公开(公告)号：US5972293A

公开(公告)日：1999-10-26

申请号：US61990

申请日：1998-04-17

申请人： Seung-uhn Kim ,  Yun-chul Oh ,  Sue-ryeon Kim ,  Jung-sung Hwang

发明人： Seung-uhn Kim ,  Yun-chul Oh ,  Sue-ryeon Kim ,  Jung-sung Hwang

IPC分类号： H01L21/304 ,  A01N37/16 ,  A01N59/00 ,  A61L2/18 ,  B01D65/02 ,  C02F1/32 ,  C02F1/44 ,  C02F1/50 ,  C02F1/72

CPC分类号： A61L2/186 ,  A01N37/16 ,  B01D65/022 ,  C02F1/444 ,  C02F1/50 ,  C02F1/722 ,  B01D2321/08 ,  B01D2321/162 ,  B01D2321/343 ,  C02F1/32 ,  C02F2103/04 ,  Y10S210/90

摘要： Compositions for making ultrapure water in microelectronic device fabrication processes comprise hydrogen peroxide, peracetic acid, and water. Methods of sterilizing ultrapure water delivery systems for use in microelectronic device fabrication processes comprise contacting ultrapure water delivery systems with water having temperatures ranging from about 26.degree. C. to about 40.degree. C.; and sterilizing the ultrapure water delivery systems with compositions comprising hydrogen peroxide, peracetic acid, and water. The ultrapure water delivery systems comprise water tanks, heat exchangers in fluid communication with the water tanks, ultraviolet sterilizers in fluid communication with the heat exchangers, OR-polishers in fluid communication with the ultraviolet sterilizers, MB-polishers in fluid communication with the OR-polishers, and ultrafilters in fluid communication with the OR-polishers. The compositions employed in the sterilizing step do not contact the OR-polishers and the MB-polishers.

摘要翻译： 用于在微电子器件制造方法中制造超纯水的组合物包括过氧化氢，过乙酸和水。 用于微电子器件制造工艺的超纯水输送系统的灭菌方法包括使超纯水输送系统与约26℃至约40℃温度范围内的水接触。 并用包含过氧化氢，过乙酸和水的组合物对超纯水输送系统进行灭菌。 超纯水输送系统包括水箱，与水箱流体连通的热交换器，与热交换器流体连通的紫外线灭菌器，与紫外线灭菌器流体连通的OR抛光机，与OR- 抛光机和超滤器与OR抛光机流体连通。 灭菌步骤中使用的组合物不接触OR抛光机和MB抛光机。

公开(公告)号：US06814835B2

公开(公告)日：2004-11-09

申请号：US10084198

申请日：2002-02-28

申请人： Seung-un Kim ,  Seung-ki Chae ,  Je-Gu Lee ,  Sue-Ryeon Kim

发明人： Seung-un Kim ,  Seung-ki Chae ,  Je-Gu Lee ,  Sue-Ryeon Kim

IPC分类号： C23F102

CPC分类号： B24B37/04 ,  B24B57/02 ,  C23F3/00 ,  H01L21/31053 ,  H01L21/3212 ,  Y10T137/0971

摘要： An apparatus for supplying chemicals in a chemical mechanical polishing (CMP) process includes a plurality of chemical solution supply sources for supplying different chemical solutions in a pump-less manner by using a pressure applied at the chemical solution supply sources, each supply source having an associated feed line, re-circulating line, and means for measuring and controlling flow rates of the chemical solutions supplied through the feed lines. The chemical solutions are delivered via a plurality of delivery lines to a mixer, thereby providing a mixed chemical solution to a chemical injection part of a polishing apparatus. Each means for measuring and controlling flow rates is mounted in the feed lines.

公开(公告)号：US06287192B1

公开(公告)日：2001-09-11

申请号：US09326655

申请日：1999-06-07

申请人： Sue-ryeon Kim ,  Sueng-uhn Kim ,  Jae-kang Jeon ,  Sa-moon Hong

发明人： Sue-ryeon Kim ,  Sueng-uhn Kim ,  Jae-kang Jeon ,  Sa-moon Hong

IPC分类号： B24B719

CPC分类号： B24B37/04 ,  B24B1/04 ,  B24B57/02

摘要： A system for supplying slurry to a processing facility, includes a tank containing the slurry, and slurry supply piping connected to the tank to allow the slurry to flow from the tank to the processing facility. A sonic wave generator is disposed along the slurry supply piping, such that sonic waves are propagated through the slurry. The sonic waves prevent the clustering of small primary abrasive particles into larger secondary abrasive particles, or break apart any clustered secondary particles, which may cause fine scratches on the surface of a wafer during a polishing operation.

