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公开(公告)号：US06478977B1
公开(公告)日：2002-11-12
申请号：US09500238
申请日：2000-02-08
申请人： Shigeo Moriyama , Katsuhiko Yamaguchi , Yoshio Homma , Sunao Matsubara , Yoshihiro Ishida , Ryousei Kawa-ai
发明人： Shigeo Moriyama , Katsuhiko Yamaguchi , Yoshio Homma , Sunao Matsubara , Yoshihiro Ishida , Ryousei Kawa-ai
IPC分类号： C01B3300
CPC分类号： B24B37/11 , B24B27/0076 , B24B37/04 , B24B37/042 , B24D3/002 , B24D3/28 , H01L21/31053
摘要： The present invention relates to a polishing method using a grindstone comprising abrasive grains and a bonding resin for bonding the abrasive grains, as well as to a polishing apparatus to be used for the polishing method. By using a resin for bonding abrasive grains, it is possible to obtain a grindstone having a desired modulus of elasticity. With such a grindstone, the surface of a substrate having concave and convex portions can be rendered uniformly flat, irrespective of the size of the concave and convex portions. Further, by first polishing the substrate surface with a polishing tool of a small elastic modulus and thereafter polishing it with a polishing tool of a large elastic modulus, it is possible to obtain a polished surface of reduced damage. The method of the invention is effective in planarizing various substrate surfaces having concave and convex portions.
摘要翻译： 本发明涉及使用包括磨粒的磨石和用于粘结磨粒的粘合树脂的抛光方法，以及用于抛光方法的抛光装置。 通过使用用于粘合磨粒的树脂，可以获得具有所需弹性模量的磨石。 利用这样的磨石，与凹部和凸部的尺寸无关地，具有凹凸部的基板的表面能够均匀地平坦化。 此外，通过用具有小的弹性模量的抛光工具首先抛光基板表面，然后用具有大的弹性模量的抛光工具进行抛光，可以获得损伤减小的抛光表面。 本发明的方法对于具有凹凸部分的各种基板表面进行平面化是有效的。
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公开(公告)号：US06180020B2
公开(公告)日：2001-01-30
申请号：US09029903
申请日：1998-03-12
申请人： Shigeo Moriyama , Katsuhiko Yamaguchi , Yoshio Homma , Sunao Matsubara , Yoshihiro Ishida , Ryousei Kawa-ai
发明人： Shigeo Moriyama , Katsuhiko Yamaguchi , Yoshio Homma , Sunao Matsubara , Yoshihiro Ishida , Ryousei Kawa-ai
IPC分类号： C01B3300
CPC分类号： H01L21/31053 , B24B27/0076 , B24B37/04 , B24B37/042 , B24B37/24 , B24B37/245 , B24D3/002 , B24D3/28
摘要： The present invention relates to a polishing method using a grindstone comprising abrasive grains and a bonding resin for bonding the abrasive grains, as well as to a polishing apparatus to be used for the polishing method. By using a resin for bonding abrasive grains, it is possible to obtain a grindstone having a desired modulus of elasticity. With such a grindstone, the surface of a substrate having concave and convex portions can be rendered uniformly flat, irrespective of the size of the concave and convex portions. Further, by first polishing the substrate surface with a polishing tool of a small elastic modulus and thereafter polishing it with a polishing tool of a large elastic modulus, it is possible to obtain a polished surface of reduced damage. The method of the invention is effective in planarizing various substrate surfaces having concave and convex portions.
摘要翻译： 本发明涉及使用包括磨粒的磨石和用于粘结磨粒的粘合树脂的抛光方法，以及用于抛光方法的抛光装置。 通过使用用于粘合磨粒的树脂，可以获得具有所需弹性模量的磨石。 利用这样的磨石，与凹部和凸部的尺寸无关地，具有凹凸部的基板的表面能够均匀地平坦化。 此外，通过用具有小的弹性模量的抛光工具首先抛光基板表面，然后用具有大的弹性模量的抛光工具进行抛光，可以获得损伤减小的抛光表面。 本发明的方法对于具有凹凸部分的各种基板表面进行平面化是有效的。
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3.发明授权公开(公告)号：US07166013B2
公开(公告)日：2007-01-23
申请号：US11004991
申请日：2004-12-07
申请人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
发明人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
CPC分类号： B24B53/017 , B24B37/042 , B24B41/04 , B24B53/12
摘要： The present invention relates to a polishing apparatus, and a semiconductor manufacturing method using the apparatus. Dressing of a grindstone surface is ground by sizing processing whereby dressing of a tool surface can be done while preventing occurrence of cracks on the grindstone surface which is the cause for occurrence of scratches. Further, flatness of the surface of a dressing tool can be guaranteed because of sizing cutting-in; even if a thick grindstone of a few centimeters is used, the flatness can be maintained to the end; and processing with less in-face unevenness can be always carried out. Therefore, the life of the dressing tool can be greatly extended.Further, the present sizing-dressing is carried out jointly with processing of a wafer to thereby enable improvement of throughput of the apparatus as well as maintenance of a processing rate.The present apparatus and method are effective for planarization of various substrate surfaces having irregularities.
