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    Continuous nickel plating process for an aluminum conductor and corresponding device
    1.
    发明授权
    Continuous nickel plating process for an aluminum conductor and corresponding device 有权
    铝导体和相应装置的连续镀镍工艺

    公开(公告)号：US06780303B2

    公开(公告)日：2004-08-24

    申请号：US10050896

    申请日：2002-01-18

    申请人： Gabriel Colombier ,  Jean-Sylvestre Safrany ,  Bernard Loreau ,  Sandrine Tournier

    发明人： Gabriel Colombier ,  Jean-Sylvestre Safrany ,  Bernard Loreau ,  Sandrine Tournier

    IPC分类号： C25D706

    CPC分类号： C25D7/0607 ,  C25D5/14 ,  C25D5/44

    摘要： A process for continuous nickel plating of an aluminum conductor, by electrolytically pre-treating the aluminum conductor to improve adherence of a nickel coat thereon by passing the aluminum conductor through a pre-treating bath in which is disposed an electrode connected to a first current source at a first voltage, for supplying to the aluminum conductor a pre-treating current, then electrolytically plating the pre-treated aluminum conductor with nickel in a plating bath in which is disposed an anode connected to a second current source at a second voltage, in which a nickel coat is deposited on the conductor by action of a nickel plating current In. At least the nickel plating current In is transmitted to the conductor through a mechanical electrical contact which contacts the conductor between the pre-treating bath and the plating bath, the pre-treating improving the contact properties of the conductor sufficient to permit the transmitting through the mechanical electrical conductor.

    摘要翻译： 一种用于铝导体的连续镀镍的方法，通过对铝导体进行电解预处理以改善其上的镍涂层的附着力，其中通过使铝导体通过预处理槽，其中设置有连接到第一电流源的电极 在第一电压下，向铝导体提供预处理电流，然后在镀浴中电镀镍预处理的铝导体，其中设置有以第二电压连接到第二电流源的阳极，在 镍镀层通过镍电镀电流In的作用沉积在导体上。 至少镍电镀电流In通过与预处理槽和电镀槽之间的导体接触的机械电接触物传导到导体，预处理改善了导体的接触性能，足以允许通过 机械电导体。