摘要翻译： 向处理设备供给浆料的系统包括容纳浆料的罐和连接到罐的浆料供给管道，以允许浆料从罐流到处理设备。 声波发生器沿着浆料供应管道设置，使得声波传播通过浆料。 声波防止小型初级磨料颗粒聚集成较大的次级磨料颗粒，或分离任何聚集的二次颗粒，这可能在抛光操作过程中造成晶片表面上的细小划痕。

公开(公告)号：US06129845A

公开(公告)日：2000-10-10

申请号：US167669

申请日：1998-10-07

申请人： Sue-ryeon Kim ,  Hyeon-jun Kim ,  Youn-chul Oh ,  Seung-un Kim

发明人： Sue-ryeon Kim ,  Hyeon-jun Kim ,  Youn-chul Oh ,  Seung-un Kim

IPC分类号： C02F1/44 ,  B01J19/12 ,  B01J21/06 ,  B01J35/02 ,  C02F1/20 ,  C02F1/28 ,  C02F1/32 ,  C02F1/42 ,  C02F1/72 ,  C02F9/00 ,  H01L21/304

CPC分类号： C02F1/725 ,  B01J19/123 ,  C02F1/32 ,  Y10S210/90

摘要： A photo-oxidation device of a water treatment system photo-oxidizes organic material, in particular, aromatic organic material, in the water to facilitate its removal from the water. The photo-oxidation device includes a UV lamp, a flow channel in which the UV lamp is disposed, and a catalyst of an oxidation reaction between an organic material and the UV radiation emitted by the UV lamp. The UV radiation emitted from the UV lamp illuminates the flow channel while the water passes through the flow channel. The catalyst, on the other hand, is fixed to an inner wall of the flow channel to foster the oxidation of the organic material by the UV radiation. The water treatment system in which the photo-oxidation device is incorporated, includes a pre-treatment unit having particle filters, a first treatment section, and a second treatment section. The first treatment section has a reverse osmosis unit in which salts are removed from the water, a gas treatment unit in which gases are removed form the water, a first one of the photo-oxidation devices, and an ion-exchange unit in which ions are removed from the water. The second treatment section has a second photo-oxidation device, a second ion-exchange unit, and a particle-removing filter.

摘要翻译： 水处理系统的光氧化装置在水中光氧化有机材料，特别是芳族有机材料，以便于其从水中除去。 光氧化装置包括UV灯，其中设置有UV灯的流动通道，以及有机材料与由UV灯发射的UV辐射之间的氧化反应的催化剂。 从UV灯发射的紫外线辐射照射流道，同时水通过流道。 另一方面，催化剂被固定到流动通道的内壁，以通过UV辐射促进有机材料的氧化。 包含光氧化装置的水处理系统包括具有颗粒过滤器的预处理单元，第一处理部和第二处理部。 第一处理部具有反渗透单元，其中从水中除去盐，从水中除去气体的气体处理单元，第一个光氧化装置，以及离子交换单元，其中离子 从水中取出。 第二处理部分具有第二光氧化装置，第二离子交换单元和颗粒除去过滤器。

公开(公告)号：US6040254A

公开(公告)日：2000-03-21

申请号：US168095

申请日：1998-10-08

申请人： Chang-su Lim ,  Hyeog-ki Kim ,  Sue-ryeon Kim ,  Il-kyoung Kim

发明人： Chang-su Lim ,  Hyeog-ki Kim ,  Sue-ryeon Kim ,  Il-kyoung Kim

IPC分类号： A41D13/00 ,  A41D31/02 ,  B32B5/02 ,  B32B5/26 ,  B32B27/12 ,  D03D1/00 ,  D03D15/00 ,  D04B21/00 ,  D06N7/00 ,  B32B3/00

CPC分类号： A41D31/02 ,  B32B27/12 ,  Y10T156/10 ,  Y10T428/2481 ,  Y10T428/24818 ,  Y10T428/24826 ,  Y10T442/2008 ,  Y10T442/2418 ,  Y10T442/2475 ,  Y10T442/3179 ,  Y10T442/3293 ,  Y10T442/365 ,  Y10T442/3854 ,  Y10T442/40

摘要： A dust-proof fabric is disclosed. The fabric comprises an inner knit fabric layer, an intermediate layer of a moisture absorbent polyurethane film and a high density woven polyester fabric outer layer. The outer layer contains a first set of spaced apart conductive yarns aligned with one another in the warp direction and a second set of spaced apart conductive yarns aligned in the weft direction.