摘要翻译： 本发明涉及一种抛光装置以及使用该装置的半导体制造方法。 磨石表面的磨合通过施胶处理进行研磨，由此可以进行工具表面的修整，同时防止在磨石表面产生裂纹，这是产生划痕的原因。 此外，可以保证修整工具的表面的平整度，因为切割的尺寸大小; 即使使用了几厘米厚的砂轮，也可以保持平坦度， 并且可以总是执行具有较少的面内不均匀性的处理。 因此，修整工具的寿命可以大大延长。 此外，与晶片的处理联合进行本施胶修整，从而能够提高装置的生产量以及维持处理速度。 本装置和方法对于具有不规则性的各种衬底表面的平坦化是有效的。
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公开(公告)号：US20060057940A1
公开(公告)日：2006-03-16
申请号：US11267306
申请日：2005-11-07
申请人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
发明人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
CPC分类号： B24B53/017 , B24B37/042 , B24B41/04 , B24B53/02 , B24B53/12
摘要： The present invention relates to a polishing apparatus, and a semiconductor manufacturing method using the apparatus. Dressing of a grindstone surface is ground by sizing processing whereby dressing of a tool surface can be done while preventing occurrence of cracks on the grindstone surface which is the cause for occurrence of scratches. Further, flatness of the surface of a dressing tool can be guaranteed because of sizing cutting-in; even if a thick grindstone of a few centimeters is used, the flatness can be maintained to the end; and processing with less in-face unevenness can be always carried out. Therefore, the life of the dressing tool can be greatly extended. Further, the present sizing-dressing is carried out jointly with processing of a wafer to thereby enable improvement of throughput of the apparatus as well as maintenance of a processing rate. The present apparatus and method are effective for planarization of various substrate surfaces having irregularities.
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公开(公告)号：US07137866B2
公开(公告)日：2006-11-21
申请号：US11267306
申请日：2005-11-07
申请人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
发明人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
IPC分类号： B24B49/00
CPC分类号： B24B53/017 , B24B37/042 , B24B41/04 , B24B53/02 , B24B53/12
摘要： The present invention relates to a polishing apparatus, and a semiconductor manufacturing method using the apparatus. Dressing of a grindstone surface is ground by sizing processing whereby dressing of a tool surface can be done while preventing occurrence of cracks on the grindstone surface which is the cause for occurrence of scratches. Further, flatness of the surface of a dressing tool can be guaranteed because of sizing cutting-in; even if a thick grindstone of a few centimeters is used, the flatness can be maintained to the end; and processing with less in-face unevenness can be always carried out. Therefore, the life of the dressing tool can be greatly extended.Further, the present sizing-dressing is carried out jointly with processing of a wafer to thereby enable improvement of throughput of the apparatus as well as maintenance of a processing rate.The present apparatus and method are effective for planarization of various substrate surfaces having irregularities.
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6.发明申请公开(公告)号：US20050095960A1
公开(公告)日：2005-05-05
申请号：US11004991
申请日：2004-12-07
申请人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
发明人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
CPC分类号： B24B53/017 , B24B37/042 , B24B41/04 , B24B53/12
摘要： The present invention relates to a polishing apparatus, and a semiconductor manufacturing method using the apparatus. Dressing of a grindstone surface is ground by sizing processing whereby dressing of a tool surface can be done while preventing occurrence of cracks on the grindstone surface which is the cause for occurrence of scratches. Further, flatness of the surface of a dressing tool can be guaranteed because of sizing cutting-in; even if a thick grindstone of a few centimeters is used, the flatness can be maintained to the end; and processing with less in-face unevenness can be always carried out. Therefore, the life of the dressing tool can be greatly extended. Further, the present sizing-dressing is carried out jointly with processing of a wafer to thereby enable improvement of throughput of the apparatus as well as maintenance of a processing rate. The present apparatus and method are effective for planarization of various substrate surfaces having irregularities.
摘要翻译： 本发明涉及一种抛光装置以及使用该装置的半导体制造方法。 磨石表面的磨合通过施胶处理进行研磨，由此可以进行工具表面的修整，同时防止在磨石表面产生裂纹，这是产生划痕的原因。 此外，可以保证修整工具的表面的平整度，因为切割的尺寸大小; 即使使用了几厘米厚的砂轮，也可以保持平坦度， 并且可以总是执行具有较少的面内不均匀性的处理。 因此，修整工具的寿命可以大大延长。 此外，与晶片的处理联合进行本施胶修整，从而能够提高装置的生产量以及维持处理速度。 本装置和方法对于具有不规则性的各种衬底表面的平坦化是有效的。
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7.发明授权公开(公告)号：US08582921B2
公开(公告)日：2013-11-12
申请号：US13278544
申请日：2011-10-21
申请人： Yoshihiro Ishida
发明人： Yoshihiro Ishida
IPC分类号： G06K9/32
CPC分类号： G06T9/20
摘要： When an image including a composite figure made of a predefined figure and a free-form figure is scanned, the position and shape of the free-form figure and the predefined figure are appropriately adjusted. The composite figure is separated into a predefined figure and a free-form figure. With respect to the separated predefined figure, a representative point is set at a predetermined position according to the type of the predefined figure and a representative point is set for the free-form figure based on a criterion according to a type of the free-form figure. If the representative point of a predefined figure is in the vicinity of the representative point of the free-form figure, the free-form figure is corrected based on the position of the representative point of the free-form figure and the position of the representative point of the predefined figure.
