公开(公告)号：US20100193491A1

公开(公告)日：2010-08-05

申请号：US12676024

申请日：2008-08-27

申请人： Sang-Bum Cho ,  Byoung-Jin Jung ,  Myung-Ha Park ,  Jung-Hyun Park

发明人： Sang-Bum Cho ,  Byoung-Jin Jung ,  Myung-Ha Park ,  Jung-Hyun Park

IPC分类号： H05B1/00

CPC分类号： H01L21/67103 ,  H01L21/67109 ,  H01L21/6831

摘要： A substrate support unit of a substrate processing apparatus includes a first support member, a second support member, a buffer member and a tube. The first support member has an electrode and a heater built-in and supports the substrate. The second support member is disposed beneath the first support member to support the first support member. The buffer member is disposed between the first support member and the second support member to form an air gap between the first support member and the second support member so as to reduce heat transfer between the first support member and the second support member. The tube is connected with a lower surface of the first support member. Further, the tube extends through the second support member and receives lines for applying power to the electrode and the heater.

摘要翻译： 基板处理装置的基板支撑单元包括第一支撑构件，第二支撑构件，缓冲构件和管。 第一支撑构件具有内置的电极和加热器，并支撑基板。 第二支撑构件设置在第一支撑构件下方以支撑第一支撑构件。 缓冲构件设置在第一支撑构件和第二支撑构件之间，以在第一支撑构件和第二支撑构件之间形成气隙，以减少第一支撑构件和第二支撑构件之间的热传递。 管与第一支撑构件的下表面连接。 此外，管延伸穿过第二支撑构件并且接收用于向电极和加热器施加电力的线。

公开(公告)号：US20090293809A1

公开(公告)日：2009-12-03

申请号：US12473316

申请日：2009-05-28

申请人： Sang-Bum Cho ,  Byung-Jin Jung ,  Myoung-Ha Park

发明人： Sang-Bum Cho ,  Byung-Jin Jung ,  Myoung-Ha Park

IPC分类号： H01L21/683 ,  C23C16/00

CPC分类号： C23C16/4583 ,  H01L21/68757 ,  H01L21/68785 ,  H01L21/68792

摘要： In a stage for supporting a substrate, a body, a base plate and a buffer are provided in the stage. The body on which the substrate is positioned includes a plate having a heating electrode for generating heat therein and a tube protruded from a bottom surface of the plate. The body is mounted on the base plate. The buffer is interposed between the base plate and the tube and has a thermal expansion ratio higher than that of the tube of the body and lower than that of the base plate. Accordingly, thermal expansion of the base plate may be absorbed by the buffer and may not have direct effect on the body. Therefore, the body may be prevented from being damaged due to the thermal expansion of the base plate.

摘要翻译： 在用于支撑衬底的阶段中，在该阶段中设置主体，基板和缓冲器。 其上定位有基板的主体包括具有用于产生热量的加热电极的板和从板的底表面突出的管。 主体安装在底板上。 缓冲器介于基板和管之间，其热膨胀比高于主体管的热膨胀比，低于基板的热膨胀率。 因此，基板的热膨胀可以被缓冲器吸收，并且可能对身体没有直接影响。 因此，可以防止主体由于基板的热膨胀而被损坏。

公开(公告)号：US06799565B2

公开(公告)日：2004-10-05

申请号：US10299873

申请日：2002-11-18

申请人： Sang-Bum Cho

发明人： Sang-Bum Cho

IPC分类号： F02D4114

CPC分类号： F02D41/10 ,  F02D41/1454 ,  F02D41/1487 ,  F02D41/187 ,  F02D2200/0404 ,  F02D2200/501

摘要： The present invention relates to a method and system for preventing a lean Air/Fuel ratio that may occur when accelerating an engine. An engine is supplied with a base amount of fuel that is adjusted, or compensated, according to one or more compensation variables that are based on an oxygen sensor signal. If the compensation variables are reduced by more than a predetermined amount and the throttle valve open-angle exceeds a predetermined value, then the method and system of the invention prevent a lean Air/Fuel ratio that may occur by initializing the compensation variables for a predetermined period of time, thereby allowing the engine to perform smoothly.

摘要翻译： 本发明涉及一种用于防止在加速发动机时可能发生的贫空气/燃料比的方法和系统。 发动机具有根据基于氧传感器信号的一个或多个补偿变量调整或补偿的基本量的燃料。 如果补偿变量减少超过预定量并且节流阀开启角度超过预定值，则本发明的方法和系统通过将预定的补偿变量初始化来预防可能发生的贫空气/燃料比， 一段时间，从而使发动机顺利进行。

公开(公告)号：US20100104403A1

公开(公告)日：2010-04-29

申请号：US12530664

申请日：2008-03-03

申请人： Sang-Bum Cho ,  Kang-Il Heo ,  Byoung-Jin Jung ,  Sung-Don Ahn ,  Jung-Ho Choi ,  Seung-Hee Gang ,  Hwi-Souck Chang

发明人： Sang-Bum Cho ,  Kang-Il Heo ,  Byoung-Jin Jung ,  Sung-Don Ahn ,  Jung-Ho Choi ,  Seung-Hee Gang ,  Hwi-Souck Chang

IPC分类号： H01L21/68

CPC分类号： H01L21/68707

摘要： An apparatus for transferring a wafer includes a ceramic blade, an electrode, a plurality of pads, a coating layer and a robot arm. The blade supports the wafer, and the electrode is disposed inside the blade. Electric power is applied to the electrode to generate an electrostatic force for holding the wafer. The pads are disposed on an upper surface of the blade, and thus frictional forces may be provided between the wafer and the pads. The coating layer is disposed on the blade. The robot arm is connected with the blade to move the blade.

摘要翻译： 用于转印晶片的装置包括陶瓷刀片，电极，多个焊盘，涂层和机器人手臂。 刀片支撑晶片，电极设置在刀片内。 向电极施加电力以产生用于保持晶片的静电力。 焊盘设置在叶片的上表面上，因此可以在晶片和焊盘之间设置摩擦力。 涂层设置在刀片上。 机器人臂与刀片连接以移动刀片。