： Shigeo Moriyama ,  Katsuhiko Yamaguchi ,  Yoshio Homma ,  Sunao Matsubara ,  Yoshihiro Ishida ,  Ryousei Kawa-ai

发明人： Shigeo Moriyama ,  Katsuhiko Yamaguchi ,  Yoshio Homma ,  Sunao Matsubara ,  Yoshihiro Ishida ,  Ryousei Kawa-ai

IPC分类号： C01B3300

CPC分类号： H01L21/31053 ,  B24B27/0076 ,  B24B37/04 ,  B24B37/042 ,  B24B37/24 ,  B24B37/245 ,  B24D3/002 ,  B24D3/28

摘要： The present invention relates to a polishing method using a grindstone comprising abrasive grains and a bonding resin for bonding the abrasive grains, as well as to a polishing apparatus to be used for the polishing method. By using a resin for bonding abrasive grains, it is possible to obtain a grindstone having a desired modulus of elasticity. With such a grindstone, the surface of a substrate having concave and convex portions can be rendered uniformly flat, irrespective of the size of the concave and convex portions. Further, by first polishing the substrate surface with a polishing tool of a small elastic modulus and thereafter polishing it with a polishing tool of a large elastic modulus, it is possible to obtain a polished surface of reduced damage. The method of the invention is effective in planarizing various substrate surfaces having concave and convex portions.

摘要翻译： 本发明涉及使用包括磨粒的磨石和用于粘结磨粒的粘合树脂的抛光方法，以及用于抛光方法的抛光装置。 通过使用用于粘合磨粒的树脂，可以获得具有所需弹性模量的磨石。 利用这样的磨石，与凹部和凸部的尺寸无关地，具有凹凸部的基板的表面能够均匀地平坦化。 此外，通过用具有小的弹性模量的抛光工具首先抛光基板表面，然后用具有大的弹性模量的抛光工具进行抛光，可以获得损伤减小的抛光表面。 本发明的方法对于具有凹凸部分的各种基板表面进行平面化是有效的。