摘要翻译： 当扫描包括由预定义图形和自由形状图形构成的复合图形的图像时，适当地调整自由形状图形和预定义图形的位置和形状。 复合图被分成预定义的图形和自由形状的图形。 对于分离的预定义图形，根据预定义图形的类型将代表点设置在预定位置，并且基于根据自由形式的类型的标准为自由形状图设置代表点 数字。 如果预定义数字的代表点在自由形式数字的代表点附近，则自由形式数字将根据自由形式数字的代表点的位置和代表的位置进行更正 点的预定义图。
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公开(公告)号：US08417029B2
公开(公告)日：2013-04-09
申请号：US12489986
申请日：2009-06-23
申请人： Yoshihiro Ishida , Tomotoshi Kanatsu , Taeko Yamazaki , Naoki Ito
发明人： Yoshihiro Ishida , Tomotoshi Kanatsu , Taeko Yamazaki , Naoki Ito
CPC分类号： H04N1/41 , G06K9/00456 , G06T7/11 , G06T2207/10008
摘要： An image in which at least one color component among a plurality of color components in an input color image has a resolution lower than that of the other color components is held as a base image. A rectangular region that includes an object image is extracted, a region of the object image and a region of a background image are specified in the rectangular region, and fill-up processing of the specified object image is executed in the base image. Fill-up processing executed at a boundary between the object image and the base image differs from fill-up processing executed at a boundary between the object image and the background image.
摘要翻译： 其中输入彩色图像中的多个颜色分量中的至少一个颜色分量的分辨率低于其它颜色分量的分辨率的图像被保持为基本图像。 提取包括对象图像的矩形区域，在矩形区域中指定对象图像的区域和背景图像的区域，并且在基本图像中执行指定对象图像的填充处理。 在对象图像和基本图像之间的边界处执行的填充处理不同于在对象图像和背景图像之间的边界处执行的填充处理。
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公开(公告)号：US07940965B2
公开(公告)日：2011-05-10
申请号：US12349139
申请日：2009-01-06
申请人： Yoshihiro Ishida
发明人： Yoshihiro Ishida
CPC分类号： H04N5/232 , G06K9/00228 , H04N5/23219
摘要： According to the present invention, the face of a subject person can be rapidly detected. An image input unit inputs an image to be processed. A photographing-position input unit inputs photographing-position information attached to the processed image. An angle-range information determination unit determines an angle range, where face detection should be performed to the processed image, on the basis of the information obtained by the photographing-position information input unit. On the basis of information indicating the determined angle range, under the control of a process control unit, a face detection unit performs face detection to the processed image input by the image input unit in predetermined angle increments. A face integration unit integrates all of face data detected by a basic-angle-range face detection unit into face information and then outputs the information.
摘要翻译： 根据本发明，可以快速地检测被摄体的脸部。 图像输入单元输入要处理的图像。 拍摄位置输入单元输入附加到处理图像的拍摄位置信息。 角度范围信息确定单元基于由拍摄位置信息输入单元获得的信息来确定对处理后的图像进行面部检测的角度范围。 基于指示确定的角度范围的信息，在处理控制单元的控制下，面部检测单元以预定的角度增量对由图像输入单元输入的处理图像执行面部检测。 面部积分单元将由基准角度范围面部检测单元检测出的全部面部数据整合到面部信息中，然后输出该信息。
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公开(公告)号：US20100167507A1
公开(公告)日：2010-07-01
申请号：US12601993
申请日：2008-05-13
IPC分类号： H01L21/306 , C23C16/513 , C23C16/511 , C23C16/52
CPC分类号： H01L21/2236 , H01J37/32412
摘要： A plasma doping apparatus implants an impurity element into a surface of a processing target object W by using plasma. The apparatus includes a high frequency power supply 72 configured to supply a high frequency bias power to a mounting table 34 installed within a processing chamber 32; a gas feed unit 96 configured to supply a doping gas containing an impurity element into the processing chamber 32; and a plasma generation unit 78 configured to generate the plasma within the processing chamber 32. In accordance with this apparatus, a portion doped with the impurity element can be made very thin, and the impurity element can be rapidly doped in a high concentration.
摘要翻译： 等离子体掺杂装置通过使用等离子体将杂质元素植入处理对象物W的表面。 该装置包括被配置为向安装在处理室32内的安装台34提供高频偏置功率的高频电源72; 气体供给单元96，被配置为将含有杂质元素的掺杂气体供给到处理室32中; 以及等离子体生成单元78，其被配置为在处理室32内产生等离子体。根据该装置，可以使掺杂有杂质元素的部分非常薄，并且可以以高浓度快速掺杂杂质元素。
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