公开(公告)号：US06287192B1

公开(公告)日：2001-09-11

申请号：US09326655

申请日：1999-06-07

申请人： Sue-ryeon Kim ,  Sueng-uhn Kim ,  Jae-kang Jeon ,  Sa-moon Hong

发明人： Sue-ryeon Kim ,  Sueng-uhn Kim ,  Jae-kang Jeon ,  Sa-moon Hong

IPC分类号： B24B719

CPC分类号： B24B37/04 ,  B24B1/04 ,  B24B57/02

摘要： A system for supplying slurry to a processing facility, includes a tank containing the slurry, and slurry supply piping connected to the tank to allow the slurry to flow from the tank to the processing facility. A sonic wave generator is disposed along the slurry supply piping, such that sonic waves are propagated through the slurry. The sonic waves prevent the clustering of small primary abrasive particles into larger secondary abrasive particles, or break apart any clustered secondary particles, which may cause fine scratches on the surface of a wafer during a polishing operation.

摘要翻译： 向处理设备供给浆料的系统包括容纳浆料的罐和连接到罐的浆料供给管道，以允许浆料从罐流到处理设备。 声波发生器沿着浆料供应管道设置，使得声波传播通过浆料。 声波防止小型初级磨料颗粒聚集成较大的次级磨料颗粒，或分离任何聚集的二次颗粒，这可能在抛光操作过程中造成晶片表面上的细小划痕。