摘要翻译： 公开了一种防尘织物。 织物包括内部编织织物层，吸湿性聚氨酯膜的中间层和高密度编织聚酯织物外层。 外层包含在经向上彼此对准的第一组间隔开的导电纱线和沿着纬向对准的第二组间隔开的导电纱线。

公开(公告)号：US06910954B2

公开(公告)日：2005-06-28

申请号：US10145806

申请日：2002-05-16

申请人： Sue-Ryeon Kim ,  Seung-Un Kim ,  Seung-Ki Chae ,  Je-Gu Lee ,  Seung-Hoon Ahn

发明人： Sue-Ryeon Kim ,  Seung-Un Kim ,  Seung-Ki Chae ,  Je-Gu Lee ,  Seung-Hoon Ahn

IPC分类号： B01F3/12 ,  B01F15/00 ,  B24B37/00 ,  B24B57/02 ,  H01L21/304 ,  B24B1/00

CPC分类号： B24B57/02 ,  B01F3/1221 ,  B01F3/1271 ,  B01F15/00123 ,  B01F2003/1285

摘要： A computer-controlled slurry supplying apparatus for providing abrasive slurry to a chemical mechanical polishing (CMP) machine in a semiconductor manufacturing process preferably comprises a storage portion for accepting and storing a quantity of undiluted slurry, a mixing portion for accepting undiluted slurry from the storage portion and mixing with a diluting solution to created a diluted slurry, a supply portion for holding the diluted slurry, and at least one point-of-use mixing unit for mixing at least one chemical additive to the diluted slurry at or near a dispensing nozzle at the point of application. Each of the above portions of the slurry supplying apparatus further includes a re-circulation means for keep solutions in a mixed and agitated state. A method for using the slurry supplying apparatus comprises steps of controllably operating various valves, pumps, and sensors to maintain a desired slurry composition and flow rate.

摘要翻译： 一种用于在半导体制造工艺中向化学机械抛光（CMP）机器提供磨料浆料的计算机控制的浆料供应装置优选地包括用于接收和存储一定数量的未稀释浆料的存储部分，用于从储存器接收未稀释浆料的混合部分 并与稀释溶液混合以产生稀释的浆料，用于保存稀释浆料的供应部分和至少一个使用点的混合单元，用于将至少一种化学添加剂与分配喷嘴处或附近的稀释浆料混合 在应用点。 浆料供给装置的上述各部分还包括用于将溶液保持在混合和搅拌状态的再循环装置。 使用浆料供给装置的方法包括可控地操作各种阀，泵和传感器以维持所需的浆料组成和流速的步骤。

公开(公告)号：US06348116B1

公开(公告)日：2002-02-19

申请号：US09468320

申请日：1999-12-21

申请人： Chang-su Lim ,  Hyeog-ki Kim ,  Sue-ryeon Kim ,  Il-kyoung Kim

发明人： Chang-su Lim ,  Hyeog-ki Kim ,  Sue-ryeon Kim ,  Il-kyoung Kim

IPC分类号： D03D2700

CPC分类号： B32B27/12 ,  A41D31/02 ,  B32B5/024 ,  B32B5/026 ,  B32B7/14 ,  B32B27/40 ,  B32B2262/0276 ,  B32B2375/00 ,  Y10T156/10 ,  Y10T428/2481 ,  Y10T428/24818 ,  Y10T428/24826 ,  Y10T442/2008 ,  Y10T442/2418 ,  Y10T442/2475 ,  Y10T442/3179 ,  Y10T442/3293 ,  Y10T442/365 ,  Y10T442/3854 ,  Y10T442/40

摘要： A dustproof fabric for use in manufacturing a smock to be worn in a clean room of a semiconductor fabrication facility includes an inner layer of a knitted fabric, an intermediate layer attached to the inner layer and formed of a non-micro porous polyurethane resin film possessing a high degree of moisture absorbency, and an outer layer attached to the intermediate layer and formed of a high density polyester woven fabric containing conductive yarn in the warp and weft.

摘要翻译： 用于制造要在半导体制造设备的洁净室中穿戴的工作服的防尘织物包括针织物的内层，附着到内层的中间层，并且由具有无纺布的非微孔聚氨酯树脂膜形成的中间层 高吸湿性，以及附着于中间层的外层，由经纱和纬纱中含有导电丝的高密度聚酯织物形成。